STPS2150AFN

STPS2150 Datasheet 150 V, 2 A power Schottky rectifier Features • • • • • • Negligible switching losses Low forward voltage drop for higher efficiency and extended battery life Low thermal resistance Surface mount miniature package Avalanche capability specified ECOPACK2 compliant Applications • • • • Switching diode SMPS DC/DC converter Telecom power Description This 150 V power Schottky rectifier is ideal for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in SMA, SMA Flat Notch and axial, the STPS2150 is optimized for use in consumer and computer applications where low drop forward voltage is required to reduce power dissipation. Product status link STPS2150 Product status link Symbol Values IF(AV) 2A VRRM 150 V Tj (max.) 175 °C VF(typ.) 0.62 V DS3282 - Rev 8 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS2150 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V IF(RMS) Forward rms current 30 A 2 A TL = 145 °C SMA IF(AV) Average forward current δ = 0.5, square wave SMA Flat Notch TL = 145 °C TL = 130 °C DO-15 IFSM Surge non repetitive forward current PARM Repetitive peak avalanche power Tstg Storage temperature range Tj SMA 75 SMA Flat Notch tp = 10 ms sinusoidal 70 DO-15 150 tp = 10 µs, Tj= 125 °C 170 W -65 to + 175 °C + 175 °C Value Unit Maximum operating junction temperature (1) A 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-L) Parameter Junction to lead Junction to lead Lead length = 10 mm SMA 20 SMA Flat Notch 20 DO-15 30 °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 2 A IF = 4 A Min. Typ. Max. Unit - 0.5 1.5 µA - 0.5 1.5 mA - 0.78 0.82 - 0.62 0.67 - 0.86 0.89 - 0.70 0.75 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.04 IF2(RMS) DS3282 - Rev 8 page 2/13 STPS2150 Characteristics (curves) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ= 0.5) IF(AV)(A) PF(AV)(W) 2.2 1.6 δ = 0.1 1.4 δ = 0.2 δ = 0.5 δ = 0.05 SMA / SMA Flat Notch Rth(j-a)=Rth(j-l) 2.0 1.8 1.2 DO-15 1.6 δ=1 Rth(j-a)=100°C/W 1.4 1.0 1.2 0.8 1.0 0.8 0.6 0.4 0.6 T T Rth(j-a)=200°C/W 0.4 0.2 IF(AV)(A) δ=tp/T 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.2 tp δ=tp/T Tamb (°C) tp 0.0 2.0 2.2 Figure 3. Normalized avalanche power derating versus pulse duration (Tj= 125 °C) PARM (t p ) PARM (10 µs) 0 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-15) 1.0 1 25 Zth(j-a) /Rth(j-a) DO-15 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 0.1 0.001 t p(µs) 1 DS3282 - Rev 8 10 Single pulse t p (s) 0.0 100 1000 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 page 3/13 STPS2150 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) IR(µA) Zth(j-a) /Rth(j-a) 1.0 Figure 6. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 SMA 0.9 Tj=150°C 1.E+03 0.8 Tj=125°C 0.7 1.E+02 Tj=100°C 0.6 1.E+01 0.5 Tj=75°C 0.4 Tj=50°C 1.E+00 0.3 0.2 Tj=25°C 1.E-01 0.1 t p (s) Single pulse VR(V) 1.E-02 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 0 1.E+03 Figure 7. Junction capacitance versus reverse voltage applied (typical values) 25 50 75 100 125 150 Figure 8. Forward voltage drop versus forward current (low level) IF (A) C(pF) 2.0 1000 F=1MHz VOSC=30mVRMS Tj=25°C 1.8 Tj=125°C (Maximum values) 1.6 1.4 Tj=25°C (Maximum values) 1.2 Tj=125°C (Typical v alues) 1.0 100 0.8 0.6 0.4 0.2 V R (V) 1 10 VF (V) 0.0 10 100 1000 Figure 9. Forward voltage drop versus forward current (high level) IF (A) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Rth(j-a) (°C/W) 200 100 SMA Tj=125°C (maximum values) 150 Tj=125°C (typical values) Tj=25°C (maximum values) 10 100 50 SCu (cm²) VF (V) 1 0.0 0.2 DS3282 - Rev 8 0.4 0.6 0.8 1.0 0 1.2 1.4 1.6 1.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/13 STPS2150 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth (°C/W) Rth(j-a) (°C/W) 200 Figure 12. Thermal resistance versus lead length (DO-15) 120 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat Notch 150 Rth(j-a) 100 80 60 100 Rth(j-I) 40 50 20 S(Cu)(cm²) L leads (mm) 0 0 0.0 0.5 DS3282 - Rev 8 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5 10 15 20 25 page 5/13 STPS2150 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS3282 - Rev 8 page 6/13 STPS2150 SMA package information 2.1 SMA package information • • Epoxy meets UL 94, V0 Cooling method : by conduction (C) Figure 13. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Ref. DS3282 - Rev 8 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A1 1.90 - 2.45 0.075 - 0.097 A2 0.05 - 0.20 0.002 - 0.008 b 1.25 - 1.65 0.049 - 0.065 C 0.15 - 0.40 0.006 - 0.016 D 2.25 - 2.90 0.089 - 0.114 E 4.80 - 5.35 0.189 - 0.211 E1 3.95 - 4.60 0.156 - 0.181 L 0.75 - 1.50 0.030 - 0.059 page 7/13 STPS2150 SMA package information Figure 14. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.103) (0.055) 1.64 (0.064) 5.43 (0.214) DS3282 - Rev 8 page 8/13 STPS2150 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 15. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS3282 - Rev 8 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 9/13 STPS2150 DO-15 package information Figure 16. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) 2.3 DO-15 package information • Epoxy meets UL 94, V0 Figure 17. DO-15 package outline C C A ØD ØB Table 6. DO-15 package mechanical data Dimensions Ref. DS3282 - Rev 8 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 6.05 - 6.75 0.238 - 0.266 B 2.95 - 3.53 0.116 - 0.139 C 26.00 - 31.00 1.024 - 1.220 D 0.71 - 0.88 0.028 - 0.0035 page 10/13 STPS2150 Ordering information 3 Ordering information Table 7. Ordering information DS3282 - Rev 8 Order code Marking Package Weight Base qty. Delivery mode STPS2150AFN A2150 SMA Flat Notch 0.039 g 10 000 Tape and reel STPS2150A 2150 SMA 0.068 g 5000 Ammopack STPS2150 STPS2150 DO-15 0.4 g 2000 Tape and reel page 11/13 STPS2150 Revision history Table 8. Document revision history DS3282 - Rev 8 Date Revision Changes Jul-2003 3A Aug-2004 4 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106) to 2.03mm (0.080). 31-May-2006 5 Reformatted to current standard. Added ECOPACK statement. Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10. 18-Sep-2008 6 Reformatted to current standard. Added SMAflat package. Removed IF(RMS) from Table 2. 04-Jul-2018 7 Removed SMAFlat package information. Updated Table 1 and Figure 3. 25-Sep-2019 8 Added Section 2.2 SMA Flat Notch package information. Last update. page 12/13 STPS2150 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS3282 - Rev 8 page 13/13