STPS2L60
Datasheet
60 V, 2 A low drop power Schottky rectifier
Features
•
•
•
•
•
Negligible switching losses
Low forward voltage drop for higher efficiency and extended battery life
Surface mount miniature package
Avalanche rated
ECOPACK2 compliant component
Applications
•
•
•
•
•
Lighting
Desktop power supply
Battery charger
Set top box
Auxiliary power
Description
This 60 V power Schottky rectifier is ideal for switch mode power supplies and high
frequency converters.
Packaged in SMA, SMA Flat Notch, axial and SMB Flat, the STPS2L60 is optimized
for use in low voltage, high frequency inverters and small battery chargers.
Product status
STPS2L60
Product summary
Symbol
Values
IF(AV)
2A
VRRM
60 V
Tj (max.)
150 °C
VF(typ.)
0.51 V
DS2976 - Rev 8 - September 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS2L60
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
Forward rms current
10
A
2
A
IF(AV)
IFSM
Average forward current δ
= 0.5, square wave
Surge non repetitive
forward current
PARM
Repetitive peak avalanche
power
Tstg
Storage temperature range
Tj
SMB Flat
TL = 130 °C
SMA
TL = 115 °C
SMA Flat Notch
TL = 120 °C
DO-41
TL = 110 °C
SMB Flat, SMA,
DO-41
tp = 10 ms sinusoidal
75
A
SMA Flat Notch
105
tp = 10 µs, Tj= 125 °C
115
W
-65 to + 150
°C
+ 150
°C
Max. value
Unit
Maximum operating junction temperature (1)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol
Rth(j-l)
Parameter
Junction to lead
Junction to lead
Lead length = 10 mm
SMB Flat
15
SMA
25
SMA Flat Notch
20
DO-41
30
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR(1)
Parameter
Reverse leakage
current
Test conditions
Tj = 25 °C
Tj = 100 °C
Tj = 25 °C
VF(1)
Forward voltage
drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 2 A
IF = 4 A
Min.
Typ.
-
2
-
Unit
100
µA
10
mA
0.60
0.51
-
Max.
0.55
0.77
0.62
V
0.67
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation: P = 0.43 x IF(AV) + 0.06 IF2(RMS)
DS2976 - Rev 8
page 2/15
STPS2L60
Characteristics (curves)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
IF(AV)(A)
PF(AV)(W)
2.2
δ = 0.1
δ = 0.2
δ = 0.5
Rth(j-a)=Rth(j-l)
2.0
SMA
1.8
δ = 0.05
DO-41
1.6
δ=1
Rth(j-a)=100°C/W
1.4
1.2
1.0
0.8
0.6
T
0.2
0.4
0.6
0.8
1.0
1.2
1.4
T
0.4
0.2
IF(AV)(A)
0.0
δ=tp/T
1.6
1.8
2.0
tp
2.2
2.4
0
25
Rth(j-a)=Rth(j-l)
50
75
100
125
150
Figure 4. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
IF(AV)(A)
2.0
Tamb (°C)
tp
δ=tp/T
0.0
Figure 3. Average forward current versus ambient
temperature (δ = 0.5, SMB Flat)
2.2
Figure 2. Average forward current versus ambient
temperature (δ = 0.5, DO-41, SMA)
1
PARM (t p )
PARM (10 µs)
1.8
SMB Flat
SMBflat
1.6
1.4
0.1
1.2
SMBflat
SMB Flat
Rth(j-a)=40 °C/W
Scu=2.5 cm²
1.0
0.8
0.01
T
0.6
0.4
0.2
δ=tp/T
tp
t p(µs)
Tamb (°C)
0.001
0.0
0
DS2976 - Rev 8
25
50
75
100
125
150
1
10
100
1000
page 3/15
STPS2L60
Characteristics (curves)
Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMA)
to ambient versus pulse duration (DO-41)
Zth(j-a)/ Rth(j-a)
Zth(j-a)/ Rth(j-a)
1.0
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
0.1
Single pulse
Single pulse
0.1
t p (s)
t p (s)
0.0
0.0
1.E-02
1.E-01
1.E+00
1.E+01
1.E-01
1.E+02
Figure 7. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB Flat)
1.E+01
1.E+02
1.E+03
Figure 8. Junction capacitance versus reverse voltage
applied (typical values)
Zth(j-l) /Rth(j-l)
1.0
1.E+00
C(pF)
1000
epoxy printed circuit board FR4, copper thickness:35 µm
F=1MHz
VOSC=30mVRMS
Tj=25°C
0.9
0.8
0.7
0.6
0.5
100
0.4
0.3
0.2
0.1
Single pulse
t p (s)
0.0
1.E-04
1.E-03
V R (V)
10
1.E-02
1.E-01
1
1.E+00
Figure 9. Reverse leakage current versus reverse voltage
applied (typical values)
10
100
Figure 10. Forward voltage drop versus forward current
IF (A)
IR(µA)
10
1.E+05
9
Tj=150°C
1.E+04
Tj=125°C
(maximum values)
(Maximum
8
Tj=125°C
7
Tj=100°C
6
1.E+03
Tj=25°C
(maximum values)
Tj=125°C
(typical values)
5
Tj=75°C
4
1.E+02
Tj=50°C
1.E+01
Tj=25°C
3
2
1
VR(V)
VF (V)
0
1.E+00
0.0
0
DS2976 - Rev 8
10
20
30
40
50
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
60
page 4/15
STPS2L60
Characteristics (curves)
Figure 11. Thermal resistance junction to ambient versus
copper surface under each lead (SMA)
Figure 12. Thermal resistance versus lead length (DO-41)
Rth(°C/W)
Rth(j-a) (°C/W)
120
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
Rth(j-a)
SMA
100
150
80
60
100
Rth(j-I)
40
50
20
Lleads(mm)
S(Cu)(cm²)
0
0
5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
Figure 13. Thermal resistance junction to ambient versus
copper surface under each lead (SMB Flat)
200
10
20
15
25
5.0
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat Notch)
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
200
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMB-Flat
Epoxy printed circuit board FR4, eCu= 35 µm
SMA Flat Notch
150
150
100
100
50
50
S(Cu)(cm²)
SCu (cm²)
0
0
0.0
0.5
DS2976 - Rev 8
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
page 5/15
STPS2L60
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMA package information
•
•
Epoxy meets UL94, V0
Cooling method : by conduction (C)
Figure 15. SMA package outline
E1
D
E
A1
C
A2
L
b
Table 4. SMA package mechanical data
Dimensions
Ref.
A1
DS2976 - Rev 8
Millimeters
Inches (for reference only)
Min.
Max.
Min.
Max.
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
4.80
5.35
0.188
0.211
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
page 6/15
STPS2L60
SMA package information
Figure 16. SMA recommended footprint in mm (inches)
1.4
2.63
1.4
(0.055)
(0.104)
(0.055)
1.64
(0.065)
5.43
(0.214)
DS2976 - Rev 8
page 7/15
STPS2L60
SMA Flat Notch package information
2.2
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 17. SMA Flat Notch package outline
Table 5. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Min.
A1
0.90
A1
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.044
0.002
b
1.25
1.65
0.049
0.065
C
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
DS2976 - Rev 8
Typ.
Inches (for reference only)
0.75
1.20
0.029
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
page 8/15
STPS2L60
SMA Flat Notch package information
Figure 18. SMA Flat Notch recommended footprint in mm (inches)
1.20
(0.047)
3.12
1.20
(0.123)
(0.047)
1.52
(0.060)
5.52
(0.217)
DS2976 - Rev 8
page 9/15
STPS2L60
SMB Flat package information
2.3
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 19. SMB Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L2 2 x
b
Table 6. SMB Flat mechanical data
Dimensions
Ref.
Millimeters
Min.
DS2976 - Rev 8
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.043
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.10
5.60
0.201
0.220
E1
4.05
4.60
0.159
0.181
L
0.75
1.50
0.030
0.059
L1
0.40
0.016
L2
0.60
0.024
page 10/15
STPS2L60
SMB Flat package information
Figure 20. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS2976 - Rev 8
page 11/15
STPS2L60
DO-41 package information
2.4
DO-41 Package information
•
Epoxy meets UL 94, V0
Figure 21. DO-41 package outline
C
C
A
ØD
ØB
Table 7. DO-41 package mechanical data
Dimensions
Ref.
DS2976 - Rev 8
Millimeters
Inches (for reference only)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
4.1
-
5.20
0.160
-
0.205
B
2.00
-
2.71
0.080
-
0.107
C
25.40
-
1.000
-
D
0.71
-
0.028
-
0.86
0.0034
page 12/15
STPS2L60
Ordering Information
3
Ordering information
Table 8. Ordering information
DS2976 - Rev 8
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS2L60A
S26
SMA
0.068 g
5000
Tape and reel
STPS2L60AFN
A26
SMA Flat Notch
0.039 g
10 000
Tape and reel
STPS2L60
STPS2L60
DO-41
0.34 g
2000
Ammopack
STPS2L60UF
FG26
SMB Flat
0.050 g
5000
Tape and reel
page 13/15
STPS2L60
Revision history
Table 9. Document revision history
DS2976 - Rev 8
Date
Version
Jul-2003
2A
Changes
Last update.
Aug-2004
3
SMA package dimensions update. Reference A1 max changed from 2.70 mm
(0.106 inch) to 2.03 mm (0.080 inch).SMA package dimensions update.
Reference A1 max changed from 2.70 mm (0.106 inch) to 2.03 mm (0.080
inch).
18-Sep-2008
4
Reformatted to current standards. Added SMB flat package.
30-Sep-2009
5
Updated table 7 package dimensions.
23-Sep-2011
6
Updated SMA package information.
30-Nov-2018
7
Updated Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise
specified) and Figure 4. Normalized avalanche power derating versus pulse
duration (Tj = 125 °C).
27-Sep-2019
8
Added Section 2.2 SMA Flat Notch package information.
page 14/15
STPS2L60
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© 2019 STMicroelectronics – All rights reserved
DS2976 - Rev 8
page 15/15
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