STPS20L60CG-TR

STPS20L60C Datasheet 60 V, 2 x 10 A, low drop power Schottky rectifier Features A1 K A2 K A1 K • ECOPACK2 compliant component in TO-220AB, on demand for D2PAK Applications K A1 Low forward voltage drop Negligible switching losses Low thermal resistance Avalanche capability specified A2 TO-220AB K • • • • A2 A1 D2PAK A2 • • • • • Set-top box Battery charger DC / DC converter Notebook adapter Switching diodes Description Dual center tab Schottky rectifier suited for SMPS and high frequency DC to DC converters. Packaged in TO-220AB and D2PAK, the STPS20L60C is intended for use in high frequency inverters. Product status link STPS20L60C Product summary Symbol Value IF(AV) 2 x 10 A VRRM 60 V T j(max.) 150 °C VF(typ.) 0.48 V DS1595 - Rev 5 - December 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS20L60C Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, per diode, at 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 30 A Per diode 10 Per device 20 Surge non repetitive forward current tp = 10 ms sinusoidal 220 A Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 430 W -65 to +175 °C 150 °C 10000 V/µs IF(AV) Average forward current IFSM PARM Tstg Tc = 135 °C, δ = 0.5 square wave Storage temperature range Tj Maximum operating junction temperature(1) dV/dt Critical rate of rise reverse voltage A 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Max. value Per diode 1.6 Total 0.85 Unit °C/W 0.1 When the diodes 1 and 2 are used simultaneously : Δ Tj(diode 1) = P(diode1) x Rth(j-c)(per diode) + P(diode 2) x Rth(c) For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics (per diode) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A IF = 20 A Min. Typ. - 65 - Unit 350 µA 95 mA 0.60 0.48 - Max. 0.56 0.74 0.62 V 0.70 1. Pulse test: tp = 380 μs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.42 x IF(AV) + 0.014 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS1595 - Rev 5 page 2/11 STPS20L60C Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) Figure 1. Average forward current versus case temperature (δ = 0.5, per diode) PARM (t p ) PARM (10 µs) IF(AV)(A) 1 25 20 0.1 15 10 0.01 5 T c(°C) 0 0 25 50 75 100 125 150 Figure 3. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c) /Rth(j-c) 0.001 t p(µs) 1 10 100 1000 Figure 4. Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E+03 IR(mA) 1.0 Tj = 150 °C 0.9 1.E+02 0.8 Tj = 125 °C 0.7 1.E+01 Tj = 100 °C 0.6 Tj = 75 °C 0.5 1.E+00 0.4 Tj = 50 °C Single pulse 0.3 1.E-01 Tj = 25 °C 0.2 VR(V) 0.1 t P(s) 1.E-02 0.0 1.E-04 1.E-03 1.E-02 1.E-01 0 1.E+00 Figure 5. Junction capacitance versus reverse voltage applied (typical values, per diode) 5 10 15 20 25 30 35 40 45 50 55 60 Figure 6. Forward voltage drop versus forward current (typical values, per diode) IF(A) C(pF) 100.0 10000 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C 10.0 Tj = 25 °C Tj = 75 °C Tj = 125 °C 1000 Tj = 150 °C 1.0 VR(V) 1 DS1595 - Rev 5 10 VF(V) 0.1 100 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 page 3/11 STPS20L60C Characteristics (curves) Figure 7. Thermal resistance junction to ambient versus copper surface under tab (typical values) Rth(j-a) (°C/W) 60 D²PAK Epoxy printed board FR4, copper thickness = 70 µm 50 40 30 20 10 SCu (cm²) 0 0 DS1595 - Rev 5 5 10 15 20 25 30 35 40 page 4/11 STPS20L60C Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 D²PAK package information • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Figure 8. D²PAK package outline Note: DS1595 - Rev 5 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 5/11 STPS20L60C D²PAK package information Table 4. D²PAK package mechanical data Dimensions Millimeters Ref. Inches (for reference only) Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R 0.4 typ. V2 0° 0.015 8° 0° 8° Figure 9. D²PAK recommended footprint (dimensions in mm) 16.90 12.20 5.08 2.54 1.60 9.75 DS1595 - Rev 5 3.50 page 6/11 STPS20L60C TO-220AB package information 2.2 TO-220AB package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 10. TO-220AB package outline DS1595 - Rev 5 page 7/11 STPS20L60C TO-220AB package information Table 5. TO-220AB package mechanical data Dimensions Millimeters Ref. Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.55 0.045 0.061 c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 D1 DS1595 - Rev 5 Inches (for reference only) 1.27 typ. 0.620 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 page 8/11 STPS20L60C Ordering Information 3 Ordering Information Table 6. Ordering information DS1595 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPS20L60CT STPS20L60CT TO-220AB 1.95 g 1000 Tape and reel STPS20L60CG-TR STPS20L60CG D2PAK 1.48 g 50 Tube page 9/11 STPS20L60C Revision history Table 7. Document revision history Date Version Jul-2003 3C 02-Aug-2013 4 Changes Previous release Added TO-220AB narrow leads package. Removed I²PAK package information. 02-Dec-2020 5 Updated D²PAK package information. Added Application section. Minor text change. DS1595 - Rev 5 page 10/11 STPS20L60C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS1595 - Rev 5 page 11/11