STPS1L60ZF

STPS1L60 Datasheet 60 V, 1 A low drop power Schottky rectifier Features • • • • • Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche rated ECOPACK2 compliant Applications • • • • • Lighting Desktop power supply Battery charger Set top box Auxiliary power Description Axial and surface mount power Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMA, SMA Flat Notch, STmite flat, DO-41 and SOD123Flat, the STPS1L60 is ideal for use in low voltage, high frequency inverters and small battery chargers. Product status STPS1L60 Product summary Symbol Value IF(AV) 1A VRRM 60 V T j(max.) 175 °C VF(typ.) 0.50 V DS2133 - Rev 12 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS1L60 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) Tstg Tj V STmite flat 2 SMA TL = 155 °C SMA Flat Notch TL = 160 °C TL = 145 °C SOD123 Flat TL = 160 °C STmite flat TC = 160 °C SMA Flat Notch A 1 A 40 tp = 10 ms sinusoidal 60 SOD123 Flat PARM 60 10 Average forward current δ = 0.5, square wave DO-41 Surge non repetitive forward current Unit SMA/DO-41 SMA, DO-41, STmite flat IFSM Value A 50 tp = 10 µs, Tj = 125 °C Repetitive peak avalanche power Storage temperature range 85 W -65 to +175 °C +175 °C Operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-l) Rth(j-c) Parameter Junction to lead Junction to case Max. value SMA 30 SMA Flat Notch 20 DO-41/lead length = 10 mm 45 SOD123 Flat 20 STmite flat 20 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter Test conditions Min. Tj = 25 °C IR(1) Reverse leakage current Tj = 100 °C Tj = 125 °C DS2133 - Rev 12 Typ. VR = VRRM Max. Unit 50 µA - 1.5 5 - 5.6 21 mA page 2/19 STPS1L60 Characteristics Symbol Parameter Test conditions Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. IF = 1 A IF = 2 A Typ. - Unit 0.57 0.50 - Max. 0.54 0.75 0.60 V 0.66 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.42 x IF(AV) + 0.12 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS2133 - Rev 12 page 3/19 STPS1L60 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 0.8 PF(AV) (W) Figure 2. Average forward current versus ambient temperature (δ = 0.5) 5 IF(AV)(A) SMA 0.7 δ = 0.05 δ = 0.2 δ = 0.1 δ = 0.5 δ= 1 4 0.6 0.5 Rth(j-a) = Rth(j-l) 3 0.4 2 0.3 0.2 T T 0.1 IF(AV) (A) 0.0 0.0 0.2 0.4 0.6 0.8 δ = tp/T 1.0 1 0 1.2 Figure 3. Average forward current versus ambient temperature (δ = 0.5) 3.5 IF(AV)(A) 0 25 50 1.6 100 125 150 175 IF(AV)(A) STmite flat Rth(j-a) = Rth(j-c) 1.4 Rth(j-a) = Rth(j-l) 75 Figure 4. Average forward current versus ambient temperature (δ = 0.5) DO-41 3.0 Tamb(°C) tp δ = tp/T tp 1.2 2.5 1.0 2.0 0.8 1.5 0.6 1.0 T 0.5 δ = tp/T T 0.4 0.2 Tamb(°C) tp 0.0 δ = tp/T Tamb(°C) tp 0.0 0 DS2133 - Rev 12 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175 page 4/19 STPS1L60 Characteristics (curves) Figure 5. Average forward current versus ambient temperature (δ = 0.5) 6 Figure 6. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) IF(AV)(A) 1 SOD123Flat SMA Flat Notch 5 Rth(j-a) = Rth(j-l) 4 0.1 3 2 T 0.01 1 Tamb(°C) tp δ = tp/T 0 0 25 50 75 100 125 150 175 0.001 t p(µs) 1 10 100 1000 Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration to ambient versus pulse duration 1.0 Zth(j-a) /Rth(j-a) 1.0 SMA 0.9 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.0 1.E-02 1.E-01 0.1 tp(s) 1.E+00 1.E+01 1.E+02 1.E+03 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration 1.0 0.9 Zth(j-a) /Rth(j-a) 1.E-01 tp(s) 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Relative variation of thermal impedance junction to lead versus pulse duration 0.9 STmite flat Single pulse 0.0 1.E-02 1.0 Zth(j-l) /Rth(j-l) SOD123Flat 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 DO-41 0.9 0.8 0.1 Zth(j-a) /Rth(j-a) 0.2 Single pulse 0.1 0.0 1.E-02 DS2133 - Rev 12 tp(s) 1.E-01 1.E+00 1.E+01 1.E+02 0.1 1.E+03 Single pulse 0.0 1.E-04 tp(s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 page 5/19 STPS1L60 Characteristics (curves) Figure 11. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) 1.E+02 Figure 12. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+01 Tj = 125 °C Tj = 100 °C 1.E+00 100 Tj = 75 °C 1.E-01 Tj = 50 °C 1.E-02 Tj = 25 °C VR(V) VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 45 50 55 10 Figure 13. Forward voltage drop versus forward current (typical values) 10.00 1 60 IF(A) 10 100 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Rth(j-a)(°C/W) SMA 150 1.00 Tj = 125 °C 100 Tj = 25 °C Tj = 75 °C 0.10 Epoxy printed board FR4, eCu = 35 µm 50 SCu (cm²) VF(V) 0.01 0.0 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 Figure 15. Thermal resistance junction to ambient versus copper surface under tab (typical values) 200 Rth(j-a)(°C/W) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (typical values) 250 Rth(j-a)(°C/W) STmite flat SOD123Flat 200 150 150 100 100 Epoxy printed board FR4, eCu = 35 µm Epoxy printed board FR4, eCu = 35 µm 50 50 SCu (cm²) SCu (cm²) 0 0 0.0 0.5 DS2133 - Rev 12 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 6/19 STPS1L60 Characteristics (curves) Figure 17. Thermal resistance versus lead length 120 Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(°C/W) Rth(j-a) (°C/W) Rth(j-a) 100 200 DO-41 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat Notch 150 80 60 Rth(j-l) 100 40 20 50 Lleads(mm) S(Cu)(cm²) 0 5 10 15 20 25 0 0.0 DS2133 - Rev 12 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 7/19 STPS1L60 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 19. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Ref. A1 DS2133 - Rev 12 Millimeters Inches (for reference only) Min. Max. Min. Max. 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 8/19 STPS1L60 SMA package information Figure 20. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS2133 - Rev 12 page 9/19 STPS1L60 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 21. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS2133 - Rev 12 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 10/19 STPS1L60 SMA Flat Notch package information Figure 22. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS2133 - Rev 12 page 11/19 STPS1L60 DO-41 package information 2.3 DO-41 package information • Epoxy meets UL 94, V0 Figure 23. DO-41 package outline C C A ØD ØB Table 6. DO-41 package mechanical data Dimensions Ref. DS2133 - Rev 12 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 4.07 - 5.20 0.160 - 0.205 B 2.04 - 2.71 0.080 - 0.107 C 25.40 - 1.000 - D 0.71 - 0.028 - 0.86 0.0034 page 12/19 STPS1L60 SOD123Flat package information 2.4 SOD123 Flat package information Figure 24. SOD123Flat package outline A C1 L HD D L C b E Table 7. SOD123Flat package mechanical data Dimensions Millimeters Ref. DS2133 - Rev 12 Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 0.86 0.98 1.10 0.034 0.038 0.043 b 0.80 0.90 1.00 0.031 0.035 0.039 c 0.08 0.15 0.25 0.003 0.006 0.009 c1 0.00 0.10 0.000 D 2.50 2.60 2.70 0.098 0.102 0.106 E 1.50 1.60 1.80 0.059 0.063 0.070 HD 3.30 3.50 3.70 0.130 0.137 0.146 L 0.45 0.65 0.85 0.018 0.025 0.033 0.004 page 13/19 STPS1L60 SOD123Flat package information Figure 25. SOD123Flat footprint dimensions (mm) 1.60 1.40 1.30 DS2133 - Rev 12 page 14/19 STPS1L60 STmite Flat package information 2.5 STmiteFlat package information • Epoxy meets UL 94,V0 Figure 26. STmite Flat package outline L1 1 L2 L E1 1 E D b2 b L3 BOTTOM VIEW TOP VIEW C A FRONT VIEW RIGHT VIEW Table 8. STmite Flat package mechanical data Dimensions Ref. DS2133 - Rev 12 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 0.80 0.85 0.95 0.031 0.033 0.037 b 0.40 0.55 0.65 0.016 0.022 0.026 b2 0.70 0.85 1.00 0.027 0.033 0.039 c 0.10 0.15 0.25 0.004 0.006 0.009 D 1.75 1.90 2.05 0.069 0.075 0.081 E 3.60 3.80 3.90 0.142 0.150 0.154 E1 2.80 2.95 3.10 0.110 0.116 0.122 L 0.50 0.55 0.80 0.020 0.022 0.031 L1 2.10 2.40 2.60 0.083 0.094 0.102 L2 0.45 0.60 0.75 0.018 0.024 0.030 L3 0.20 0.35 0.50 0.008 0.014 0.020 page 15/19 STPS1L60 STmite Flat package information Figure 27. STmite Flat Recommended footprint (0.033) (0.025) 0.85 0.63 (0.079) 2.00 (0.026) 0.65 (0.026) 0.65 0.95 (0.037) 1.95 (0.077) 4.13 (0.163) millimeters (inches) DS2133 - Rev 12 page 16/19 STPS1L60 Ordering information 3 Ordering information Table 9. Ordering information DS2133 - Rev 12 Order code Marking Package Weight Base qty. Delivery mode STPS1L60A GB6 SMA 68 mg 5000 Tape and reel STPS1L60AFN A16 SMA Flat Notch 39 mg 10 000 Tape and reel STPS1L60RL STPS1L60 DO-41 340 mg 5000 Tape and reel STPS1L60MF F1L6 STmite flat 16 mg 12000 Tape and reel STPS1L60ZF 1L6 SOD123 Flat 12.5 mg 3000 Tape and reel page 17/19 STPS1L60 Revision history Table 10. Document revision history Date DS2133 - Rev 12 Revision Changes Jul-2003 5A Last update. Aug-2004 6 SMA package dimensions update. Reference A1 max. changed from 2.70 mm (0.106 inch.) to 2.03 mm (0.080 inc.). 25-Jun-2009 7 Added STmite flat package. Updated ECOPACK statement. 30-Sep-2009 8 Updated table 7 ref. "C" 9-Aug-2016 9 Added SOD123Flat package. 26-Aug-2016 10 Updated table 4. 05-Dec-2018 11 Updated Section Features and Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified). 27-Sep-2019 12 Added Section 2.2 SMA Flat Notch package information. page 18/19 STPS1L60 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS2133 - Rev 12 page 19/19