STPS2H100AY

STPS2H100-Y Datasheet Automotive 100 V - 2 A power Schottky diode Features • • • AEC-Q101 qualified PPAP capable VRRM guaranteed from -40°C to 175°C • • • Low leakage current Avalanche capability specified ECOPACK2 compliant Applications • • • • DC/DC converter Auxiliary power supply Freewheeling function Reverse battery polarity protection Description This high quality Schottky barrier rectifier device is designed for high frequency miniature switched mode power supplies such as adaptors or on-board DC/DC converters for automotive applications. Packaged in SMB, SMA and SOD128Flat, the STPS2H100-Y provides a high level of performance in compact and flat packages which can withstand high operating junction temperature. Product status link STPS2H100-Y Product summary IF(AV) 2A VRRM 100 V Tj (max.) 175 °C VF (typ.) 0.60 V DS6949 - Rev 2 - February 2021 For further information contact your local STMicroelectronics sales office. www.st.com STPS2H100-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol VRRM IF(AV) Parameter Repetitive peak reverse voltage (Tj = -40°C to + 175°C) Average forward current, δ = 0.5 square wave TL = 135 °C SMB TL = 130 °C SMA TL = 150 °C SOD128Flat IFSM Surge non repetitive forward current tp = 10 ms sinusoidal PARM Repetitive peak avalanche power tp = 10 μs, Tj = 125°C Tstg Operating junction temperature Unit 100 V 2 A SMA, SMB 75 SOD128Flat 55 Storage temperature range Tj Value range(1) A 173 W -65 to +175 °C -40 to +175 °C 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMA 30 SMB 25 SOD128Flat 16 Unit °C/W For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 2 A IF = 4 A Min. Typ. - 0.4 - Unit 1 µA 1 mA 0.79 0.60 - Max. 0.65 0.88 0.69 V 0.74 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.56 x IF(AV) + 0.045 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS6949 - Rev 2 page 2/13 STPS2H100-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward current versus lead temperature (δ = 0.5) Figure 2. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) I F(AV)(A) 1.0 9 Zth(j-a) / Rth(j-a) SMA 0.9 8 7 0.8 SMA SMB 6 0.7 SOD128Flat 0.6 5 0.5 4 0.4 3 0.3 T 0.2 2 1 tp =tp/T 25 tp(s) 0.0 0 0 Single pulse 0.1 TL(°C) 50 75 100 125 150 175 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 3. Relative variation of thermal impedance junction Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) to lead versus pulse duration (SOD128Flat) Zth(j-a) / Rth(j-a) 1.0 1.0 0.9 SMB SOD128Flat 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Zth(j-l) / Rth(j-l) Single pulse 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 Single pulse 0.1 tp(s) 1.E+03 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 0.0 1.E-04 1.E-03 tp(s) 1.E-02 1.E-01 1.E+00 1.E+01 Figure 6. Junction capacitance versus reverse voltage applied (typical values) IR(µA) C(pF) 1.E+04 1000 1.E+03 F = 1 MHz Vosc= 30 mV RMS Tj = 25 °C Tj = 150 °C Tj = 125 °C 1.E+02 Tj = 100 °C 1.E+01 100 Tj = 75 °C 1.E+00 Tj = 50 °C 1.E-01 Tj = 25 °C VR(V) 1.E-02 0 DS6949 - Rev 2 10 20 30 40 50 60 70 80 90 100 VR(V) 10 1 10 100 page 3/13 STPS2H100-Y Characteristics (curves) Figure 7. Forward voltage drop versus forward current (typical values) Figure 8. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) IF(A) 10.0 PARM (t p ) PARM (10 µs) 1 Tj = 25 °C Tj = 75 °C Tj = 125 °C 0.1 Tj = 150 °C 1.0 0.01 Tj = -40 °C t p(µs) VF(V) 0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.001 1.0 1 Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMA, typical values) 10 100 1000 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMB, typical values) Rth(j-a)(°C/W) Rth(j-a)(°C/W) 150 200 Epoxy printed circuit board, copper thickness = 70 µm Epoxy printed circuit board, copper thickness = 70 µm SMA SMB 120 150 90 100 60 50 30 SCU(cm²) SCU(cm²) 0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.0 5.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SOD128Flat, typical values) 150 Rth(j-a)(°C/W) SOD128flat Epoxy printed board FR4, copper thickness: 70 μm 120 90 60 30 SCu (cm²) 0 0.0 DS6949 - Rev 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/13 STPS2H100-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 12. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Millimeters Ref. DS6949 - Rev 2 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 5/13 STPS2H100-Y SMA package information Figure 13. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS6949 - Rev 2 page 6/13 STPS2H100-Y SMB package information 2.2 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 14. SMB package outline E1 D E A1 C A2 L b Table 5. SMB package mechanical data Dimensions Millimeters Ref. DS6949 - Rev 2 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 page 7/13 STPS2H100-Y SMB package information Figure 15. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS6949 - Rev 2 page 8/13 STPS2H100-Y SOD128Flat package information 2.3 SOD128Flat package information • Lead-free package Figure 16. SOD128Flat package outline DS6949 - Rev 2 page 9/13 STPS2H100-Y SOD128Flat package information Table 6. SOD128Flat package mechanical data Dimensions Millimeters Ref. Inches Min. Max. Min. Max. A 0.93 1.03 0.037 0.041 b 1.69 1.81 0.067 0.071 c 0.10 0.22 0.004 0.009 D 2.30 2.50 0.091 0.098 E 4.60 4.80 0.181 0.189 E1 3.70 3.90 0.146 0.154 L 0.55 0.85 0.026 0.033 L1 0.30 typ. 0.012 typ. L2 0.45 typ. 0.018 typ. Figure 17. SOD128Flat footprint in mm (inches) Note: DS6949 - Rev 2 For package and tape orientation, reel and inner box dimensions and tape outline please check TN1173 page 10/13 STPS2H100-Y Ordering Information 3 Ordering information Table 7. Ordering information DS6949 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode STPS2H100AY S21Y SMA 68 mg 5000 Tape and reel STPS2H100UY G21Y SMB 107 mg 2500 Tape and reel STPS2H100AFY 2H100Y SOD128Flat 26.4 mg 3000 Tape and reel page 11/13 STPS2H100-Y Revision history Table 8. Document revision history DS6949 - Rev 2 Date Version Changes 10-Dec-2010 1 Initial release. 11-Feb-2021 2 Added SOD128Flat package information. Minor text changes. page 12/13 STPS2H100-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS6949 - Rev 2 page 13/13