STPS2045CH

STPS2045CH Datasheet 45 V power Schottky rectifier Features A1 K A2 A1 K • • • • Very small conduction losses Avalanche specification Low forward voltage drop High frequency operation • ECOPACK®2 compliant Applications A2 • • • • • IPAK DC/DC converter Battery charger SMPS Desktop power Auxiliary power Description This dual-diode common cathode Schottky rectifier is ideal for high frequency switch mode power supply. Packaged in IPAK, the STPS2045CH is optimized for notebook, game station and desktop adapters, providing in these applications a good efficiency at both low and high load. Product status link STPS2045CH Product summary IF(AV) 2 x 10 A VRRM 45 V VF (typ.) 0.50 V Tj (max.) 175 °C DS8991 - Rev 3 - November 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS2045CH Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 20 A TC = 155 °C Per diode 10 TC = 150 °C Per device 20 Surge non repetitive forward current tp = 10 ms sine-wave 150 A Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 280 W -65 to +175 °C +175 °C IF(AV) Average forward current δ = 0.5, square wave IFSM PARM Tstg Storage temperature range Tj Maximum operating junction temperature (1) A 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Value Per diode 2.5 Total 1.6 Unit °C/W 0.7 For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR (1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 125 °C VF (2) Forward voltage drop Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A IF = 20 A Min. Typ. - Max. Unit 100 µA mA - 7 15 - 0.50 0.57 - 0.84 0.65 V 0.72 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.42 x IF(AV) + 0.015 x IF 2 (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS8991 - Rev 3 page 2/9 STPS2045CH Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (per diode) 9 PF(AV) (W) 8 Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV) (A) 12 δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 R δ=1 th(j-a) =R th(j-c) 10 7 6 8 5 6 4 3 4 T T 2 2 1 δ= tp/T 0 2 0 6 4 8 tp 10 I F(AV) 12 (A) Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 δ= tp/T 0 14 PARM (t p ) PARM (10 µs) tp 25 0 50 tamb(°C) 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.1 0.6 0.5 Single pulse 0.4 0.01 0.3 0.2 0.1 t p(µs) 0.001 1 DS8991 - Rev 3 10 100 1000 0.0 1.E-04 tP(s) 1.E-03 1.E-02 1.E-01 1.E+00 page 3/9 STPS2045CH Characteristics (curves) Figure 5. Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E+05 Figure 6. Junction capacitance versus reverse voltage applied (typical values, per diode) IR (µA) C(pF) 1000 F = 1 MHz V = 30 mV 1.E+04 OSC Tj = 150°C Tj = 125 °C 1.E+03 RMS T = 25 °C j 500 Tj = 100 °C 1.E+02 Tj = 75 °C 1.E+01 Tj = 50 °C 1.E+00 Tj = 25 °C 200 V R(V) 100 1.E-01 0 5 10 15 20 25 30 35 40 45 VR(V) 1 2 10 5 20 50 Figure 7. Forward voltage drop versus forward current (per diode) 100.0 IF (A) Tj = 125 °C Typical values 10.0 Tj = 25 °C Maximum values 1.0 Tj = 125 °C Maximum values VF (V) 0.1 0.0 DS8991 - Rev 3 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 page 4/9 STPS2045CH Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 IPAK package information • • Cooling method: by conduction (C) Epoxy meets UL 94,V0 Figure 8. IPAK package outline E b4 A c2 V1 L2 D L1 A1 e B5 b2 b e1 DS8991 - Rev 3 H L c page 5/9 STPS2045CH IPAK package information Table 4. IPAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 b 0.64 0.90 0.025 0.035 b2 b4 0.95 5.20 B5 5.43 0.037 0.205 0.30 typ. 0.214 0.012 typ. c 0.45 0.60 0.018 0.024 c2 0.46 0.60 0.018 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.65 0.252 0.261 e e1 2.28 typ. 4.40 H DS8991 - Rev 3 Inches typ.0.090 4.60 0.173 16.10 typ. 0.181 0.634 typ. L 9.0 9.60 0.354 0.378 L1 0.80 1.20 0.031 0.047 L2 0.80 typ. 1.25 0.031 typ. 0.049 V1 +10° +10 page 6/9 STPS2045CH Ordering information 3 Ordering information Table 5. Ordering information DS8991 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STPS2045CH S20 45CH IPAK 0.31 g 75 Tube page 7/9 STPS2045CH Revision history Table 6. Document revision history Date Version Changes 21-Jun-2012 1 First issue. 09-Oct-2014 2 Updated Table 2 and IPAK package informations. Removed figure 1 and figure 9. 27-Nov-2018 DS8991 - Rev 3 3 Updated Table 1. Absolute ratings (limiting values, at 25 °C unless otherwise specified), Figure 5. Reverse leakage current versus reverse voltage applied (typical values, per diode), Figure 7. Forward voltage drop versus forward current (per diode) and Table 5. Ordering information. page 8/9 STPS2045CH IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2018 STMicroelectronics – All rights reserved DS8991 - Rev 3 page 9/9