STPS2L30
Datasheet
30 V, 2 A low drop power Schottky rectifier
Features
•
•
•
•
•
Low forward voltage drop for less power dissipation
Optimized conduction/reverse losses trade-off which lead to the highest
efficiency in the applications
Surface mount miniature package
Avalanche rated
ECOPACK2 component
Applications
•
•
•
•
•
Cordless appliance
SSD
Battery charger
Telecom power
DC / DC converter
Description
Single chip Schottky rectifiers designed for high frequency miniature switched mode
power supplies such as adaptors and on board DC/DC converters.
Packaged in SMA, SMA Flat, SMA Flat Notch and SMB Flat, the STPS2L30 is ideal
for use in parallel with MOSFETs in synchronous rectification.
Product status
STPS2L30
Product summary
Symbol
Value
IF(AV)
2A
VRRM
30 V
T j(max.)
150 °C
VF(typ.)
0.325 V
DS1526 - Rev 8 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS2L30
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter
VRRM
Repetitive peak reverse voltage
IF(AV)
Average forward current, δ = 0.5, square
wave
Value
Unit
30
V
2
A
TL = 120 °C
SMA
SMA Flat, SMA Flat Notch TL = 130 °C
TL = 135 °C
SMB Flat
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
75
A
PARM
Repetitive peak avalanche power
tp = 10 µs, Tj = 125 °C
108
W
-65 to +150
°C
+150
°C
Tstg
Tj
Storage temperature range
Maximum operating junction
temperature(1)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol
Rth(j-l)
Parameter
Junction to lead
Max. value
SMA
30
SMA Flat, SMA Flat Notch
20
SMB Flat
15
Unit
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 100 °C
Tj = 25 °C
VF(1)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 2 A
IF = 4 A
Min.
Typ.
-
6
-
Unit
200
µA
15
mA
0.45
0.325
-
Max.
0.375
0.53
0.43
V
0.51
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.24 x IF(AV) + 0.068 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
DS1526 - Rev 8
page 2/16
STPS2L30
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
1.2
IF(AV)(A)
PF(AV)(W)
2.2
δ = 0.1
1.1
1.0
δ = 0.2
Rth(j-a)=Rth(j-l)
2.0
δ = 0.5
SMA
1.8
δ = 0.05
0.9
1.6
0.8
Rth(j-a)=120°C/W
1.4
δ=1
0.7
1.2
0.6
1.0
0.5
0.8
0.4
0.6
0.3
T
0.2
IF(AV)(A)
0.1
δ=tp/T
0.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
tp
2.4
0
2.6
IF(AV)(A)
Tamb (°C)
tp
δ =tp/T
0.0
Figure 3. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat)
25
50
75
100
125
150
Figure 4. Average forward current versus ambient
temperature (δ = 0.5, SMA Flat, SMA Flat Notch)
2.2
IF(AV)(A)
SMB Flat
Rth(j-a)=Rth(j-l)
2.0
T
0.4
0.2
2.2
Figure 2. Average forward current versus ambient
temperature (δ = 0.5) SMA
SMA Flat
SMA Flat Notch
Rth(j-a)=Rth(j-l)
2.0
1.8
1.8
1.6
1.6
Rth(j-a)=120°C/W
1.4
1.4
1.2
1.2
1.0
1.0
0.8
0.8
0.6
0.2
Tamb (°C)
tp
δ=tp/T
DS1526 - Rev 8
25
50
75
100
125
150
0
Tamb (°C)
tp
δ=tp/T
0.0
0.0
0
T
0.4
0.4
0.2
Rth(j-a)=200°C/W
0.6
T
25
50
75
100
125
150
page 3/16
STPS2L30
Characteristics (curves)
Figure 5. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
PARM (t p )
PARM (10 µs)
Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
Zth(j-a)/ Rth(j-a)
1.0
1
SMA
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.3
0.01
0.2
Single pulse
0.1
0.001
t p(µs)
1
10
100
1.0
SMB Flat
1.E+01
1.E+02
1.E+03
Zth(j-a)/ Rth(j-a)
SMA Flat / SMA Flat Notch
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
Single pulse
0.0
1.E-04
Single pulse
0.2
0.1
t p (s)
1.E-03
1.E-02
0.1
1.E-01
1.E+00
1.E+01
Figure 9. Reverse leakage current versus reverse voltage
applied (typical values)
1.E+02
1.E+00
Figure 8. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA Flat, SMA Flat
Notch)
Zth(j-l) / Rth(j-l)
0.9
1.E-01
1000
Figure 7. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB Flat)
1.0
t p (s)
0.0
1.E-02
0.0
1.E-02
t p (s)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 10. Junction capacitance versus reverse voltage
applied (maximum values)
C(pF)
IR(mA)
1000
Tj = 150 °C
F=1MHz
VOSC=30mVRMS
Tj=25°C
Tj = 125 °C
1.E+01
Tj = 100 °C
1.E+00
100
1.E-01
Tj = 25 °C
1.E-02
V R (V)
VR(V)
10
1.E-03
0
DS1526 - Rev 8
5
10
15
20
25
30
1
10
100
page 4/16
STPS2L30
Characteristics (curves)
Figure 11. Forward voltage drop versus forward current
(high level)
10.0
Figure 12. Forward voltage drop versus forward current
(low level)
IF(A)
IF(A)
3.0
2.5
Tj=125°C
(Maximum
(maximum values)
1.0
2.0
Tj=25°C
(maximum values)
Tj=125°C
(typical values)
Tj=125°C
(maximum values)
(Maximum
Tj=125°C
(typical values)
1.5
Tj=25°C
(maximum values)
1.0
0.5
VF(V)
VF(V)
0.1
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.0
0.7
0.0
Figure 13. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
0.1
0.2
0.3
0.4
0.5
0.6
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat, SMA Flat
Notch)
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
200
SMA
150
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat
SMA Flat Notch
150
100
100
50
50
S(Cu)(cm²)
S(Cu)(cm²)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat)
200
Rth(j-a) (°C/W)
SMB flat
Epoxy printed circuit board FR4, eCu = 35 µm
150
100
50
SCu (cm²)
0
0.0
DS1526 - Rev 8
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 5/16
STPS2L30
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMA package information
•
•
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 16. SMA package outline
E1
D
E
A1
C
A2
L
b
Table 4. SMA package mechanical data
Dimensions
Ref.
A1
DS1526 - Rev 8
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
4.80
5.35
0.188
0.211
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
page 6/16
STPS2L30
SMA package information
Figure 17. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.104)
(0.055)
1.64
(0.065)
5.43
(0.214)
DS1526 - Rev 8
page 7/16
STPS2L30
SMA Flat package information
2.2
SMA Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 18. SMA Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L
L2 2 x
b
2x
Table 5. SMA Flat package mechanical data
Dimensions
Ref.
Millimeters
Min.
DS1526 - Rev 8
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.044
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.95
0.088
0.117
E
4.80
5.60
0.188
0.221
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
L1
0.50
0.020
L2
0.50
0.020
page 8/16
STPS2L30
SMA Flat package information
Figure 19. SMA Flat recommended footprint in mm (inches)
5.52
(0.217)
1.52
(0.060)
1.20
(0.047)
3.12
(0.123)
1.20
(0.047)
millimeter s
(inches)
DS1526 - Rev 8
page 9/16
STPS2L30
SMA Flat Notch package information
2.3
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 20. SMA Flat Notch package outline
Table 6. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Min.
A1
0.90
A1
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.044
0.002
b
1.25
1.65
0.049
0.065
C
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
DS1526 - Rev 8
Typ.
Inches (for reference only)
0.75
1.20
0.029
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
page 10/16
STPS2L30
SMA Flat Notch package information
Figure 21. SMA Flat Notch recommended footprint in mm (inches)
1.20
(0.047)
3.12
1.20
(0.123)
(0.047)
1.52
(0.060)
5.52
(0.217)
DS1526 - Rev 8
page 11/16
STPS2L30
SMB Flat package information
2.4
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 22. SMB Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L2 2 x
b
Table 7. SMB Flat mechanical data
Dimensions
Ref.
Millimeters
Min.
DS1526 - Rev 8
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
L1
0.40
0.016
L2
0.60
0.024
page 12/16
STPS2L30
SMB Flat package information
Figure 23. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS1526 - Rev 8
page 13/16
STPS2L30
Ordering Information
3
Ordering information
Table 8. Ordering information
DS1526 - Rev 8
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS2L30A
G30
SMA
0.068 g
5000
Tape and reel
STPS2L30UF
FG30
SMB Flat
0.050 g
5000
Tape and reel
STPS2L30AFN
A23
SMA Flat Notch
0.039 g
10 000
Tape and reel
STPS2L30AF
F30
SMA Flat
0.035 g
10000
Tape and reel
page 14/16
STPS2L30
Revision history
Table 9. Document revision history
DS1526 - Rev 8
Date
Version
Changes
Jul-2003
3A
Aug-2004
4
SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm
(0.080).
31-Jan-2007
5
Reformatted to current standard. Added ECOPACK statement. Added SMB flat package.
23-Apr-2008
6
Reformatted to current standards. Added SMA flat package.
30-Nov-2018
7
Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and
Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C).
26-Sep-2019
8
Added Section 2.3 SMA Flat Notch package information.
Last update.
page 15/16
STPS2L30
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DS1526 - Rev 8
page 16/16
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