STPS2045CGY-TR

STPS2045C-Y Automotive power Schottky rectifier Features ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Avalanche rated ■ AEC-Q101 qualified A1 K A2 K A2 A1 Description D2PAK STPS2045CGY Dual center tap Schottky rectifier suited for high frequency DC to DC converters. Packaged in D2PAK, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. May 2011 Table 1. Doc ID 17262 Rev 1 Device summary IF(AV) 2 x 10 A VRRM 45 V Tj(max) 175 °C VF(typ) 0.57 V 1/7 www.st.com 7 Characteristics 1 STPS2045C-Y Characteristics Table 2. Absolute ratings (limiting values, per diode) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A 10 A IF(AV) Average forward current δ = 0.5 Tc = 155 °C IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 180 A PARM Repetitive peak avalanche power tp = 1 μs, Tj = 25 °C 4000 W -65 to +175 °C -40 to +175 °C 10000 V/µs Tstg Tj dV/dt 1. Per diode Storage temperature range Maximum operating junction temperature (1) Critical rate of rise of reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal resistances parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Value Unit 2.2 1.3 °C/W 0.3 °C/W Per diode Total When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode 1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) Table 4. Symbol IR(1) Static electrical characteristics (per diode) Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 125 °C VF(1) Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A IF = 20 A 1. Pulse test : tp = 380 μs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.015 IF2(RMS) 2/7 Doc ID 17262 Rev 1 Min. Typ. Max. Unit - - 100 μA - 7 15 mA - 0.5 0.57 - - 0.84 - 0.65 0.72 V STPS2045C-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current (per diode) Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV)(A) PF(AV)(W) 12 8 δ = 0.1 δ = 0.05 7 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) 10 6 8 δ=1 5 Rth(j-a)=15°C/W 4 6 3 4 T T 2 2 1 IF(AV)(A) δ=tp/T 0 0 1 2 3 Figure 3. 4 5 6 7 8 9 10 δ=tp/T tp tp Tamb(°C) 0 11 12 Normalized avalanche power derating versus pulse duration 0 25 Figure 4. 50 75 100 125 150 175 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) PARM(tp) PARM(1µs) 1.2 1 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0 0.01 0.1 Figure 5. 1 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) 25 50 Figure 6. IM(A) 75 100 125 150 Relative variation of thermal impedance junction to ambient versus pulse duration Zth(j-c)/Rth(j-c) 140 1.0 120 0.8 100 0.6 80 δ = 0.5 TC=75°C 60 0.4 TC=100°C 40 T TC=125°C IM 20 0.2 t δ = 0.1 t(s) δ=0.5 δ = 0.2 tp(s) Single pulse 0.0 0 1E-3 1E-2 1E-1 1E+0 1E-4 Doc ID 17262 Rev 1 1E-3 1E-2 δ=tp/T 1E-1 tp 1E+0 3/7 Characteristics Figure 7. STPS2045C-Y Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) IR(µA) 1000 5E+4 F=1MHz VOSC=30mVRMS Tj=25°C Tj=150°C 1E+4 Tj=125°C 500 Tj=100°C 1E+3 Tj=75°C 1E+2 Tj=50°C 1E+1 Tj=25°C 200 1E+0 VR(V) VR(V) 1E-1 100 0 5 10 Figure 9. 15 20 25 30 35 40 45 Forward voltage drop versus forward current (maximum values, per diode) 1 2 5 10 20 50 Figure 10. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) IFM(A) 100.0 80 Tj=125°C (typical values) (Epoxy printed circuit board, copper thickness: 35 µm) 70 60 10.0 Tj=125°C 50 Tj=25°C 40 30 1.0 20 10 S(cm²) VFM(V) 0 0.1 0.0 4/7 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 Doc ID 17262 Rev 1 5 10 15 20 25 30 35 40 STPS2045C-Y 2 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. D2PAK dimensions Dimensions Ref. A E C2 L2 D L B2 Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R C B G A2 M * Inches Min. L3 A1 Millimeters V2 * FLAT ZONE NO LESS THAN 2mm R V2 0.40 typ. 0° 0.016 typ. 8° 0° 8° Figure 11. Footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 17262 Rev 1 3.70 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS2045CGY-TR STPS2045CGY D2PAK 1.48 g 1000 Tape and reel Revision history Table 7. 6/7 STPS2045C-Y Document revision history Date Revision 24-May-2011 1 Changes Initial release. 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