STPS2150_06

STPS2150 Power Schottky rectifier Main product characteristics IF(AV) VRRM Tj (max) VF(max) 2A 150 V 175° C 0.67 V Description 150 V Power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in SMA and Axial, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. SMA (JEDEC DO-214AC) STPS2150A DO-15 STPS2150 Features and benefits ■ ■ ■ ■ ■ Negligible switching losses Low forward voltage drop for higher efficiency and extented battery life Low thermal resistance Surface mount miniature package Avalanche capability specified Order Codes Part Number STPS2150A STPS2150 STPS2150RL Marking 2150 STPS2150 STPS2150 Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj 1. Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward voltage Average forward current Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature(1) thermal runaway condition for a diode on its own heatsink Value 150 15 Unit V A A SMA DO-15 SMA DO-15 TL = 145° C δ = 0.5 TL = 130° C δ = 0.5 tp = 10 ms sinusoidal tp = 1 µs Tj = 25° C 2 75 150 2400 -65 to + 175 175 A W °C °C dPtot 1 --------------- > ------------------------dTj Rth ( j – a ) May 2006 Rev 5 1/7 www.st.com 7 Characteristics STPS2150 1 Table 2. Symbol Rth(j-l) Characteristics Thermal resistance Parameter SMA Junction to lead Lead length = 10 mm DO-15 30 Value 20 ° C/W Unit Table 3. Symbol IR (1) Static electrical characteristics Parameter Reverse leakage current Tests conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ 0.5 0.5 0.78 IF = 2 A 0.62 0.86 IF = 4 A 0.70 Max. 1.5 1.5 0.82 0.67 V 0.89 0.75 Unit µA mA VF (2) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.04 IF2(RMS) Figure 1. Average forward power dissipation versus average forward current δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 Figure 2. Average forward current versus ambient temperature (δ = 0.5) PF(AV)(W) 1.6 1.4 1.2 2.2 2.0 IF(AV)(A) Rth(j-a)=Rth(j-I) SMA 1.8 DO-15 δ=1 1.0 0.8 1.6 1.4 1.2 1.0 Rth(j-a)=100°C/W 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.8 T 0.6 0.4 T IF(AV)(A) δ=tp/T 1.8 2.0 tp 2.2 0.2 0.0 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 175 2/7 STPS2150 Characteristics Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 0.1 0.8 0.6 0.4 0.2 0.001 0.01 0.1 1 PARM(tp) PARM(25°C) 0.01 tp(µs) 10 100 1000 Tj(°C) 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration - maximum values (SMA) Figure 6. Non repetitive surge peak forward current versus overload duration - maximum values (DO-15) IM(A) 10 9 8 7 6 5 4 3 2 1 0 1.E-03 1.E-02 1.E-01 1.E+00 IM IM(A) 10 9 8 7 6 Ta=25°C Ta=25°C 5 4 Ta=75°C Ta=75°C 3 2 IM t Ta=125°C Ta=125°C t δ=0.5 t(s) 1 0 1.E-03 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration - epoxy printed circuit board, eCu = 35 µm, recommended pad layout (SMA) Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-15) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Single pulse δ = 0.2 δ = 0.1 δ = 0.5 Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 δ = 0.5 T 0.3 0.2 δ = 0.2 δ = 0.1 T tp(s) 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 0.1 Single pulse tp(s) 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 0.0 1.E-02 1.E-01 0.0 1.E-01 1.E+00 3/7 Characteristics STPS2150 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C IR(µA) 1.E+04 Tj=150°C 1.E+03 Tj=125°C 1.E+02 Tj=100°C 1.E+01 Tj=75°C Tj=50°C 100 1.E+00 1.E-01 Tj=25°C VR(V) 1.E-02 0 25 50 75 100 125 150 10 1 10 VR(V) 100 1000 Figure 11. Forward voltage drop versus Figure 12. Forward voltage drop versus forward current - maximum values, forward current - maximum values, high level low level IFM(A) 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Tj=125°C (typical values) Tj=25°C (maximum values) Tj=125°C (maximum values) IFM(A) 100 Tj=125°C (maximum values) Tj=125°C (typical values) Tj=25°C (maximum values) 10 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 VFM(V) 1.0 1.2 1.4 1.6 1.8 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead - Epoxy printed circuit board FR4, eCu = 35 µm (SMA) Rth(j-a)(°C/W) 140 120 100 Figure 14. Thermal resistance versus lead length (DO-15) Rth(°C/W) 120 Rth(j-a) 100 80 80 60 60 Rth(j-I) 40 40 20 20 SCu(cm²) 0 0 1 2 3 4 5 0 5 10 Lleads(mm) 15 20 25 4/7 STPS2150 Package information 2 Package information Band shows cathode. Epoxy meets UL94, V0. Table 4. SMA Package dimensions DIMENSIONS E1 REF. Millimeters Min. Max. 2.03 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.080 0.008 0.065 0.016 0.220 0.181 0.116 0.063 D A1 A2 b 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 E c A1 E E1 b C L A2 D L Figure 15. SMA Foot Print Dimensions (in mm) 1.87 1.75 1.87 1.67 5.49 Table 5. C DO-15 Package dimensions DIMENSIONS A C REF. Millimeters Min. Max. 6.75 3.53 31 0.88 Inches Min. Max. A B D B 6.05 2.95 26 0.71 0.238 0.266 0.116 0.139 1.024 1.220 0.028 0.035 C D In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 5/7 Ordering information STPS2150 3 Ordering information Ordering type STPS2150A STPS2150 STPS2150RL Marking 2150 STPS2150 STPS2150 Package SMA DO-15 DO-15 Weight 0.068 g 0.4 g 0.4 g Base qty 5000 2000 5000 Delivery mode Tape and reel Ammopack Tape and reel 4 Revision history Date Jul-2003 Aug-2004 31-May-2006 Revision 3A 4 5 Last update. SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). Reformatted to current standard. Added ECOPACK statement. Updated SMA footprint in Figure 15. Changed nF to pF in Figure 10. Description of Changes 6/7 STPS2150 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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