STPS2L25UF

STPS2L25 Low drop power Schottky rectifier Main product characteristics A IF(AV) VRRM Tj (max) VF(max) 2A 25 V 150° C 0.375 V K SMB STPS2L25U Features and benefits ■ ■ Very low forward voltage drop for less power dissipation Optimized conduction/reverse losses trade-off which means the highest efficiency in the applications Avalanche capability specified A ■ K SMB flat STPS2L25UF Description Single Schottky rectifier suited to switched mode power supplies and high frequency DC to DC converters. Packaged in SMB, SMB flat for thermal resistance characteristic improvement, this device is especially intended for use in parallel with MOSFETs in synchronous rectification. Table 1. Symbol VRRM IF(AV) IFSM PARM Tstg Tj 1. d Ptot --------------dTj Absolute ratings (limiting values) Parameter Repetitive peak reverse voltage Average forward current SMB SMB flat TL = 125° C δ = 0.5 TL = 135° C δ = 0.5 tp = 10 ms sinusoidal tp = 1 µs Tj = 25° C Value 25 2 75 1500 -65 to + 150 150 Unit V A A W °C °C Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature(1) 1 ------------------------Rth ( j – a ) < condition to avoid thermal runaway for a diode on its own heatsink February 2007 Rev 5 1/9 www.st.com 9 Characteristics STPS2L25 1 Table 2. Symbol Rth(j-l) Characteristics Thermal resistance Parameter SMB Junction to lead SMB flat 15 Value 25 °C/W Unit Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Tj = 25° C Min. Typ. Max. 90 Unit µA mA VR = VRRM 15 30 0.45 VF(1) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C IF = 2 A 0.325 0.375 V 0.53 IF = 4 A 0.43 0.51 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the maximum conduction losses, use the following equation: P = 0.24 x IF(AV) + 0.068 IF2(RMS) 2/9 STPS2L25 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) 2.2 Average forward current versus ambient temperature (δ = 0.5) SMB PF(AV)(W) 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 1.0 0.8 0.6 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) SMB 2.0 1.8 1.6 Rth(j-a)=100°C/W δ=1 1.4 1.2 T 0.4 T IF(AV)(A) δ=tp/T 2.0 2.2 0.2 tp 0.0 2.4 2.6 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 Figure 3. Average forward current versus ambient temperature (δ = 0.5) SMB flat Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) SMB IF(AV)(A) 2.2 Rth(j-a)=Rth(j-l) IM(A) 10 SMB 2.0 1.8 1.6 Rth(j-a)=100°C/W SMB flat 9 8 7 6 Ta=25°C 1.4 1.2 5 1.0 0.8 0.6 0.4 0.2 0.0 0 4 3 Ta=75°C T Ta=125°C 2 IM t δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 1 0 1.E-03 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat Figure 6. Normalized avalanche power derating versus pulse duration IM(A) 30 SMB flat PARM(tp) PARM(1µs) 1 25 20 0.1 TL=25°C 15 TL=75°C 10 TL=125°C 0.01 IM t 5 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 0.001 0.01 0.1 1 tp(µs) 10 100 1000 0 1.E-03 3/9 Characteristics STPS2L25 Figure 7. Normalized avalanche power derating versus junction temperature Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - SMB PARM(tp) PARM(25°C) 1.2 1 Zth(j-a)/Rth(j-a) 1.0 SMB 0.9 0.8 0.7 0.8 0.6 0.4 0.2 0.6 0.5 0.4 0.3 0.2 T Single pulse Tj(°C) 0 25 50 75 100 125 150 0.1 0.0 tp(s) 1.E-01 1.E+00 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 1.E-02 Figure 9. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Figure 10. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) 1.E+02 Tj=150°C Zth(j-l)/Rth(j-l) 1.0 SMB flat 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 Single pulse 1.E+01 Tj=125°C Tj=100°C 1.E+00 1.E-01 1.E-02 Tj=25°C tp(s) 1.E-03 0 5 10 VR(V) 15 20 25 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Figure 12. Forward voltage drop versus forward current (typical values) IFM(A) 10.0 Tj=125°C Tj=150°C Tj=25°C 100 1.0 VR(V) 10 1 10 100 0.1 0.0 0.1 0.2 0.3 VFM(V) 0.4 0.5 0.6 4/9 STPS2L25 Characteristics Figure 13. Forward voltage drop versus forward current (maximum values, high level) 10.0 Figure 14. Forward voltage drop versus forward current (maximum values, low level) 3.0 IFM(A) IFM(A) 2.5 Tj=125 °C (maximum values) 2.0 Tj=125 °C (maximum values) 1.0 Tj=125 °C (typical values) 1.5 Tj=125 °C (typical values) Tj=25 °C (maximum values) Tj=25 °C (maximum values) 1.0 0.5 VFM(V) 0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 VFM(V) 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35µm) Rth(j-a)(°C/W) 110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMB flat SMB SCU(Cm²) 5/9 Package information STPS2L25 2 Package information ● Epoxy meets UL94, V0 SMB dimensions Dimensions Ref. E1 Table 4. Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L Figure 16. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 6/9 STPS2L25 Table 5. SMB Flat dimensions Package information Dimensions Ref. A c D L L2 E E1 L L1 b Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029 Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024 A b(1) c (1) 0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60 1.10 2.20 0.40 3.95 5.60 4.60 1.50 D E E1 L L1 L2 1. Applies to plated leads Figure 17. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 7/9 Ordering information STPS2L25 3 Ordering information Ordering type STPS2L25U STPS2L25UF Marking G23 FG23 Package SMB SMB flat Weight 0.107 g 0.50 g Base qty 2500 5000 Delivery mode Tape and reel Tape and reel 4 Revision history Date July 2003 08-Feb-2007 Revision 4A 5 Last update Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Changes 8/9 STPS2L25 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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