STPS2545CFP

STPS2545C Power Schottky rectifier Features ■ ■ ■ ■ ■ ■ Very small conduction losses Negligible switching losses Extremely fast switching Low thermal resistance Avalanche capability specified ECOPACK®2 compliant component (STPS2545CT) A1 A2 K K A1 A2 TO-220AB STPS2545CT K Description Dual center tab Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. This device is especially intended for use in low volage, high frequency inverters, free-wheeling and polarity protection applications. A2 K A1 A2 A1 TO-220FPAB STPS2545CFP Table 1. D2PAK STPS2545CG Device summary Symbol IF(AV) VRRM Tj (max) VF(max) Value 2 x 12.5 A 45 V 175 °C 0.57 V June 2010 Doc ID 8736 Rev 3 1/10 www.st.com 10 Characteristics STPS2545C 1 Table 2. Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt 1. Characteristics Absolute ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage Forward rms current Average forward current δ = 0.5 TO-220AB D2PAK TO-220FPAB Tc =160 °C Per diode Tc =140 °C Per device tp = 10 ms sinusoidal tp = 2 µs square F=1 kHz tp = 100 µs square tp = 1 µs Tj = 25 °C Value 45 30 12.5 A 25 200 1 2 4800 -65 to + 175 temperature(1) 175 10000 A A A W °C °C V/µs Unit V A Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction Critical rate of rise reverse voltage 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Symbol Thermal resistances Parameter TO-220AB / D2PAK Per diode TO-220FPAB Value 1.6 4 1.1 3.5 0.6 3 Unit ° C/W ° C/W ° C/W Rth (j-c) Junction to ambient TO-220AB / D2PAK Total TO-220FPAB TO-220AB / D2PAK Rth (c) Coupling TO-220FPAB When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) 2/10 Doc ID 8736 Rev 3 STPS2545C Table 4. Symbol IR (1) Characteristics Static electrical characteristics (per diode) Parameter Tests Conditions Tj = 25 °C Tj = 125 °C Tj = 125 °C VR = VRRM IF = 12.5 A IF = 25 A IF = 25 A 0.65 Min. Typ. Max. 125 9 0.50 25 0.57 0.84 0.72 V Unit µA mA Reverse leakage current VF (1) Forward voltage drop Tj = 25 °C Tj = 125 °C 1. Pulse test : tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.012 x IF2(RMS) Figure 1. PF(AV)(W) 10 9 8 7 6 5 4 3 2 1 0 0.0 2.5 5.0 7.5 10.0 T Conduction losses versus average Figure 2. current) IF(AV)(A) 14 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5) Rth(j-a)=Rth(j-c) TO-220AB/D²PAK 12 δ=1 10 8 6 Rth(j-a)=50°C/W 4 T 2 IF(AV)(A) δ=tp/T 12.5 tp 0 15.0 δ=tp/T 0 25 tp Tamb(°C) 50 75 100 125 150 175 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 PARM(tp) PARM(25°C) 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 Doc ID 8736 Rev 3 3/10 Characteristics STPS2545C Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) TO-220AB, D PAK 2 Figure 6. Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) IM(A) 200 180 160 140 120 100 80 TC=125°C TC=25°C TC=75°C IM(A) 120 100 80 TC=25°C 60 TC=75°C 60 40 20 0 1.E-03 IM t 40 TC=125°C 20 δ=0.5 IM t t(s) 0 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 1.E-02 1.E-01 1.E+00 1.E-03 Figure 7. Relative variation of thermal Figure 8. impedance junction to case versus pulse duration (TO-220AB, D2PAK) 1.0 0.9 0.8 0.7 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c) / Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse δ = 0.2 δ = 0.1 δ = 0.5 Zth(j-c) / Rth(j-c) 0.6 0.5 0.4 0.3 T δ = 0.5 δ = 0.2 δ = 0.1 0.2 0.1 tp T 0.1 0.0 1.E-03 tP(s) 1.E-02 1.E-01 δ=tp/T Single pulse tP(s) 1.E-02 1.E-01 1.E+00 0.0 1.E-03 δ=tp/T 1.E+00 tp 1.E+01 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) Figure 10. Junction capacitance versus reverse voltage applied (typical values) C(nF) 10.0 F=1MHz Vosc=30mV Tj=25°C IR(mA) 1.E+02 Tj=150°C 1.E+01 Tj=125°C 1.E+00 Tj=100°C Tj=75°C 1.0 1.E-01 Tj=50°C 1.E-02 Tj=25°C VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 45 0.1 1 VR(V) 10 100 4/10 Doc ID 8736 Rev 3 STPS2545C Figure 11. Forward voltage drop versus forward current IFM(A) 100 Tj=125°C (Maximum values) Characteristics Figure 12. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 80 epoxy printed board FR4, Cu = 35 µm 70 60 Tj=125°C (Typical values) 50 Tj=25°C (Maximum values) 10 40 30 20 10 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 0 5 10 15 S(cm²) 20 25 30 35 40 Doc ID 8736 Rev 3 5/10 Package information STPS2545C 2 Package information ● ● Epoxy meets UL94, V0 Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. TO-220AB dimensions Dimensions Ref. Millimeters Min. A C H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/10 Doc ID 8736 Rev 3 STPS2545C Table 6. TO-220FPAB dimensions Package information Dimensions Ref. Millimeters Min. A B A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 D E Dia L6 L2 L3 L5 F1 L4 F2 D L7 F F1 F2 G G1 H L2 E 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G L3 L4 L5 L6 L7 Dia. Doc ID 8736 Rev 3 7/10 Package information Table 7. D2PAK dimensions Dimensions Ref. Millimeters Min. A A E L2 C2 STPS2545C Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. Footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 8/10 Doc ID 8736 Rev 3 STPS2545C Ordering information 3 Ordering information Table 8. Ordering information Marking STPS2545CT Package TO-220AB Weight 2.20 g 2.0 g 1.48 g 1.48 g Base qty 50 50 50 1000 Delivery mode Tube Tube Tube Tape and reel Order code STPS2545CT STPS2545CFP STPS2545CG STPS2545CG-TR STPS2545CFP TO-220FPAB STPS2545CG STPS2545CG D PAK D2PAK 2 4 Revision history Table 9. Date July-2003 21-Jun-2010 Document revision history Revision 2A 3 Last release. Updated ECOPACK statement. Changes Doc ID 8736 Rev 3 9/10 STPS2545C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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