STPS20170CFP

STPS20170C High voltage power Schottky rectifier Datasheet - production data A1 A2 Description K Dual center tap Schottky rectifier diode suited for high frequency switched mode power supplies. K Table 1: Device summary A2 Symbol Value IF(AV) 2 x 10 A VRRM 170 V Tj (max.) 175 °C VF (typ.) 0.69 V K A2 K A1 A1 TO-220AB TO-220FPAB K K A2 A2 A1 A1 D²PAK Features      High reverse voltage High junction temperature capability Avalanche specification with derating curves Insulated package TO-220FPAB  Insulating voltage: 2000 VRMS sine ECOPACK®2 compliant component for D²PAK on demand Benefits  Can challenge bipolar ultrafast diodes with better dynamic characteristics October 2016 DocID10243 Rev 3 This is information on a product in full production. 1/15 www.st.com Characteristics 1 STPS20170C Characteristics Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 170 V IF(RMS) Forward rms current 30 A IF(AV) Average forward current δ = 0.5, square wave TO-220AB / D²PAK TO-220FPAB TC = 155 °C Per diode 10 TC = 150 °C Total 20 TC = 135 °C Per diode 10 TC = 115 °C Total 20 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 480 W Tstg Tj Storage temperature range -65 to +175 Maximum operating junction temperature (1) 175 °C Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Parameter TO-220AB / D²PAK Rth(j-c) Junction to case TO-220FPAB Rth(c) Coupling Per diode 2.2 Total 1.3 Per diode 4.5 Total 3.5 TO-220AB / D²PAK 0.3 TO-220FPAB 2.5 When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) 2/15 Max. value DocID10243 Rev 3 Unit °C/W STPS20170C Characteristics Table 4: Static electrical characteristics (per diode) Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A IF = 20 A Min. Max. Unit - 15 µA - 15 mA - 0.90 - Typ. 0.69 - 0.75 0.99 0.79 V 0.86 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.64 x IF(AV) + 0.011 x IF2(RMS) DocID10243 Rev 3 3/15 Characteristics 1.1 STPS20170C Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current (per diode) 10 Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode) PF(AV)(W) 12 δ = 0.05 9 δ = 0.1 δ = 0.2 δ = 0.5 IF(AV)(A) 11 R th(j-a) =R th(j-c) (TO-220AB and D²PAK) 10 8 9 7 R th(j-a) =R th(j-c) (TO -220FPAB ) 8 δ=1 6 7 5 6 4 5 R th(j-a) =15°C/W 4 3 T 3 T 2 2 1 IF (AV) (A ) δ = tp/T δ = tp/T 1 tp 0 tp Tamb (° C) 0 0 1 2 3 4 5 6 7 8 9 10 11 12 Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 PARM (t p ) PARM (10 µs) 0 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration 1.0 Zth(j-c)/Rth(j-c) 0.9 0.8 0.7 0.1 0.6 TO-220AB and D²PAK 0.5 0.4 0.01 0.3 T TO-220FPAB 0.2 Single pulse t p (µs) 0.1 0.001 1 10 100 t p( s ) 1.E- 03 Figure 5: Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E +05 δ = tp/T tp 0.0 1000 IR(µA) 1.E- 02 1.E- 01 1.E+ 00 Figure 6: Junction capacitance versus reverse voltage applied (typical values, per diode) 1000 C(pF) F = 1 MHz T j = 175 °C 1.E +04 V = 30 mV OSC RMS Tj = 25 °C T j = 150 °C T j = 125 °C 1.E +03 100 1.E +02 T j = 100 °C 1.E +01 1.E +00 T j = 25 °C V R (V ) V R (V ) 10 1.E -01 0 4/15 25 50 75 100 125 150 175 DocID10243 Rev 3 1 10 100 1000 STPS20170C Characteristics Figure 7: Forward voltage drop versus forward current (per diode) Figure 8: Thermal resistance junction to ambient versus copper surface under tab for D²PAK 80 Rth(j-a) (°C/W) 70 60 50 40 30 20 Epoxy printed board FR4, eCU= 35 µm 10 SCu(cm²) 0 0 DocID10243 Rev 3 5 10 15 20 25 30 35 5/15 40 Package information 2 STPS20170C Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.     6/15 Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N·m (for TO-220AB and TO-220FPAB) Maximum torque value: 0.7 N·m (for TO-220AB and TO-220FPAB) DocID10243 Rev 3 Package information STPS20170C 2.1 D²PAK package information Figure 9: D²PAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID10243 Rev 3 7/15 Package information STPS20170C Table 5: D²PAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 8/15 Inches 0.4 typ. 0° 0.015 8° DocID10243 Rev 3 0° 8° Package information STPS20170C Figure 10: D²PAK recommended footprint (dimensions in mm) DocID10243 Rev 3 9/15 Package information 2.2 STPS20170C TO-220FPAB package information Figure 11: TO-220FPAB package outline A B H Dia L6 L2 L7 L3 L5 F1 L4 F2 F G1 G 10/15 D DocID10243 Rev 3 E Package information STPS20170C Table 6: TO-220FPAB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.50 2.75 0.098 0.108 E 0.45 0.70 0.018 0.027 F 0.75 1.0 0.03 0.039 F1 1.15 1.70 0.045 0.067 F2 1.15 1.70 0.045 0.067 G 4.95 5.20 0.195 0.205 G1 2.40 2.70 0.094 0.106 H 10.00 10.40 0.393 0.409 L2 16.00 typ. 0.63 typ. L3 28.60 30.60 1.126 1.205 L4 9.80 10.6 0.386 0.417 L5 2.90 3.60 0.114 0.142 L6 15.90 16.40 0.626 0.646 L7 9.00 9.30 0.354 0.366 Dia 3.0 3.20 0.118 0.126 DocID10243 Rev 3 11/15 Package information 2.3 STPS20170C TO-220AB package information Figure 12: TO-220AB package outline 12/15 DocID10243 Rev 3 Package information STPS20170C Table 7: TO-220AB package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 1.27 typ. 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 DocID10243 Rev 3 13/15 Ordering information 3 STPS20170C Ordering information Table 8: Ordering information Order code 4 Marking Package Weight Base qty. Delivery mode STPS20170CT STPS20170CT TO-220AB 1.95 g 50 Tube STPS20170CFP STPS20170CFP TO-220FPAB 1.7 g 50 Tube STPS20170CG-TR STPS20170CG D²PAK 1.38 g 1000 Tape and reel Revision history Table 9: Document revision history Date Revision Mar-2004 1 First issue. 28-Jul-2005 2 TO-220FPAB, I²PAK and D²PAK packages added. 3 Removed I²PAK package. Updated features and packages silhouettes in cover page. Updated Section 5: "Characteristics", Section 5.1: "Characteristics (curves)", Table 8: "Ordering information" and Section 6.2: "D²PAK package information". 14-Oct-2016 14/15 Changes DocID10243 Rev 3 STPS20170C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved DocID10243 Rev 3 15/15