STPS2L30UF

STPS2L30 Datasheet 30 V, 2 A low drop power Schottky rectifier Features • • • • • Low forward voltage drop for less power dissipation Optimized conduction/reverse losses trade-off which lead to the highest efficiency in the applications Surface mount miniature package Avalanche rated ECOPACK2 component Applications • • • • • Cordless appliance SSD Battery charger Telecom power DC / DC converter Description Single chip Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA, SMA Flat, SMA Flat Notch and SMB Flat, the STPS2L30 is ideal for use in parallel with MOSFETs in synchronous rectification. Product status STPS2L30 Product summary Symbol Value IF(AV) 2A VRRM 30 V T j(max.) 150 °C VF(typ.) 0.325 V DS1526 - Rev 8 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS2L30 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current, δ = 0.5, square wave Value Unit 30 V 2 A TL = 120 °C SMA SMA Flat, SMA Flat Notch TL = 130 °C TL = 135 °C SMB Flat IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 75 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 108 W -65 to +150 °C +150 °C Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMA 30 SMA Flat, SMA Flat Notch 20 SMB Flat 15 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 100 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 2 A IF = 4 A Min. Typ. - 6 - Unit 200 µA 15 mA 0.45 0.325 - Max. 0.375 0.53 0.43 V 0.51 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.24 x IF(AV) + 0.068 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS1526 - Rev 8 page 2/16 STPS2L30 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 1.2 IF(AV)(A) PF(AV)(W) 2.2 δ = 0.1 1.1 1.0 δ = 0.2 Rth(j-a)=Rth(j-l) 2.0 δ = 0.5 SMA 1.8 δ = 0.05 0.9 1.6 0.8 Rth(j-a)=120°C/W 1.4 δ=1 0.7 1.2 0.6 1.0 0.5 0.8 0.4 0.6 0.3 T 0.2 IF(AV)(A) 0.1 δ=tp/T 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 tp 2.4 0 2.6 IF(AV)(A) Tamb (°C) tp δ =tp/T 0.0 Figure 3. Average forward current versus ambient temperature (δ = 0.5, SMB Flat) 25 50 75 100 125 150 Figure 4. Average forward current versus ambient temperature (δ = 0.5, SMA Flat, SMA Flat Notch) 2.2 IF(AV)(A) SMB Flat Rth(j-a)=Rth(j-l) 2.0 T 0.4 0.2 2.2 Figure 2. Average forward current versus ambient temperature (δ = 0.5) SMA SMA Flat SMA Flat Notch Rth(j-a)=Rth(j-l) 2.0 1.8 1.8 1.6 1.6 Rth(j-a)=120°C/W 1.4 1.4 1.2 1.2 1.0 1.0 0.8 0.8 0.6 0.2 Tamb (°C) tp δ=tp/T DS1526 - Rev 8 25 50 75 100 125 150 0 Tamb (°C) tp δ=tp/T 0.0 0.0 0 T 0.4 0.4 0.2 Rth(j-a)=200°C/W 0.6 T 25 50 75 100 125 150 page 3/16 STPS2L30 Characteristics (curves) Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) Zth(j-a)/ Rth(j-a) 1.0 1 SMA 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 Single pulse 0.1 0.001 t p(µs) 1 10 100 1.0 SMB Flat 1.E+01 1.E+02 1.E+03 Zth(j-a)/ Rth(j-a) SMA Flat / SMA Flat Notch 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 Single pulse 0.0 1.E-04 Single pulse 0.2 0.1 t p (s) 1.E-03 1.E-02 0.1 1.E-01 1.E+00 1.E+01 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 1.E+00 Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA Flat, SMA Flat Notch) Zth(j-l) / Rth(j-l) 0.9 1.E-01 1000 Figure 7. Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat) 1.0 t p (s) 0.0 1.E-02 0.0 1.E-02 t p (s) 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Figure 10. Junction capacitance versus reverse voltage applied (maximum values) C(pF) IR(mA) 1000 Tj = 150 °C F=1MHz VOSC=30mVRMS Tj=25°C Tj = 125 °C 1.E+01 Tj = 100 °C 1.E+00 100 1.E-01 Tj = 25 °C 1.E-02 V R (V) VR(V) 10 1.E-03 0 DS1526 - Rev 8 5 10 15 20 25 30 1 10 100 page 4/16 STPS2L30 Characteristics (curves) Figure 11. Forward voltage drop versus forward current (high level) 10.0 Figure 12. Forward voltage drop versus forward current (low level) IF(A) IF(A) 3.0 2.5 Tj=125°C (Maximum (maximum values) 1.0 2.0 Tj=25°C (maximum values) Tj=125°C (typical values) Tj=125°C (maximum values) (Maximum Tj=125°C (typical values) 1.5 Tj=25°C (maximum values) 1.0 0.5 VF(V) VF(V) 0.1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.0 0.7 0.0 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMA) 0.1 0.2 0.3 0.4 0.5 0.6 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat, SMA Flat Notch) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm 200 SMA 150 Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat SMA Flat Notch 150 100 100 50 50 S(Cu)(cm²) S(Cu)(cm²) 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat) 200 Rth(j-a) (°C/W) SMB flat Epoxy printed circuit board FR4, eCu = 35 µm 150 100 50 SCu (cm²) 0 0.0 DS1526 - Rev 8 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/16 STPS2L30 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 16. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Ref. A1 DS1526 - Rev 8 Millimeters Inches (for reference only) Min. Max. Min. Max. 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 6/16 STPS2L30 SMA package information Figure 17. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS1526 - Rev 8 page 7/16 STPS2L30 SMA Flat package information 2.2 SMA Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 18. SMA Flat package outline A c D L 2x L1 2 x E E1 L L2 2 x b 2x Table 5. SMA Flat package mechanical data Dimensions Ref. Millimeters Min. DS1526 - Rev 8 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.95 0.088 0.117 E 4.80 5.60 0.188 0.221 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 L1 0.50 0.020 L2 0.50 0.020 page 8/16 STPS2L30 SMA Flat package information Figure 19. SMA Flat recommended footprint in mm (inches) 5.52 (0.217) 1.52 (0.060) 1.20 (0.047) 3.12 (0.123) 1.20 (0.047) millimeter s (inches) DS1526 - Rev 8 page 9/16 STPS2L30 SMA Flat Notch package information 2.3 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 20. SMA Flat Notch package outline Table 6. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS1526 - Rev 8 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 10/16 STPS2L30 SMA Flat Notch package information Figure 21. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS1526 - Rev 8 page 11/16 STPS2L30 SMB Flat package information 2.4 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 22. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 7. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS1526 - Rev 8 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 L1 0.40 0.016 L2 0.60 0.024 page 12/16 STPS2L30 SMB Flat package information Figure 23. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS1526 - Rev 8 page 13/16 STPS2L30 Ordering Information 3 Ordering information Table 8. Ordering information DS1526 - Rev 8 Order code Marking Package Weight Base qty. Delivery mode STPS2L30A G30 SMA 0.068 g 5000 Tape and reel STPS2L30UF FG30 SMB Flat 0.050 g 5000 Tape and reel STPS2L30AFN A23 SMA Flat Notch 0.039 g 10 000 Tape and reel STPS2L30AF F30 SMA Flat 0.035 g 10000 Tape and reel page 14/16 STPS2L30 Revision history Table 9. Document revision history DS1526 - Rev 8 Date Version Changes Jul-2003 3A Aug-2004 4 SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). 31-Jan-2007 5 Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. 23-Apr-2008 6 Reformatted to current standards. Added SMA flat package. 30-Nov-2018 7 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) and Figure 5. Normalized avalanche power derating versus pulse duration (Tj = 125 °C). 26-Sep-2019 8 Added Section 2.3 SMA Flat Notch package information. Last update. page 15/16 STPS2L30 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS1526 - Rev 8 page 16/16