STPS1L30AFN

STPS1L30 Datasheet 30 V, 1 A low drop power Schottky rectifier Features • • • • Very low forward voltage drop for less power dissipation Surface mount miniature packages Avalanche rated ECOPACK2 compliant Applications • • • • • Cordless appliance SSD Battery charger Telecom power DC / DC converter Description Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA, SMA Flat Notch or SMB, the STPS1L30 is ideal for use in parallel with MOSFETs in synchronous rectification. Product status STPS1L30 Product summary Symbol Value IF(AV) 1A VRRM 30 V T j(max.) 150 °C VF(typ.) 0.26 V DS1243 - Rev 8 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS1L30 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) Forward rms current 10 A 1 A IF(AV) Average forward current, δ = 0.5, square wave SMA TL = 135 °C SMA Flat Notch TL = 140 °C SMB TL = 140 °C SMA IFSM Surge non repetitive forward current 75 SMA Flat Notch tp = 10 ms sinusoidal SMB PARM Tstg Tj A 75 tp = 10 µs, Tj = 125 °C Repetitive peak avalanche power Storage temperature range Maximum operating junction 90 temperature(1) 110 W -65 to +150 °C +150 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMA 30 SMA Flat Notch 20 SMB 25 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 100 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 1 A IF = 2 A Min. Typ. - 6 - Unit 200 µA 15 mA 0.395 0.260 - Max. 0.300 0.445 0.325 V 0.375 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.225x IF(AV) + 0.075 x IF2(RMS) DS1243 - Rev 8 page 2/15 STPS1L30 Characteristics (curves) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode 1.1 Characteristics (curves) Figure 2. Average forward current versus ambient temperature (δ = 0.5) Figure 1. Average forward power dissipation versus average forward current PF(AV)(W) δ = 0.05 0.45 IF(AV)(A) 6 0.50 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)= Rth(j-l) 5 0.40 SMB 4 0.35 0.30 SMA δ=1 3 0.25 0.20 2 0.15 T T 0.10 0.05 I F(A V) (A) 0.00 0.0 0.2 0.4 0.6 δ=tp/T 0.8 1.0 1 1.2 Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C) PARM (t p ) PARM (10 µs) 0 Tam b (°C) tp δ=tp/T 0 tp 25 50 75 100 125 150 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Zth(j-a)/ Rth(j-a) 1.00 1 SMB 0.1 0.10 Single pulse 0.01 t p (s) 0.001 0.01 t p(µs) 1 DS1243 - Rev 8 10 1.E-03 100 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1000 page 3/15 STPS1L30 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Figure 6. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) Zth(j-a)/ Rth(j-a) 1.E+2 1.00 T j =150°C SMA T j =125°C 1.E+1 T j =100°C 1.E+0 0.10 1.E-1 T j =25°C Single pulse 1.E-2 t p (s) 1.E-03 1.E-02 1.E-01 1.E+00 VR (V) 1.E-3 0.01 1.E+01 1.E+02 0 1.E+03 Figure 7. Junction capacitance versus reverse voltage applied (typical values) 5 10 15 20 25 30 Figure 8. Forward voltage drop versus forward current (typical values, high level) IF(A) C(pF) 500 10.00 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 100 Tj=25°C Tj=100°C 1.00 V R (V) 10 V F (V) 0.10 1 2 10 5 20 50 Figure 9. Forward voltage drop versus forward current (maximum values, low level) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMB) IF(A) Rth(j-a) (°C/W) 3.0 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm Tj =150°C SMB 2.5 Tj=100°C 2.0 150 Tj=125°C 1.5 100 Tj=25°C 1.0 50 0.5 S(Cu)(cm²) V F (V) 0.0 0.10 0.15 DS1243 - Rev 8 0.20 0.25 0.30 0.35 0.40 0.45 0 0.50 0.55 0.60 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/15 STPS1L30 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 200 200 Epoxy printed circuit board FR4, copper thickness: 35 µm Epoxy printed circuit board FR4, copper thickness: 35 µm SMA SMA Flat Notch 150 150 100 100 50 50 S(Cu)(cm²) S(Cu)(cm²) 0 0 0.0 0.5 DS1243 - Rev 8 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/15 STPS1L30 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS1243 - Rev 8 page 6/15 STPS1L30 SMA package information 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Ref. DS1243 - Rev 8 Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 7/15 STPS1L30 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS1243 - Rev 8 page 8/15 STPS1L30 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 15. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS1243 - Rev 8 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 9/15 STPS1L30 SMA Flat Notch package information Figure 16. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS1243 - Rev 8 page 10/15 STPS1L30 SMB package information 2.3 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 17. SMB package outline E1 D E A1 C A2 L b Table 6. SMB package mechanical data Dimensions Millimeters Ref. DS1243 - Rev 8 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 page 11/15 STPS1L30 SMB package information Figure 18. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1243 - Rev 8 page 12/15 STPS1L30 Ordering Information 3 Ordering Information Table 7. Ordering information DS1243 - Rev 8 Order code Marking Package Weight Base qty. Delivery mode STPS1L30A GB3 SMA 0.068 g 5000 Tape and reel STPS1L30AFN A13 SMA Flat Notch 0.039 g 10 000 Tape and reel STPS1L30U G23 SMB 0.107 g 2500 Tape and reel page 13/15 STPS1L30 Revision history Table 8. Document revision history DS1243 - Rev 8 Date Version Changes Jul-2003 5A Aug-2004 6 SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm (0.080 inc). 17-Sep-2018 7 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and Figure 3. Normalized avalanche power derating versus junction temperature (Tj = 125 °C). 26-Sep-2019 8 Added Section 2.2 SMA Flat Notch package information. Last update. page 14/15 STPS1L30 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS1243 - Rev 8 page 15/15