STPS2L60UF

STPS2L60 Datasheet 60 V, 2 A low drop power Schottky rectifier Features • • • • • Negligible switching losses Low forward voltage drop for higher efficiency and extended battery life Surface mount miniature package Avalanche rated ECOPACK2 compliant component Applications • • • • • Lighting Desktop power supply Battery charger Set top box Auxiliary power Description This 60 V power Schottky rectifier is ideal for switch mode power supplies and high frequency converters. Packaged in SMA, SMA Flat Notch, axial and SMB Flat, the STPS2L60 is optimized for use in low voltage, high frequency inverters and small battery chargers. Product status STPS2L60 Product summary Symbol Values IF(AV) 2A VRRM 60 V Tj (max.) 150 °C VF(typ.) 0.51 V DS2976 - Rev 8 - September 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS2L60 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 10 A 2 A IF(AV) IFSM Average forward current δ = 0.5, square wave Surge non repetitive forward current PARM Repetitive peak avalanche power Tstg Storage temperature range Tj SMB Flat TL = 130 °C SMA TL = 115 °C SMA Flat Notch TL = 120 °C DO-41 TL = 110 °C SMB Flat, SMA, DO-41 tp = 10 ms sinusoidal 75 A SMA Flat Notch 105 tp = 10 µs, Tj= 125 °C 115 W -65 to + 150 °C + 150 °C Max. value Unit Maximum operating junction temperature (1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Junction to lead Lead length = 10 mm SMB Flat 15 SMA 25 SMA Flat Notch 20 DO-41 30 °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 100 °C Tj = 25 °C VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 2 A IF = 4 A Min. Typ. - 2 - Unit 100 µA 10 mA 0.60 0.51 - Max. 0.55 0.77 0.62 V 0.67 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.43 x IF(AV) + 0.06 IF2(RMS) DS2976 - Rev 8 page 2/15 STPS2L60 Characteristics (curves) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 1.4 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 IF(AV)(A) PF(AV)(W) 2.2 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-l) 2.0 SMA 1.8 δ = 0.05 DO-41 1.6 δ=1 Rth(j-a)=100°C/W 1.4 1.2 1.0 0.8 0.6 T 0.2 0.4 0.6 0.8 1.0 1.2 1.4 T 0.4 0.2 IF(AV)(A) 0.0 δ=tp/T 1.6 1.8 2.0 tp 2.2 2.4 0 25 Rth(j-a)=Rth(j-l) 50 75 100 125 150 Figure 4. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) IF(AV)(A) 2.0 Tamb (°C) tp δ=tp/T 0.0 Figure 3. Average forward current versus ambient temperature (δ = 0.5, SMB Flat) 2.2 Figure 2. Average forward current versus ambient temperature (δ = 0.5, DO-41, SMA) 1 PARM (t p ) PARM (10 µs) 1.8 SMB Flat SMBflat 1.6 1.4 0.1 1.2 SMBflat SMB Flat Rth(j-a)=40 °C/W Scu=2.5 cm² 1.0 0.8 0.01 T 0.6 0.4 0.2 δ=tp/T tp t p(µs) Tamb (°C) 0.001 0.0 0 DS2976 - Rev 8 25 50 75 100 125 150 1 10 100 1000 page 3/15 STPS2L60 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to ambient versus pulse duration (SMA) to ambient versus pulse duration (DO-41) Zth(j-a)/ Rth(j-a) Zth(j-a)/ Rth(j-a) 1.0 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 0.1 Single pulse Single pulse 0.1 t p (s) t p (s) 0.0 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E-01 1.E+02 Figure 7. Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat) 1.E+01 1.E+02 1.E+03 Figure 8. Junction capacitance versus reverse voltage applied (typical values) Zth(j-l) /Rth(j-l) 1.0 1.E+00 C(pF) 1000 epoxy printed circuit board FR4, copper thickness:35 µm F=1MHz VOSC=30mVRMS Tj=25°C 0.9 0.8 0.7 0.6 0.5 100 0.4 0.3 0.2 0.1 Single pulse t p (s) 0.0 1.E-04 1.E-03 V R (V) 10 1.E-02 1.E-01 1 1.E+00 Figure 9. Reverse leakage current versus reverse voltage applied (typical values) 10 100 Figure 10. Forward voltage drop versus forward current IF (A) IR(µA) 10 1.E+05 9 Tj=150°C 1.E+04 Tj=125°C (maximum values) (Maximum 8 Tj=125°C 7 Tj=100°C 6 1.E+03 Tj=25°C (maximum values) Tj=125°C (typical values) 5 Tj=75°C 4 1.E+02 Tj=50°C 1.E+01 Tj=25°C 3 2 1 VR(V) VF (V) 0 1.E+00 0.0 0 DS2976 - Rev 8 10 20 30 40 50 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 60 page 4/15 STPS2L60 Characteristics (curves) Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMA) Figure 12. Thermal resistance versus lead length (DO-41) Rth(°C/W) Rth(j-a) (°C/W) 120 200 Epoxy printed circuit board FR4, copper thickness: 35 µm Rth(j-a) SMA 100 150 80 60 100 Rth(j-I) 40 50 20 Lleads(mm) S(Cu)(cm²) 0 0 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat) 200 10 20 15 25 5.0 Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(j-a) (°C/W) Rth(j-a) (°C/W) 200 Epoxy printed circuit board FR4, copper thickness: 35 µm SMB-Flat Epoxy printed circuit board FR4, eCu= 35 µm SMA Flat Notch 150 150 100 100 50 50 S(Cu)(cm²) SCu (cm²) 0 0 0.0 0.5 DS2976 - Rev 8 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/15 STPS2L60 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA package information • • Epoxy meets UL94, V0 Cooling method : by conduction (C) Figure 15. SMA package outline E1 D E A1 C A2 L b Table 4. SMA package mechanical data Dimensions Ref. A1 DS2976 - Rev 8 Millimeters Inches (for reference only) Min. Max. Min. Max. 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 4.80 5.35 0.188 0.211 E1 3.95 4.60 0.155 0.182 L 0.75 1.50 0.029 0.060 page 6/15 STPS2L60 SMA package information Figure 16. SMA recommended footprint in mm (inches) 1.4 2.63 1.4 (0.055) (0.104) (0.055) 1.64 (0.065) 5.43 (0.214) DS2976 - Rev 8 page 7/15 STPS2L60 SMA Flat Notch package information 2.2 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 17. SMA Flat Notch package outline Table 5. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L DS2976 - Rev 8 Typ. Inches (for reference only) 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° page 8/15 STPS2L60 SMA Flat Notch package information Figure 18. SMA Flat Notch recommended footprint in mm (inches) 1.20 (0.047) 3.12 1.20 (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS2976 - Rev 8 page 9/15 STPS2L60 SMB Flat package information 2.3 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 19. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 6. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS2976 - Rev 8 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 L1 0.40 0.016 L2 0.60 0.024 page 10/15 STPS2L60 SMB Flat package information Figure 20. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS2976 - Rev 8 page 11/15 STPS2L60 DO-41 package information 2.4 DO-41 Package information • Epoxy meets UL 94, V0 Figure 21. DO-41 package outline C C A ØD ØB Table 7. DO-41 package mechanical data Dimensions Ref. DS2976 - Rev 8 Millimeters Inches (for reference only) Min. Typ. Max. Min. Typ. Max. A 4.1 - 5.20 0.160 - 0.205 B 2.00 - 2.71 0.080 - 0.107 C 25.40 - 1.000 - D 0.71 - 0.028 - 0.86 0.0034 page 12/15 STPS2L60 Ordering Information 3 Ordering information Table 8. Ordering information DS2976 - Rev 8 Order code Marking Package Weight Base qty. Delivery mode STPS2L60A S26 SMA 0.068 g 5000 Tape and reel STPS2L60AFN A26 SMA Flat Notch 0.039 g 10 000 Tape and reel STPS2L60 STPS2L60 DO-41 0.34 g 2000 Ammopack STPS2L60UF FG26 SMB Flat 0.050 g 5000 Tape and reel page 13/15 STPS2L60 Revision history Table 9. Document revision history DS2976 - Rev 8 Date Version Jul-2003 2A Changes Last update. Aug-2004 3 SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inch) to 2.03 mm (0.080 inch).SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inch) to 2.03 mm (0.080 inch). 18-Sep-2008 4 Reformatted to current standards. Added SMB flat package. 30-Sep-2009 5 Updated table 7 package dimensions. 23-Sep-2011 6 Updated SMA package information. 30-Nov-2018 7 Updated Table 1. Absolute ratings (limiting values, at 25 °C, unless otherwise specified) and Figure 4. Normalized avalanche power derating versus pulse duration (Tj = 125 °C). 27-Sep-2019 8 Added Section 2.2 SMA Flat Notch package information. page 14/15 STPS2L60 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS2976 - Rev 8 page 15/15