STPS30170CFP

® STPS30170C HIGH VOLTAGE POWER SCHOTTKY RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM Tj VF(max) 2 x 15 A 170 V 175 °C 0.75 V A2 A2 A1 K K A1 A1 K A2 FEATURES AND BENEFITS ■ ■ ■ High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Insulated package: TO-220FPAB Insulating voltage: 2000 V DC Capacitance: 45 pF Avalanche specification TO-247 STPS30170CW TO-220AB STPS30170CT ■ K ■ A2 K A1 A1 A2 DESCRIPTION Dual center tab Schottky rectifier suited for High Frequency Switch Mode Power Supply. TO-220FPAB STPS30170CFP D2PAK STPS30170CG Table 2: Order Codes Part Numbers STPS30170CW STPS30170CT STPS30170CFP STPS30170CG STPS30170CG-TR Marking STPS30170CW STPS30170CT STPS30170CFP STPS30170CG STPS30170CG September 2005 REV. 1 1/9 STPS30170C Table 3: Absolute Ratings (limiting values, per diode) Symbol VRRM IF(RMS) RMS forward current TO-220FPAB IF(AV) Average forward current TO-220AB / δ = 0.5 D2PAK TO-247 IFSM PARM Tstg Tj dV/dt Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 120 °C Tc = 155 °C Per device tp = 10ms sinusoidal tp = 1µs Tj = 25 °C 30 220 10500 -65 to + 175 175 10000 A W °C °C V/µs Per diode 15 A Parameter Repetitive peak reverse voltage Value 170 30 Unit V A 1 dPtot * : --------------- > ------------------------- thermal runaway condition for a diode on its own heatsink Rth ( j – a ) dTj Table 4: Thermal Parameters Symbol Parameter TO-220FPAB Rth(j-c) Junction to case TO-220AB / D2PAK TO-247 TO-220FPAB Rth(c) TO-220AB / TO-247 When the diodes 1 and 2 are used simultaneously: ∆ Tj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Value Per diode Total Per diode Total Per diode Total Coupling Coupling Coupling 4 3.3 1.6 0.85 1.5 0.8 2.6 0.3 0.3 Unit °C/W D2PAK °C/W Table 5: Static Electrical Characteristics (per diode) Symbol IR * Parameter Reverse leakage current Tests conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF ** Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Pulse test: * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% Min. Typ 5 Max. 20 20 0.92 Unit µA mA VR = VRRM IF = 15 A IF = 30 A 0.69 0.75 1 V 0.80 0.86 To evaluate the conduction losses use the following equation: P = 0.64 x IF(AV) + 0.0073 IF (RMS) 2 2/9 STPS30170C Figure 1: Average forward power dissipation versus average forward current (per diode) PF(AV)(W) 14 d=0.1 d=0.2 d=0.5 d=1 Figure 2: Average forward current versus ambient temperature (δ = 0.5, per diode) IF(AV)(A) 18 16 14 12 10 8 6 Rth(j-A)=15 °C/W Rth(j-a)=Rth(j-c) (TO-220FPAB) Rth(j-a)=Rth(j-c) (TO-220AB, TO -247 & D²PAK) 12 10 8 6 4 d=0.05 T 2 IF(AV)(A) 0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 4 d=tp/T tp T 2 0 0 d=tp/T 25 tp Tamb (°C) 50 75 100 125 150 175 Figure 3: Normalized avalanche derating versus pulse duration PARM (t p ) PARM (1µs) 1 power Figure 4: Normalized avalanche derating versus junction temperature PARM (t p ) PARM (25°C) power 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 t p (µs) 10 100 1000 Tj (°C) 0 25 50 75 100 125 150 Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220AB, TO-247, D2PAK) IM(A) 225 TO-220AB, TO -247 & D²PAK Figure 6: Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) IM(A) 140 130 120 110 100 90 TO-220FPAB 200 175 150 125 100 TC=75°C TC=50°C 80 70 60 50 40 30 20 10 0 1.E-03 TC=50°C 75 50 IM TC=75°C TC=125°C IM t TC=125°C 25 0 1.E-03 t d =0.5 t(s) 1.E-02 1.E-01 1.E+00 d =0.5 t(s) 1.E-02 1.E-01 1.E+00 3/9 STPS30170C Figure 7: Relative variation of thermal impedance junction to case versus pulse duration (per diode) (TO-220AB, TO-247, D2PAK) Zth(j-c)/Rth(j-c) 1.0 TO-220AB, TO -247 & D²PAK Figure 8: Relative variation of thermal impedance junction to case versus pulse duration (per diode) (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 TO-220FPAB 0.9 0.8 0.7 d=0.5 0.9 0.8 0.7 0.6 0.5 d=0.5 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse d=0.2 d=0.1 0.4 0.3 T d=0.2 D=0.1 T 0.2 tP(s) d=tp/T tp 0.1 Single pulse tP(s) 1.E-02 1.E-01 d =tp/T 1.E+00 tp 0.0 1.E-03 1.E+01 Figure 9: Reverse leakage current versus reverse voltage applied (typical values, per diode) IR(µA) 1.E+06 1.E+05 1.E+04 1.E+03 1.E+02 1.E+01 Tj=25°C Figure 10: Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Tj=175°C Tj=150°C Tj=125°C 100 Tj=75°C 1.E+00 1.E-01 0 VR(V) 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 10 1 10 VR(V) 100 1000 Figure 11: Forward voltage drop versus forward current (maximum values, per diode, low level) IFM(A) 15.0 Figure 12: Forward voltage drop versus forward current (maximum values, per diode, high level) IFM(A) 100 12.5 Tj=125°C (Maximum values) Tj=125°C (Maximum values) 10.0 Tj=125°C (Typical values) 7.5 Tj=125°C (Typical values) 10 Tj=25°C (Maximum values) 5.0 Tj=25°C (Maximum values) 2.5 VFM(V) VFM(V) 1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 4/9 STPS30170C Figure 13: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35 µm) (D2PAK) Rth(j-a) (°C/W) 80 D²PAK 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 SCU(cm²) Figure 14: TO-247 Package Mechanical Data DIMENSIONS REF. V Millimeters Min. Typ. Max. Min. 4.85 2.20 0.40 1.00 3.00 2.00 2.00 3.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5° 60° 3.55 3.65 0.139 3.00 0.078 14.80 0.559 15.75 0.608 20.15 0.781 4.30 0.145 2.40 0.078 3.40 0.118 5.15 0.191 2.60 0.086 0.80 0.015 1.40 0.039 Inches Typ. Max. 0.203 0.102 0.031 0.055 0.118 0.078 0.094 0.133 0.429 0.620 0.793 0.169 0.728 0.582 1.362 0.216 0.118 5° 60° 0.143 A D E F F1 H A V Dia F2 F3 F4 G H L5 L L2 L4 F1 V2 F(x3) M G E F2 F3 F4 L3 D L1 L L1 L2 L3 L4 L5 M V V2 Dia. 5/9 STPS30170C Figure 15: D2PAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0° 8° 0° 8° REF. A E L2 C2 D L L3 A1 B2 B G A2 R C M * V2 * FLAT ZONE NO LESS THAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 Figure 16: Foot Print Dimensions (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 6/9 STPS30170C Figure 17: TO-220FPAB Package Mechanical Data REF. A H B Dia L6 L2 L3 L5 F1 L4 F2 D L7 F G1 G E A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.018 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.205 2.4 2.7 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.205 9.8 10.6 0.386 0.417 2.9 3.6 0.114 0.142 15.9 16.4 0.626 0.646 9.00 9.30 0.354 0.366 3.00 3.20 0.118 0.126 Figure 18: TO-220AB Package Mechanical Data REF. A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 7/9 H2 Dia L5 C A L7 L6 L2 F2 F1 L9 L4 F G1 G M E D STPS30170C In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 6: Ordering Information Ordering type STPS30170CW STPS30170CT STPS30170CFP STPS30170CG STPS30170CG-TR ■ ■ ■ ■ Marking STPS30170CW STPS30170CT STPS30170CFP STPS30170CG STPS30170CG Package TO-247 TO-220AB TO-220FPAB D2PAK Weight 4.40 g 2g 1.9 g 1.48 g Base qty 30 50 50 50 1000 Delivery mode Tube Tube Tube Tube Tape & reel Epoxy meets UL94, V0 Cooling method: by conduction (C) TO-220 - Recommended torque value: 0.55 Nm, Maximum torque value: 0.7 Nm. TO-247 - Recommended torque value: 0.8 Nm, Maximum torque value: 1.0 Nm. Table 7: Revision History Date 16-Sep-2005 Revision 1 First issue. Description of Changes 8/9 STPS30170C Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9