STPS30170DJF-TR

STPS30170DJF Datasheet 170 V, 30 A power Schottky rectifier Features • • • • • • Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Low thermal resistance High avalanche capability specified • ECOPACK®2 compliant Applications • • • • Switching diode SMPS DC/DC converter Telecom power Description This Schottky rectifier is ideally suited for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT™ 5x6, the STPS30170DJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. Product status Its low profile was especially designed to be used in applications with space-saving constraints. STPS30170DJF Product summary IF(AV) 30 A VRRM 170 V Tj(max.) 150 °C VF(typ.) 0.71 V PowerFLAT™ is a trademark of STMicroelectronics. DS6587 - Rev 5 - February 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS30170DJF Characteristics 1 Characteristics Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 170 V IF(RMS) Forward rms current 45 A IF(AV) Average forward current, δ = 0.5, square wave TC = 80 °C 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 200 A PARM Repetitive peak avalanche power tp = 10 µs , Tj = 125 °C 900 W -65 to +175 °C 150 °C Max. value Unit 2.5 °C/W Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case For more information, please refer to the following application note : • AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages Table 3. Static electrical characteristics (anode terminals short circuited) Symbol IR (1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF (2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 15 A IF = 30 A Min. Typ. - 4 - Max. Unit 15 µA 12 mA 0.88 0.65 0.70 0.95 0.71 V 0.79 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.65 x IF(AV) + 0.0046 IF 2 (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS6587 - Rev 5 page 2/9 STPS30170DJF Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current PF(AV) (W) 32 Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV)(A) 35 Rth(j-a)=Rth(j-c) δ = 0.5 28 30 δ= 0.2 24 δ= 1 25 δ = 0.1 20 δ = 0.05 20 16 15 12 10 T 8 4 IF(AV) (A) tp δ =tp/T 0 0 0 5 10 15 20 25 30 35 40 Figure 3. Normalized avalanche power derating versus pulse duration (Tj= 125 °C) 1 T 5 PARM (t p ) PARM (10 µs) 0 Tamb (°C) tp δ =tp/T 25 50 75 100 125 150 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration 1.0 Zth(j-c) / Rth(j-c) 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 0.1 t p(µs) 0.001 1 10 100 Single pulse 0.0 1.E-05 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) Tj = 150 °C 1.E+00 Tj = 125 °C 1.E-02 1.E-01 1.E+00 C(pF) 1000 1.E+01 1.E-03 Figure 6. Junction capacitance versus reverse voltage applied (typical values) IR(mA) 1.E+02 t p (s) 1.E-04 F=1 MHz VOSC=30 mVRMS Tj=25 °C Tj = 100 °C 100 1.E-01 Tj = 75 °C 1.E-02 Tj = 50 °C Tj = 25 °C 1.E-03 V R (V) VR (V) 10 1.E-04 0 DS6587 - Rev 5 20 40 60 80 100 120 140 160 180 1 10 100 1000 page 3/9 STPS30170DJF Characteristics (curves) Figure 7. Forward voltage drop versus forward current 60 Figure 8. Thermal resistance junction to ambient versus copper surface under tab IF(A) Rth(j-a) (°C/W) 150 55 PowerFlat™_5X6 50 45 Tj = 125 °C (Maximum values) 40 100 35 30 Tj = 125 °C (Typical values) 25 75 20 50 15 Tj = 25 °C (Maximum values) 10 5 0 0.0 epoxy printed board FR4, eCu = 35 µm 125 25 VF(V) 0.1 DS6587 - Rev 5 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 SCu (cm²) 0 0 1 2 3 4 5 6 7 8 9 10 page 4/9 STPS30170DJF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 PowerFLAT™ 5x6 package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 9. PowerFLAT™ 5x6 package outline (non-contractual) Bottom view Side view Top view DS6587 - Rev 5 page 5/9 STPS30170DJF PowerFLAT™ 5x6 package information Table 4. PowerFLAT™ 5x6 mechanical data Dimensions Ref Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 b 0.30 0.50 0.01 0.02 c 0.25 0.010 D 4.80 5.40 0.189 0.212 D2 3.91 4.45 0.154 0.175 e 1.27 0.050 E 5.90 6.35 0.232 0.250 E2 3.34 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.10 1.575 0.015 0.023 L1 0.05 0.25 0.002 0.15 0.006 0.009 Figure 10. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm) DS6587 - Rev 5 page 6/9 STPS30170DJF Ordering information 3 Ordering information Table 5. Ordering information DS6587 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPS30170DJF-TR PS30 170 PowerFLAT 5x6 0.095 g 3000 Tape and reel page 7/9 STPS30170DJF Revision history Table 6. Document revision history DS6587 - Rev 5 Date Revision Changes 06-Nov-2009 1 First issue. 30-Jul-2010 2 Updated Table 1. 20-May-2011 3 Corrected order code and marking in Table 6. 05-Jun-2018 4 Updated Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) and Figure 3. Normalized avalanche power derating versus pulse duration (Tj= 125 °C). Minor text changes to improve readability. 08-Feb-2019 5 Updated Section Cover image, Figure 9. PowerFLAT™ 5x6 package outline (non-contractual) and Table 4. PowerFLAT™ 5x6 mechanical data. page 8/9 STPS30170DJF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS6587 - Rev 5 page 9/9