STPS1L30MF

STPS1L30MF Low drop power Schottky rectifier in flat package Main product characteristics IF(AV) 1A VRRM 30 V Tj (max) 150° C VF (max) 0.39 V A K STmite flat (DO222-AA) Features and benefits Description ■ Very low profile package: 0.85 mm ■ Backward compatible with standard STmite footprint ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low forward voltage drop for higher efficiency and extended battery life ■ Low thermal resistance ■ Avalanche capability specified Single Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in STmite flat, this device is intended for use in very low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the very small size of the package this device fits battery powered equipment (cellular, notebook, PDA’s, printers) as well as chargers and PCMCIA cards. Order Code Part number Marking STPS1L30MF F1L3 Table 1. Absolute ratings (limiting values) Symbol Value Unit VRRM Repetitive peak reverse voltage 30 V IF(RMS) RMS forward voltage 2 A IF(AV) Average forward current Tc = 140° C δ = 0.5 1 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 1200 W -65 to + 150 °C 150 °C 10000 V/µs Storage temperature range Tstg Tj Maximum operating junction dV/dt 1. Parameter dPtot --------------dTj < temperature(1) Critical rate of rise of reverse voltage (rated VR, Tj = 25° C) 1 -------------------------Rth ( j – a ) August 2006 condition to avoid thermal runaway for a diode on its own heatsink Rev 1 1/7 www.st.com Characteristics 1 STPS1L30MF Characteristics Table 2. Thermal resistance Symbol Rth(j-c) Rth(j-a) (1) Parameter Value Unit Junction to case 20 °C/W Junction to ambient 250 °C/W 1. Mounted with minimum recommended pad size, PC board FR4 Table 3. Symbol Static electrical characteristics Parameter Tests conditions Tj = 25° C Tj = 85° C IR (1) Reverse leakage current Tj = 25° C Tj = 85° C Tj = 25° C Tj = 85° C Tj = 25° C Tj = 85° C Tj = 25° C VF (1) Forward voltage drop Tj = 85° C Tj = 25° C Tj = 85° C Tj = 25° C Tj = 85° C VR = VRRM VR = 20 V VR = 10 V IF = 1 A IF = 2 A Min. Typ Max. 0.13 0.39 5.25 16.5 0.05 0.24 3.5 10.5 0.03 0.15 2.4 7 0.33 0.39 0.28 0.34 0.39 0.45 0.36 0.42 0.45 0.53 0.43 0.51 0.50 0.60 0.50 0.60 Unit mA V IF = 3 A IF = 4 A 1. Pulse test: = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.26 x IF(AV) + 0.08 IF2(RMS) 2/7 STPS1L30MF Figure 1. Characteristics Conduction losses versus average Figure 2. current IF(AV)(A) PF(AV)(W) 0.50 δ = 0.05 0.45 Average forward current versus ambient temperature (δ = 0.5) δ = 0.1 1.1 δ = 0.2 Rth(j-a)=Rth(j-c) δ = 0.5 1.0 0.9 0.40 δ=1 0.35 0.8 0.7 0.30 Rth(j-a)=270°C/W 0.6 0.25 0.5 0.20 0.4 0.15 0.3 T 0.10 0.2 0.05 IF(AV)(A) δ=tp/T 0.00 0.0 0.1 0.2 Figure 3. 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.1 tp Tamb(°C) 0.0 1.1 1.2 1.3 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. PARM(tp) PARM(1µs) 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(tp) PARM(25°C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 0 10 1 100 25 1000 Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. 50 75 100 125 150 Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) IM(A) 22 1.0 20 0.9 18 0.8 16 0.7 14 0.6 12 TC=25°C δ = 0.5 0.5 10 TC=75°C 8 TC=125°C 4 0.4 0.3 6 IM 2 t 0.1 t(s) δ=0.5 0 1.E-03 0.2 δ = 0.2 T δ = 0.1 tp(s) Single pulse δ=tp/T 0.0 1.E-02 1.E-01 1.E+00 1.E-04 1.E-03 1.E-02 tp 1.E-01 3/7 Characteristics Figure 7. STPS1L30MF Reverse leakage currrent versus reverse voltage applied (typical values) Figure 8. IR(mA) Reverse leakage currrent versus junction temperature (typical values) IR(mA) 1.E+03 1.E+03 VR=30V Tj=150°C 1.E+02 1.E+02 Tj=125°C Tj=100°C 1.E+01 1.E+01 Tj=75°C 1.E+00 1.E+00 Tj=50°C Tj=25°C 1.E-01 1.E-01 Tj(°C) VR(V) 1.E-02 1.E-02 0 2 Figure 9. 4 6 8 10 12 14 16 18 20 22 24 26 28 0 30 Junction capacitance versus reverse voltage applied (typical values) 25 50 75 100 125 150 Figure 10. Forward voltage drop versus forward current IFM(A) C(pF) 2.0 1000 F=1MHz VOSC=30mVRMS Tj=25°C 1.8 Tj=85°C (maximum values) 1.6 1.4 Tj=85°C (typical values) 1.2 1.0 100 0.8 0.6 Tj=25°C (maximum values) 0.4 0.2 VR(V) 10 1 10 100 Figure 11. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu=35 µm, typical values) Rth(j-a)(°C/W) 250 200 150 100 50 S(mm²) 0 0 4/7 VFM(V) 0.0 20 40 60 80 100 120 140 160 180 200 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 STPS1L30MF 2 Package information Package information Table 4. STmite flat dimensions Dimensions Ref. L E1 D L1 Inches Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 D 1.75 1.90 2.05 0.069 0.075 0.081 E 3.60 3.80 3.90 0.142 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.122 L 0.50 0.55 0.80 0.020 0.022 0.031 L1 2.10 2.40 2.60 0.083 0.094 0.102 L2 0.45 0.60 0.75 0.018 0.024 0.030 L3 0.20 0.35 0.50 0.008 0.014 0.020 L2 b b2 L3 E Millimeters c A Figure 12. STmite flat recommended footprint (all dimensions in mm) 0.85 0.63 2.00 0.65 0.65 0.95 1.95 4.13 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information 3 4 6/7 STPS1L30MF Ordering information Part number Marking Package Weight Base qty Delivery mode STPS1L30MF F1L3 STmite flat 16 mg 12000 Tape and reel Revision history Date Revision 21-Aug-2006 1 Changes First issue. STPS1L30MF Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 7/7