STPS20LCD80CB-TR

STPS20LCD80CB High voltage power Schottky rectifier Datasheet - production data Description A1 This dual diode Schottky rectifier is suited for high frequency switched mode power supplies. K A2 Packaged in DPAK, this device is intended to be used in high density converters, providing these applications with a good efficiency at both low and high load. K K Table 1: Device summary A1 A1 A2 A2 DPA K Features      Symbol Value IF(AV) 2 x 10 A VRRM 80 V Tj (max) 175 °C VF (typ) 0.66 V High junction temperature capability Good trade-off between leakage current and forward voltage drop Low leakage current Avalanche capability specified ECOPACK®2 compliant component for DPAK on demand September 2017 DocID024228 Rev 2 This is information on a product in full production. 1/9 www.st.com Characteristics 1 STPS20LCD80CB Characteristics Table 2: Absolute ratings (limiting values, per diode, at Tamb 25 °C, unless otherwise stated) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 80 V IF(RMS) Forward rms current 20 A Average forward current δ = 0.5, square wave Per diode TC = 145 °C 10 IF(AV) Per device TC = 140 °C 20 Surge non repetitive forward current tp = 10 ms sinusoidal Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C IFSM PARM(1) Tstg A 125 Storage temperature range 230 W -65 to + 175 °C + 175 °C Maximum operating junction temperature (2) Tj A Notes: (1)For pulse time duration derating, please refer to Figure 3: "Normalized avalanche power derating versus pulse duration (Tj = 125 °C)". More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the application notes AN1768 and AN2025. (2)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameter Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Value Per diode 3.20 Total 1.95 0.70 When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) 2/9 DocID024228 Rev 2 Unit °C/W °C/W STPS20LCD80CB Characteristics Table 4: Static electrical characteristics (per diode) Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 10 A IF = 20 A Min. Typ. Max. Unit - 3.2 15 µA - 2.8 8 mA - 0.815 0.880 - 0.660 0.710 - 1.030 1.160 - 0.765 0.865 V Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.555 x IF(AV) + 0.0155 IF2(RMS) DocID024228 Rev 2 3/9 Characteristics 1.1 STPS20LCD80CB Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current (per diode) Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode) IF(A V) (A) P F(AV)(W) 12 10 δ = 0.2 δ = 0.1 δ = 0.05 9 δ= 1 δ = 0.5 R th(j - a) = Rth(j - c) 11 10 8 9 7 8 6 7 5 6 4 5 4 3 3 T 2 2 1 IF(A V) (A) δ =tp/T 0 0 1 2 3 4 5 6 7 8 9 10 0 11 12 13 Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 Tamb (°C) 1 tp 0 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration PARM (t p ) PARM (10 µs) Zth(j-c) / Rth(j-c) 1.0 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 Single pulse 0.3 0.2 t p (µs) 0.1 0.001 1 10 100 1000 0.0 1.E-04 Figure 5: Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E+05 IR(µA) 1.E-03 1.E-02 1.E-01 1.E+00 Figure 6: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 1.E+04 F=1MHz VOSC=30mVRMS Tj=25°C Tj = 150 °C Tj = 125 °C 1.E+03 Tj = 100 °C 1.E+02 100 Tj = 75 °C Tj = 50 °C 1.E+01 Tj = 25 °C 1.E+00 VR (V) 1.E-01 10 0 4/9 10 20 30 40 50 60 70 80 DocID024228 Rev 2 1 10 100 STPS20LCD80CB Characteristics Figure 7: Thermal resistance junction to ambient versus copper surface under tab Figure 8: Forward voltage drop versus forward current (per diode) IFM (A) 20 18 Tj=125°C (Maximum values) 16 14 12 Tj=125°C (Typical values) 10 8 Tj=25°C (Maximum values) 6 4 2 VFM (V) 0 0.0 DocID024228 Rev 2 0.2 0.4 0.6 0.8 1.0 5/9 1.2 Package information 2 STPS20LCD80CB Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Cooling method: by conduction (C) Epoxy meets UL 94,V0 DPAK package information Figure 9: DPAK package outline This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. 6/9 DocID024228 Rev 2 Package information STPS20LCD80CB Table 5: DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 10: DPAK recommended footprint (dimensions in mm) DocID024228 Rev 2 7/9 Ordering information 3 STPS20LCD80CB Ordering information Table 6: Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS20LCD80CB-TR S20LC D80C DPAK 0.32 g 2500 Tape and reel Revision history Table 7: Document revision history 8/9 Date Revision Changes 07-Jan-2015 1 First full version, consolidating the previous internal release of march 2013. Updated the DPAK package information. 27-Sep-2017 2 Updated description in cover page. Minor text changes. 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All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved DocID024228 Rev 2 9/9