STPS1H100-Y
Datasheet
Automotive high voltage power Schottky rectifier
Features
A
A
K
K
SMB
SMA
•
•
•
•
•
•
AEC-Q101 qualified
Negligible switching losses
High junction temperature capability
Low leakage current
Good trade off between leakage current and forward voltage drop
Avalanche capability specified
•
•
•
ECOPACK®2 compliant component
PPAP capable
VRRM guaranteed from -40°C to +175°C
Description
Schottky rectifiers packaged in SMA or SMB, and designed for high frequency
miniature switched mode power supplies as DC/DC converters for automotive
applications. It is particularly suited for LED lighting applications, ADAS power, and
ECU (Engine Control Unit) in automotive environment.
Product status
STPS1H100-Y
Product summary
Symbol
Value
IF(AV)
1A
VRRM
100 V
T j (range)
-40 °C to +175 °C
VF(max.)
0.62 V
DS6946 - Rev 2 - April 2018
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS1H100-Y
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage, Tj = -40 °C to +175 °C
100
V
IF(RMS)
Forward rms current
10
A
1
A
SMA
TL = 150 °C
SMB
TL = 155 °C
IF(AV)
Average forward current, δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
50
A
PARM
Repetitive peak avalanche power
tp = 10 µs, Tj = 125 °C
108
W
-65 to +175
°C
+175
°C
Tstg
Storage temperature range
Tj
Maximum operating junction temperature(1)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal parameters
Symbol
Rth(j-l)
Parameter
Max. value
Junction to lead
SMA
30
SMB
25
Unit
°C/W
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 1 A
IF = 2 A
Min.
Typ.
-
0.2
-
Unit
4
µA
0.5
mA
0.77
0.58
-
Max.
0.62
0.86
0.65
V
0.70
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.54 x IF(AV) + 0.08 x IF2(RMS)
DS6946 - Rev 2
page 2/11
STPS1H100-Y
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
IF(AV)(A)
1.2
PF(AV) (W)
0.8
0.7
δ = 0.1
δ = 0.05
δ= 0.2
δ = 0.5
Rth(j-a)=Rth(j-l)
1.0
Rth(j-a)=120°C/W
0.6
SMB
Rth(j-a)=100°C/W
0.8
δ= 1
SMA
0.5
Rth(j-a)=200°C/W
0.6
0.4
0.3
0.4
T
0.2
T
0.1
IF(AV) (A)
0.2
tp
δ =tp/T
δ=tp/T
0.0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0
Figure 3. Normalized avalanche power derating versus
junction temperature (Tj = 125 °C)
1
Tamb (°C)
tp
0.0
25
50
75
100
125
150
175
Figure 4. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
Zth(j-a)/ Rth(j-a)
PARM (t p )
PARM (10 µs)
1.00
SMA
0.1
0.10
0.01
Single pulse
t p (s)
t p(µs)
0.01
0.001
1
10
100
1000
Figure 5. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
1.E-03
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 6. Reverse leakage current versus reverse voltage
applied (typical values)
Zth(j-a)/ Rth(j-a)
1.E+03
1.00
1.E-02
IR(µA)
SMB
1.E+02
Tj=125 °C
1.E+01
0.10
1.E+00
1.E-01
Single pulse
Tj=25 °C
1.E-02
t p (s)
VR(V)
0.01
1.E-03
DS6946 - Rev 2
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E-03
0
10
20
30
40
50
60
70
80
90
100
page 3/11
STPS1H100-Y
Characteristics (curves)
Figure 7. Junction capacitance versus reverse voltage
applied (typical values)
Figure 8. Forward voltage drop versus forward current
(maximum values)
C(pF)
IFM(A)
100
100.00
F=1 MHz
VOSC=30 mVRMS
Tj=25 °C
10.00
Tj=125 °C
Tj=25 °C
1.00
0.10
VR(V)
10
1
10
100
VFM(V)
0.01
0.0
Figure 9. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
200
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
Epoxy printed ci rcui t board FR4, coppe r t hi ckness: 35 µm
200
SMB
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA
150
150
100
100
50
50
S(Cu)(cm²)
S(Cu)(cm²)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0
0.0
DS6946 - Rev 2
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 4/11
STPS1H100-Y
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 11. SMB package outline
E1
D
E
A1
C
A2
L
DS6946 - Rev 2
b
page 5/11
STPS1H100-Y
SMB package information
Table 4. SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.0748
0.0965
A2
0.05
0.20
0.0020
0.0079
b
1.95
2.20
0.0768
0.0867
c
0.15
0.40
0.0059
0.0157
D
3.30
3.95
0.1299
0.1556
E
5.10
5.60
0.2008
0.2205
E1
4.05
4.60
0.1594
0.1811
L
0.75
1.50
0.0295
0.0591
Figure 12. SMB recommended footprint
1.62
2.60
1.62
(0.064)
(0.102)
(0.064)
2.18
(0.086)
5.84
(0.230)
DS6946 - Rev 2
page 6/11
STPS1H100-Y
SMA package information
2.2
SMA package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 13. SMA package outline
E1
D
E
A1
C
L
A2
b
Table 5. SMA package mechanical data
Dimensions
Millimeters
Ref.
DS6946 - Rev 2
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.097
A2
0.05
0.20
0.002
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.006
0.016
D
2.25
2.90
0.089
0.114
E
4.80
5.35
0.189
0.211
E1
3.95
4.60
0.156
0.181
L
0.75
1.50
0.030
0.059
page 7/11
STPS1H100-Y
SMA package information
Figure 14. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.103)
(0.055)
1.64
(0.064)
5.43
(0.214)
DS6946 - Rev 2
page 8/11
STPS1H100-Y
Ordering Information
3
Ordering Information
Table 6. Ordering information
DS6946 - Rev 2
Order code
Marking
Package
Weight
Base qty.
STPS1H100AY
S11Y
SMA
0.068 g
5000
STPS1H100UY
G11Y
SMB
0.107
2500
Delivery mode
Tape and reel
page 9/11
STPS1H100-Y
Revision history
Table 7. Document revision history
DS6946 - Rev 2
Date
Version
Changes
3-Dec-2010
1
Initial release.
10-Apr-2018
2
Update Figure 3 "Normalized avalanche power derating versus pulse duration" with PARM 10 µs
curve.
page 10/11
STPS1H100-Y
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© 2018 STMicroelectronics – All rights reserved
DS6946 - Rev 2
page 11/11
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