STPS1L40ZF

STPS1L40 Datasheet 40 V, 1 A low drop power Schottky rectifier Features • • • • • • Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche rated ECOPACK2 compliant Applications • • • • Reverse polarity protection Set-top box power supply TV power supply Battery charger Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA, SMA Flat Notch, SMB and SOD123Flat, the STPS1L40 is ideal for use in surface mounting and used in low voltage, high frequency inverters, freewheeling and polarity protection applications. Product status STPS1L40 Product summary Symbol Value IF(AV) 1A VRRM 40 V T j(max.) 175 °C VF(typ.) 0.37 V DS1244 - Rev 9 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS1L40 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) SMA/SMB Average forward current δ = 0.5, square wave SMA/SMB TL = 155 °C SMA Flat Notch TL = 160 °C SOD123Flat TL = 160 °C SMA/SMB IFSM Surge non repetitive forward current SMA Flat Notch tp = 10 ms sinusoidal Tstg Tj V 8 A 1 A A 50 Storage temperature range Operating junction 40 60 tp = 10 µs, Tj = 125 °C Repetitive peak avalanche power Unit 60 SOD123Flat PARM Value temperature(1) 65 W -65 to +175 °C +175 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMA 30 SMA Flat Notch 20 SMB 25 SOD123Flat 20 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 1 A IF = 2 A Typ. - 6 - Unit 35 µA 10 mA 0.50 0.37 - Max. 0.42 0.63 0.50 V 0.61 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.23 x IF(AV) + 0.19 x IF2(RMS) DS1244 - Rev 9 page 2/16 STPS1L40 Characteristics (curves) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current PF(AV) (W) 0.8 IF(AV) (A) 4.0 SMA 0.7 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 3.5 δ= 1 Rth(j-a) = Rth(j-l) 3.0 0.6 2.5 0.5 2.0 0.4 1.5 0.3 1.0 0.2 T 0.1 IF(AV) (A) 0.0 0.0 δ = tp/T T 0.5 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 Tamb(°C) tp δ = tp/T 0.0 tp 25 50 75 100 125 IF(AV) (A) 175 Figure 4. Average forward current versus ambient temperature (SOD123Flat, SMA Flat Notch, δ = 0.5) 5 IF(AV) (A) SOD123Flat SMA Flat Notch SMB Rth(j-a) = Rth(j-l) 150 1.6 Figure 3. Average forward current versus ambient temperature (SMB, δ = 0.5) 4.0 Figure 2. Average forward current versus ambient temperature (SMA, δ = 0.5) 3.5 Rth(j-a) = Rth(j-l) 4 3.0 2.5 3 2.0 2 1.5 1.0 T 0.5 δ = tp/T T 1 Tamb(°C) tp δ = tp/T Tamb(°C) tp 0 0.0 0 DS1244 - Rev 9 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175 page 3/16 STPS1L40 Characteristics (curves) Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) 1.0 1 Zth(j-a)/Rth(j-a) SMA 0.9 0.8 0.7 0.6 0.1 0.5 0.4 0.3 0.01 0.2 Single pulse 0.1 0.001 t p(µs) 1 10 t P (s) 0.0 1.E-02 100 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1000 Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) to lead versus pulse duration (SOD123Flat) 1.0 Zth(j-a)/Rth(j-a) 1.0 SMB 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.1 Zth(j-l)/Rth(j-l) SOD123Flat 0.2 Single pulse 0.1 t P (s) t P (s) 0.0 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 Single pulse IR(mA) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+01 Figure 10. Junction capacitance versus reverse voltage applied (typical values) 1000 C(pF) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+01 1.E+00 Tj = 125 °C Tj = 100 °C 1.E+00 Tj = 75 °C 100 1.E-01 Tj = 50 °C 1.E-02 Tj = 25 °C VR (V) VR(V) 1.E-03 10 0 DS1244 - Rev 9 5 10 15 20 25 30 35 40 1 10 100 page 4/16 STPS1L40 Characteristics (curves) Figure 11. Forward voltage drop versus forward current (typical values) 10.00 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (typical values) IF (A) 200 Rth(j-a)(°C/W) SMA 150 1.00 Tj = 25 °C Tj = 125 °C 100 Tj = 75 °C 0.10 Epoxy printed board FR4, eCu = 35 µm 50 SCu (cm²) VF(V) 0.01 0.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 0.0 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Rth(j-a)(°C/W) 250 Rth(j-a)(°C/W) SOD123Flat SMB 200 150 150 100 100 Epoxy printed board FR4, eCu = 35 µm 50 Epoxy printed board FR4, eCu = 35 µm 50 SCu (cm²) SCu (cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(j-a) (°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat Notch 150 100 50 S(Cu)(cm²) 0 0.0 DS1244 - Rev 9 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/16 STPS1L40 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 16. SMB package outline E1 D E A1 C A2 L DS1244 - Rev 9 b page 6/16 STPS1L40 SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 17. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS1244 - Rev 9 page 7/16 STPS1L40 SMA package information 2.2 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 18. SMA package outline E1 D E A1 C A2 L b Table 5. SMA package mechanical data Dimensions Ref. DS1244 - Rev 9 Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 8/16 STPS1L40 SMA package information Figure 19. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS1244 - Rev 9 page 9/16 STPS1L40 SMA Flat Notch package information 2.3 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 20. SMA Flat Notch package outline Table 6. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS1244 - Rev 9 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 10/16 STPS1L40 SMA Flat Notch package information Figure 21. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS1244 - Rev 9 page 11/16 STPS1L40 SOD123Flat package information 2.4 SOD123Flat package information Figure 22. SOD123Flat package outline A C1 L HD D L C b E Table 7. SOD123Flat package mechanical data Dimensions Millimeters Ref. DS1244 - Rev 9 Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 0.86 0.98 1.10 0.034 0.038 0.043 b 0.80 0.90 1.00 0.031 0.035 0.039 c 0.08 0.15 0.25 0.003 0.006 0.009 c1 0.00 0.10 0.000 D 2.50 2.60 2.70 0.098 0.102 0.106 E 1.50 1.60 1.80 0.059 0.063 0.070 HD 3.30 3.50 3.70 0.130 0.137 0.146 L 0.45 0.65 0.85 0.018 0.025 0.033 0.004 page 12/16 STPS1L40 SOD123Flat package information Figure 23. SOD123Flat footprint dimensions (mm) 1.60 1.40 1.30 DS1244 - Rev 9 page 13/16 STPS1L40 Ordering information 3 Ordering information Table 8. Ordering information DS1244 - Rev 9 Order code Marking Package Weight Base qty. Delivery mode STPS1L40U GC4 SMB 107 mg 2500 Tape and reel STPS1L40A GB4 SMA 68 mg 5000 Tape and reel STPS1L40AFN A14 SMA Flat Notch 39 mg 10 000 Tape and reel STPS1L40ZF 1L4 SOD123Flat 12.5 mg 3000 Tape and reel page 14/16 STPS1L40 Revision history Table 9. Document revision history Date DS1244 - Rev 9 Revision Changes Jul-2003 4A Last update. Aug-2004 5 SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inch.) to 2.03 mm (0.080). 24-Jun-2009 6 Added STmite flat package. 01-Jul-2016 7 03-Dec-2018 8 Updated Section Features and Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified). 27-Sep-2019 9 Added Section 2.3 SMA Flat Notch package information. STmite flat package information removed. Added SOD123Flat package. page 15/16 STPS1L40 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS1244 - Rev 9 page 16/16