STPS2L60ZFY

STPS2L60ZFY Automotive low drop power Schottky rectifier Datasheet - production data Description Single chip Schottky rectifiers suited to switched mode power supplies and high frequency DC to DC converters. A K Packaged in SOD123Flat, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free-wheeling and polarity protection in automotive applications. A K SOD123Flat Table 1: Device summary Features        AEC-Q101 qualified Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature packages Avalanche capability specified PPAP capable October 2016 DocID029446 Rev 2 This is information on a product in full production. Symbol Value IF(AV) 2A VRRM 60 V VF (typ.) 0.60 V Tj (max.) 175 °C 1/8 www.st.com Characteristics 1 STPS2L60ZFY Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage Tj = -40 °C to +175 °C 60 V IF(AV) Average forward current δ = 0.5, square wave TL = 140 °C 2 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 50 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 85 W Tstg Storage temperature range Tj -65 to +175 Operating junction temperature range(1) °C -40 to +175 Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Rth(j-l) Parameter Max. value Unit 20 °C/W Junction to lead Table 4: Static electrical characteristics Symbol Parameter Test conditions IR(1) Reverse leakage current VF(2) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 2 A Typ. - 5.6 - Max. Unit 50 µA 21 mA 0.75 0.60 0.66 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.51 x IF(AV) + 0.075 x IF2(RMS) For more information, please refer to the following application notes related to the power losses.   2/8 AN604 (Calculation of conduction losses in a power rectifier) AN4021 (Calculation of reverse losses in a power diode) DocID029446 Rev 2 V STPS2L60ZFY 1.1 Characteristics Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current 1.8 Figure 2: Average forward current versus ambient temperature (δ = 0.5) PF(AV) (W) δ = 0.05 δ = 0.2 δ = 0.1 δ = 0.5 δ= 1 IF(AV)(A) 7 1.6 SOD123Flat 6 1.4 Rth(j-a)=Rth(j-l) 1.2 5 1.0 4 0.8 3 0.6 0.4 T 0.2 IF(AV) (A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 2 δ = tp /T 1.6 1.8 2.0 tp 2.2 T 1 2.4 δ = tp/T 0 0 Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 Tamb(°C) tp 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to lead versus pulse duration PARM (t p ) PARM (10 µs) Zth(j-l)/Rth(j-l) 1.0 SOD123 flat 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 Single pulse t p (µs) 0.1 0.001 1 10 100 Figure 5: Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 tp(s) 0.0 1.E-04 1000 IR(mA) 1.E-03 1.E-02 1.E-01 1.E+01 Figure 6: Junction capacitance versus reverse voltage applied (typical values) 1000 C(pF) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+01 1.E+00 Tj = 125 °C Tj = 100 °C 1.E+00 100 Tj = 75 °C 1.E-01 Tj = 50 °C 1.E-02 Tj = 25 °C VR(V) VR(V) 1.E-03 10 0 5 10 15 20 25 30 35 40 45 50 55 60 DocID029446 Rev 2 1 10 100 3/8 Characteristics STPS2L60ZFY Figure 7: Forward voltage drop versus forward current (typical values) Figure 8: Thermal resistance junction to ambient versus copper surface under each lead (typical values) 250 Rth(j-a)(C/W) SOD123Flat 200 150 100 Epoxy printed board FR4, eCu = 35 µm 50 SCu (cm²) 0 0.0 4/8 DocID029446 Rev 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Package information STPS2L60ZFY 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Epoxy meets UL94, V0 Cooling method: by conduction (C) SOD123Flat package information Figure 9: SOD123Flat package outline A C1 L HD D L b C E DocID029446 Rev 2 5/8 Package information STPS2L60ZFY Table 5: SOD123Flat package mechanical data Dimensions Ref. Millimeters Min. Typ. Max. A 0.86 0.98 1.10 b 0.80 0.90 1.00 c 0.08 0.15 0.25 c1 0.00 D 2.50 2.60 2.70 E 1.50 1.60 1.80 HD 3.30 3.50 3.70 L 0.45 0.65 0.85 0.10 Figure 10: SOD123Flat footprint dimensions (mm) 1.60 1.40 1.30 6/8 DocID029446 Rev 2 Ordering information STPS2L60ZFY 3 Ordering information Table 6: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STPS2L60ZFY 2Y6 SOD123Flat 12.5 mg 3000 Tape and reel Revision history Table 7: Document revision history Date Revision Changes 13-Oct-2016 1 Initial release. 17-Oct-2016 2 Updated Table 4: "Static electrical characteristics". DocID029446 Rev 2 7/8 STPS2L60ZFY IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 8/8 DocID029446 Rev 2