STPS1L40
Datasheet
40 V, 1 A low drop power Schottky rectifier
Features
•
•
•
•
•
•
Very small conduction losses
Negligible switching losses
Low forward voltage drop
Surface mount miniature packages
Avalanche rated
ECOPACK2 compliant
Applications
•
•
•
•
Reverse polarity protection
Set-top box power supply
TV power supply
Battery charger
Description
Single chip Schottky rectifiers suited to switched mode power supplies and high
frequency DC to DC converters.
Packaged in SMA, SMA Flat Notch, SMB and SOD123Flat, the STPS1L40 is ideal
for use in surface mounting and used in low voltage, high frequency inverters, freewheeling and polarity protection applications.
Product status
STPS1L40
Product summary
Symbol
Value
IF(AV)
1A
VRRM
40 V
T j(max.)
175 °C
VF(typ.)
0.37 V
DS1244 - Rev 9 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS1L40
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
VRRM
Repetitive peak reverse voltage
IF(RMS)
Forward rms current
IF(AV)
SMA/SMB
Average forward current δ = 0.5, square wave
SMA/SMB
TL = 155 °C
SMA Flat Notch
TL = 160 °C
SOD123Flat
TL = 160 °C
SMA/SMB
IFSM
Surge non repetitive forward current
SMA Flat Notch
tp = 10 ms sinusoidal
Tstg
Tj
V
8
A
1
A
A
50
Storage temperature range
Operating junction
40
60
tp = 10 µs, Tj = 125 °C
Repetitive peak avalanche power
Unit
60
SOD123Flat
PARM
Value
temperature(1)
65
W
-65 to +175
°C
+175
°C
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol
Rth(j-l)
Parameter
Junction to lead
Max. value
SMA
30
SMA Flat Notch
20
SMB
25
SOD123Flat
20
Unit
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(1)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
Min.
VR = VRRM
IF = 1 A
IF = 2 A
Typ.
-
6
-
Unit
35
µA
10
mA
0.50
0.37
-
Max.
0.42
0.63
0.50
V
0.61
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.23 x IF(AV) + 0.19 x IF2(RMS)
DS1244 - Rev 9
page 2/16
STPS1L40
Characteristics (curves)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
PF(AV) (W)
0.8
IF(AV) (A)
4.0
SMA
0.7
δ = 0.05
δ = 0.1
δ = 0.2
δ = 0.5
3.5
δ= 1
Rth(j-a) = Rth(j-l)
3.0
0.6
2.5
0.5
2.0
0.4
1.5
0.3
1.0
0.2
T
0.1
IF(AV) (A)
0.0
0.0
δ = tp/T
T
0.5
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Tamb(°C)
tp
δ = tp/T
0.0
tp
25
50
75
100
125
IF(AV) (A)
175
Figure 4. Average forward current versus ambient
temperature (SOD123Flat, SMA Flat Notch, δ = 0.5)
5
IF(AV) (A)
SOD123Flat
SMA Flat Notch
SMB
Rth(j-a) = Rth(j-l)
150
1.6
Figure 3. Average forward current versus ambient
temperature (SMB, δ = 0.5)
4.0
Figure 2. Average forward current versus ambient
temperature (SMA, δ = 0.5)
3.5
Rth(j-a) = Rth(j-l)
4
3.0
2.5
3
2.0
2
1.5
1.0
T
0.5
δ = tp/T
T
1
Tamb(°C)
tp
δ = tp/T
Tamb(°C)
tp
0
0.0
0
DS1244 - Rev 9
25
50
75
100
125
150
175
0
25
50
75
100
125
150
175
page 3/16
STPS1L40
Characteristics (curves)
Figure 5. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
PARM (t p )
PARM (10 µs)
Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
1.0
1
Zth(j-a)/Rth(j-a)
SMA
0.9
0.8
0.7
0.6
0.1
0.5
0.4
0.3
0.01
0.2
Single pulse
0.1
0.001
t p(µs)
1
10
t P (s)
0.0
1.E-02
100
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1000
Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
to lead versus pulse duration (SOD123Flat)
1.0
Zth(j-a)/Rth(j-a)
1.0
SMB
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.1
Zth(j-l)/Rth(j-l)
SOD123Flat
0.2
Single pulse
0.1
t P (s)
t P (s)
0.0
0.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 9. Reverse leakage current versus reverse voltage
applied (typical values)
1.E+02
Single pulse
IR(mA)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+01
Figure 10. Junction capacitance versus reverse voltage
applied (typical values)
1000
C(pF)
F = 1 MHz
VOSC = 30 mVRMS
Tj = 25 °C
Tj = 150 °C
1.E+01
1.E+00
Tj = 125 °C
Tj = 100 °C
1.E+00
Tj = 75 °C
100
1.E-01
Tj = 50 °C
1.E-02
Tj = 25 °C
VR (V)
VR(V)
1.E-03
10
0
DS1244 - Rev 9
5
10
15
20
25
30
35
40
1
10
100
page 4/16
STPS1L40
Characteristics (curves)
Figure 11. Forward voltage drop versus forward current
(typical values)
10.00
Figure 12. Thermal resistance junction to ambient versus
copper surface under each lead (typical values)
IF (A)
200
Rth(j-a)(°C/W)
SMA
150
1.00
Tj = 25 °C
Tj = 125 °C
100
Tj = 75 °C
0.10
Epoxy printed board FR4, eCu = 35 µm
50
SCu (cm²)
VF(V)
0.01
0.0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
0.0
Figure 13. Thermal resistance junction to ambient versus
copper surface under each lead (typical values)
200
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (typical values)
Rth(j-a)(°C/W)
250
Rth(j-a)(°C/W)
SOD123Flat
SMB
200
150
150
100
100
Epoxy printed board FR4, eCu = 35 µm
50
Epoxy printed board FR4, eCu = 35 µm
50
SCu (cm²)
SCu (cm²)
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat
Notch)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat Notch
150
100
50
S(Cu)(cm²)
0
0.0
DS1244 - Rev 9
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 5/16
STPS1L40
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 16. SMB package outline
E1
D
E
A1
C
A2
L
DS1244 - Rev 9
b
page 6/16
STPS1L40
SMB package information
Table 4. SMB package mechanical data
Dimensions
Ref.
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.95
2.20
0.076
0.087
c
0.15
0.40
0.005
0.016
D
3.30
3.95
0.129
0.156
E
5.10
5.60
0.200
0.221
E1
4.05
4.60
0.159
0.182
L
0.75
1.50
0.029
0.060
Figure 17. SMB recommended footprint
1.62
2.60
1.62
(0.064)
(0.102)
(0.064)
2.18
(0.086)
5.84
(0.230)
DS1244 - Rev 9
page 7/16
STPS1L40
SMA package information
2.2
SMA package information
•
•
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 18. SMA package outline
E1
D
E
A1
C
A2
L
b
Table 5. SMA package mechanical data
Dimensions
Ref.
DS1244 - Rev 9
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
4.80
5.35
0.188
0.211
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
page 8/16
STPS1L40
SMA package information
Figure 19. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.104)
(0.055)
1.64
(0.065)
5.43
(0.214)
DS1244 - Rev 9
page 9/16
STPS1L40
SMA Flat Notch package information
2.3
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 20. SMA Flat Notch package outline
Table 6. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Min.
A1
0.90
A1
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.044
0.002
b
1.25
1.65
0.049
0.065
C
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
DS1244 - Rev 9
Typ.
Inches (for reference only)
0.75
1.20
0.029
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
page 10/16
STPS1L40
SMA Flat Notch package information
Figure 21. SMA Flat Notch recommended footprint in mm (inches)
1.20
(0.047)
3.12
1.20
(0.123)
(0.047)
1.52
(0.060)
5.52
(0.217)
DS1244 - Rev 9
page 11/16
STPS1L40
SOD123Flat package information
2.4
SOD123Flat package information
Figure 22. SOD123Flat package outline
A
C1
L
HD D
L
C
b
E
Table 7. SOD123Flat package mechanical data
Dimensions
Millimeters
Ref.
DS1244 - Rev 9
Inches (for reference only)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.86
0.98
1.10
0.034
0.038
0.043
b
0.80
0.90
1.00
0.031
0.035
0.039
c
0.08
0.15
0.25
0.003
0.006
0.009
c1
0.00
0.10
0.000
D
2.50
2.60
2.70
0.098
0.102
0.106
E
1.50
1.60
1.80
0.059
0.063
0.070
HD
3.30
3.50
3.70
0.130
0.137
0.146
L
0.45
0.65
0.85
0.018
0.025
0.033
0.004
page 12/16
STPS1L40
SOD123Flat package information
Figure 23. SOD123Flat footprint dimensions (mm)
1.60
1.40
1.30
DS1244 - Rev 9
page 13/16
STPS1L40
Ordering information
3
Ordering information
Table 8. Ordering information
DS1244 - Rev 9
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS1L40U
GC4
SMB
107 mg
2500
Tape and reel
STPS1L40A
GB4
SMA
68 mg
5000
Tape and reel
STPS1L40AFN
A14
SMA Flat Notch
39 mg
10 000
Tape and reel
STPS1L40ZF
1L4
SOD123Flat
12.5 mg
3000
Tape and reel
page 14/16
STPS1L40
Revision history
Table 9. Document revision history
Date
DS1244 - Rev 9
Revision Changes
Jul-2003
4A
Last update.
Aug-2004
5
SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inch.) to 2.03
mm (0.080).
24-Jun-2009
6
Added STmite flat package.
01-Jul-2016
7
03-Dec-2018
8
Updated Section Features and Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise
specified).
27-Sep-2019
9
Added Section 2.3 SMA Flat Notch package information.
STmite flat package information removed.
Added SOD123Flat package.
page 15/16
STPS1L40
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© 2019 STMicroelectronics – All rights reserved
DS1244 - Rev 9
page 16/16
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