STPS30120DJF-TR

STPS30120DJF Datasheet 120 V, 30 A power Schottky rectifier Features • • • • • Very small conduction losses Negligible switching losses Extremely fast switching Low thermal resistance Avalanche capability specified • ECOPACK®2 compliant Applications • • • • • Switching diode SMPS DC/DC converter LED lighting Notebook adapter Description This power Schottky is suited for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT™ 5x6, the STPS30120DJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. Product status link PowerFLAT™ is a trademark of STMicroelectronics. STPS30120DJF Product summary Symbol Value IF(AV) 30 A VRRM 120 V Tj (max.) 150 °C VF (typ.) 0.68 V DS6255 - Rev 7 - February 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS30120DJF Characteristics 1 Characteristics Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 120 V IF(RMS) Forward rms current 45 A IF(AV) Average forward current, δ = 0.5, square wave TC = 80 °C 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 200 A PARM Repetitive peak avalanche power tp = 10 µs , Tj = 125 °C 900 W -65 to +175 °C 150 °C Max. value Unit 2.5 °C/W Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case For more information, please refer to the following application note : • AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages Table 3. Static electrical characteristics (anode terminals short circuited) Symbol IR (1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF (2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 15 A IF = 30 A Min. Typ. - 5.5 - Max. Unit 35 µA 16 mA 0.84 0.61 0.67 0.92 0.68 V 0.75 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.61 x IF(AV) + 0.005 IF 2 (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS6255 - Rev 7 page 2/9 STPS30120DJF Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 30.0 PF(AV) (W) Figure 2. Average forward current versus ambient temperature (δ = 0.5) 35 IF(AV)(A) Rth(j-a)=Rth(j-c) δ = 0.5 30 25.0 δ= 0.2 δ= 1 25 δ = 0.1 20.0 20 δ = 0.05 15.0 15 10.0 10 T T 5 5.0 IF(AV) (A) tp δ =tp/T 0 5 10 15 20 25 30 35 Figure 3. Normalized avalanche power derating versus pulse duration (Tj= 125 °C) 1 0 40 PARM (t p ) PARM (10 µs) Tamb (°C) tp δ =tp/T 0 0.0 25 50 75 100 125 150 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration 1.0 Zth(j-c) / Rth(j-c) 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 0.001 1 10 100 t p (s) Single pulse 0.1 t p(µs) 0.0 1.E-05 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 6. Junction capacitance versus reverse voltage applied (typical values) IR(mA) C(pF) 1.E+02 10000 1.E+01 Tj=150°C F=1 MHz VOSC=30 mVRMS Tj=25 °C Tj=125°C 1.E+00 Tj=100°C 1.E-01 1000 Tj=75°C 1.E-02 Tj=50°C 1.E-03 Tj=25°C VR (V) 1.E-04 0 DS6255 - Rev 7 10 20 30 40 50 60 70 80 90 100 110 120 V R (V) 100 1 10 100 1000 page 3/9 STPS30120DJF Characteristics (curves) Figure 7. Forward voltage drop versus forward current 60 Figure 8. Thermal resistance junction to ambient versus copper surface under tab IF(A) Rth(j-a) (°C/W) 150 55 PowerFlat™_5X6 50 epoxy printed board FR4, eCu = 35 µm 125 45 40 100 Tj=125°C (Maximum values) 35 30 25 75 Tj=125°C (Typical values) 20 50 Tj=25°C (Maximum values) 15 10 5 0 0.0 25 VF(V) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 SCu (cm²) 1.1 0 0 DS6255 - Rev 7 1 2 3 4 5 6 7 8 9 10 page 4/9 STPS30120DJF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 PowerFLAT™ 5x6 package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 9. PowerFLAT™ 5x6 package outline (non-contractual) Bottom view Side view Top view DS6255 - Rev 7 page 5/9 STPS30120DJF PowerFLAT™ 5x6 package information Table 4. PowerFLAT™ 5x6 mechanical data Dimensions Ref Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 b 0.30 0.50 0.01 0.02 c 0.25 0.010 D 4.80 5.40 0.189 0.212 D2 3.91 4.45 0.154 0.175 e 1.27 0.050 E 5.90 6.35 0.232 0.250 E2 3.34 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.10 1.575 0.015 0.023 L1 0.05 0.25 0.002 0.15 0.006 0.009 Figure 10. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm) DS6255 - Rev 7 page 6/9 STPS30120DJF Ordering information 3 Ordering information Table 5. Ordering information DS6255 - Rev 7 Order code Marking Package Weight Base qty. Delivery mode STPS30120DJF-TR PS30 120 PowerFLAT 5x6 0.095 g 3000 Tape and reel page 7/9 STPS30120DJF Revision history Table 6. Document revision history DS6255 - Rev 7 Date Revision Changes 18-May-2009 1 First issue. 09-Nov-2009 2 Updated Table 1. 25-Feb-2010 3 Corrected order code and marking in Table 6. 30-Jul-2010 4 Replace Power QFN with PowerFLAT. 20-May-2011 5 Updated package graphics. Added mention of terminals to captions of Table 2 and Table 4. Updated base quantity and marking in Table 6. Added Figure 12. 28-May-2018 6 Updated PARM value and removed "Normalized avalanche power derating" curves. 08-Feb-2019 7 Updated Figure 9. PowerFLAT™ 5x6 package outline (non-contractual), Table 4. PowerFLAT™ 5x6 mechanical data and Section Cover image. page 8/9 STPS30120DJF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS6255 - Rev 7 page 9/9