STPS2H100ZF

STPS2H100ZF Power Schottky rectifier Datasheet - production data Description Single chip Schottky rectifiers suited to surface mounting and especially intended for use in high frequency converters, free-wheeling and reverse polarity protection.. A K Table 1: Device summary A K SOD123Flat Symbol Value IF(AV) 2A VRRM 100 V VF (typ.) 0.60 V Tj (max.) 175 °C Features      High junction temperature capability Low leakage current Negligible switching losses Avalanche capability specified ECOPACK®2 compliant component August 2016 DocID029645 Rev 1 This is information on a product in full production. 1/8 www.st.com Characteristics 1 STPS2H100ZF Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol VRRM Parameter Value Unit Repetitive peak reverse voltage 100 V 2 A IF(AV) Average forward current TL = 140 °C/ δ = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 105 W Tstg Storage temperature range Tj Maximum operating junction -65 to +175 temperature(1) °C -40 to +175 Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Rth(j-l) Parameter Max. value Unit 20 °C/W Junction to lead Table 4: Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 2 A IF = 4 A Typ. - 0.2 - Unit 1 µA 0.5 mA 0.86 0.65 - Max. 0.70 0.96 0.75 0.83 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.57 x IF(AV) + 0.065 x IF2(RMS) For more information, please refer to the following application notes related to the power losses.   2/8 AN604 (Calculation of conduction losses in a power rectifier) AN4021 (Calculation of reverse losses in a power diode) DocID029645 Rev 1 V STPS2H100ZF 1.1 Characteristics Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current Figure 2: Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 7 2.0 PF(AV) (W) Rth(j-a) = Rth(j-l) 6 1.8 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ= 1 1.6 5 1.4 1.2 4 1.0 3 0.8 0.6 2 T 0.4 T 0.2 IF(AV) (A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 δ = tp/T 1.8 2.0 1 tp 2.2 2.4 1 PARM (t p ) PARM (10 µs) tp 0 0 Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C) Tamb(°C) δ = tp/T 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to lead versus pulse duration Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 Single pulse t p (µs) 0.1 0.001 1 10 100 Figure 5: Reverse leakage current versus reverse voltage applied (typical values) 1.E+03 tp(s) 0.0 1.E-04 1000 IR(µA) 1.E-03 1.E-02 1.E-01 1.E+01 Figure 6: Junction capacitance versus reverse voltage applied (typical values) 100 C(pF) Tj = 150 °C 1.E+02 1.E+00 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 125 °C Tj = 100 °C 1.E+01 Tj = 75 °C 1.E+00 Tj = 50 °C 1.E-01 Tj = 25 °C 1.E-02 VR(V) VR(V) 1.E-03 10 0 10 20 30 40 50 60 70 80 90 100 DocID029645 Rev 1 1 10 100 3/8 Characteristics STPS2H100ZF Figure 7: Forward voltage drop versus forward current (typical values) 10.00 Figure 8: Thermal resistance junction to ambient versus copper surface under each lead (typical values) IF(A) 250 Rth(j-a)(C/W) SOD123Flat 200 Tj = 75 °C 1.00 150 Tj = 25 °C Tj = 125 °C 100 Epoxy printed board FR4, eCu = 35 µm 0.10 50 SCu (cm²) 0 VF(V) 0.01 0.0 4/8 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 1.1 DocID029645 Rev 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Package information STPS2H100ZF 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Epoxy meets UL94, V0 Cooling method: by conduction (C) SOD123Flat package information Figure 9: SOD123Flat package outline A C1 L HD D L b C E DocID029645 Rev 1 5/8 Package information STPS2H100ZF Table 5: SOD123Flat package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. A 0.86 0.98 1.10 b 0.80 0.90 1.00 c 0.08 0.15 0.25 c1 0.00 D 2.50 2.60 2.70 E 1.50 1.60 1.80 HD 3.30 3.50 3.70 L 0.45 0.65 0.85 0.10 Figure 10: SOD123Flat footprint dimensions (mm) 1.60 1.40 1.30 6/8 DocID029645 Rev 1 Ordering information STPS2H100ZF 3 Ordering information Table 6: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STPS2H100ZF 2H1 SOD123Flat 12.5 mg 3000 Tape and reel Revision history Table 7: Document revision history Date Revision 19-Aug-2016 1 Changes Initial release. DocID029645 Rev 1 7/8 STPS2H100ZF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 8/8 DocID029645 Rev 1