STPS3045CW

® STPS3045CT/CG/CR/CP/CPI/CW/CFP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF 2 x 15 A 45 V 175 °C 0.57 V A1 K A2 K A2 FEATURES AND BENEFITS s A2 A1 K A1 s s s s s VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING LOW THERMAL RESISTANCE INSULATED PACKAGE: TOP-3I Insulating voltage = 2500V RMS Capacitance = 12pF AVALANCHE CAPABILITY SPECIFIED TO-220AB STPS3045CT D2PAK STPS3045CG A2 A1 K A2 A1 K DESCRIPTION Dual center tap Schottky rectifier suited for SwitchMode Power Supply and high frequency DC to DC converters. Packaged either in TO-220AB, TO-220FPAB, D2PAK, I2PAK, TO-247, SOT93 or TOP-3I, this device is especially intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Insulated TOP-3I STPS3045CPI I2PAK STPS3045CR A2 A1 K A2 K A1 SOT-93 STPS3045CP TO-247 STPS3045CW A2 K A1 TO-220FPAB STPS3045CFP July 2003 - Ed: 6E 1/9 STPS3045CT/CG/CR/CP/CPI/CW/CFP ABSOLUTE RATINGS (limiting values, per diode) Symbol Parameter VRRM IF(RMS) IF(AV) Repetitive peak reverse voltage RMS forward current Average forward current δ = 0.5 TO-220AB / D PAK / I2PAK / SOT-93 / TO-247 TO-220FPAB TOP-3I IFSM IRRM IRSM PARM Tstg Tj Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * 2 Value 45 30 Tc = 155°C Tc = 130°C Tc = 150°C tp = 10 ms sinusoidal tp = 2 µs square F = 1kHz tp = 100 µs square tp = 1µs Tj = 25°C 220 1 3 6000 -65 to +175 175 10000 Per diode Per device 15 30 Unit V A A A A A W °C °C V/µs dV/dt Critical rate of rise of reverse voltage 1 dPtot thermal runaway condition for a diode on its own heatsink *: < dTj Rth( j − a ) THERMAL RESISTANCES Symbol Rth(j-c) Junction to case Parameter TO-220AB / D PAK / I PAK SOT-93 / TO-247 TO-220FPAB TOP-3I Rth(c) TO-220AB / D2PAK / I2PAK SOT-93 / TO-247 TO-220FPAB TOP-3I 2 2 Value Per diode Total Per diode Total Per diode Total Per diode Total Coupling Coupling Coupling 1.60 0.85 1.5 0.8 4 3.2 2.2 1.6 0.10 2.5 1.0 Unit °C/W When the diodes 1 and 2 are used simultaneously: ∆ Tj (diode 1) = P (diode1) x Rth(j-c) (per diode) + P (diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (Per diode) Symbol Parameter Tests Conditions IR * VF * Reverse leakage current Forward voltage drop Tj = 25°C Tj = 125°C Tj = 125°C Tj = 25°C Tj = 125°C Pulse test : * tp = 380 µs, δ < 2% Min. Typ. 11 Max. 200 40 0.57 0.84 0.72 Unit µA mA V VR = VRRM IF = 15 A IF = 30 A IF = 30 A 0.65 0.5 To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.01 IF2(RMS) 2/9 STPS3045CT/CG/CR/CP/CPI/CW/CFP Fig. 1: Average forward power dissipation versus average forward current (per diode). PF(AV)(W) 12 11 10 9 8 7 6 5 4 3 2 1 0 0 2 4 6 8 10 12 14 16 18 20 Fig. 2: Average current versus temperature (δ = 0.5, per diode). IF(AV)(A) 18 ambient δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) (TO-220AB, I2PAK, D2PAK, SOT-93, TO-247) 16 δ=1 14 12 10 8 6 Rth(j-a)=Rth(j-c) (TO-220FPAB) Rth(j-a)=Rth(j-c) (TOP-3I) Rth(j-a)=15°C/W T 4 T IF(AV)(A) δ=tp/T tp 2 0 0 δ=tp/T 25 tp Tamb(°C) 50 75 100 125 150 175 Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1µs) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25°C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 Fig. 5-1: Non repetitive surge peak forward current versus overload duration (maximum values, per diode). IM(A) 200 180 160 TO-220AB, I2PAK, D2PAK, SOT-93, TO-247 Fig. 5-2: Non repetitive surge peak forward current versus overload duration (maximum values, per diode). IM(A) 160 140 120 TOP-3I 140 120 100 TC=75°C 100 80 TC=75°C 80 60 40 20 0 1.E-03 1.E-02 1.E-01 IM t TC=100°C TC=125°C 60 40 20 IM t TC=100°C TC=125°C δ=0.5 t(s) 0 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 1.E+00 1.E-03 3/9 STPS3045CT/CG/CR/CP/CPI/CW/CFP Fig. 5-3: Non repetitive surge peak forward current versus overload duration (maximum values, per diode). IM(A) 120 TO-220FPAB Fig. 6-1: Relative variation of thermal transient impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 δ = 0.5 TO-220AB, I PAK, D PAK, SOT-93, TOP-3I, TO-247 2 2 100 80 TC=75°C 0.6 0.5 60 TC=100°C 0.4 δ = 0.2 δ = 0.1 40 TC=125°C IM 0.3 0.2 T Single pulse 20 t δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 δ=tp/T tp 1.E+00 0 1.E-03 Fig. 6-2: Relative variation of thermal transient impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Single pulse δ = 0.2 δ = 0.1 δ = 0.5 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values, per diode). IR(µA) 1.E+05 TO-220FPAB Tj=150°C 1.E+04 Tj=125°C Tj=100°C Tj=75°C 1.E+03 1.E+02 Tj=50°C 1.E+01 Tj=25°C T 1.E+00 tp(s) 1.E-02 1.E-01 0.0 1.E-03 δ=tp/T 1.E+00 tp 1.E-01 VR(V) 0 5 10 15 20 25 30 35 40 45 1.E+01 Fig. 8: Junction capacitance versus reverse voltage applied (typical values, per diode). C(nF) 10000 F=1MHz VOSC=30mVRMS Tj=25°C Fig. 9: Forward voltage drop versus forward current (maximum values, per diode). IFM(A) 1000 Tj=125°C (maximum values) 100 Tj=125°C (typical values) 1000 10 Tj=25°C (maximum values) VR(V) 100 1 10 100 1 0.0 0.2 0.4 0.6 VFM(V) 0.8 1.0 1.2 1.4 1.6 1.8 4/9 STPS3045CT/CG/CR/CP/CPI/CW/CFP Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu=35µm). Rth(j-a)(°C/W) 80 70 60 50 40 30 20 10 S(cm²) 0 0 5 10 15 20 25 30 35 40 PACKAGE MECHANICAL DATA TO-220AB REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 H2 Dia L5 C A L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 5/9 STPS3045CT/CG/CR/CP/CPI/CW/CFP PACKAGE MECHANICAL DATA I2PAK REF. Min. A A1 b b1 D DIMENSIONS Millimeters Inches Min. 0.173 0.098 0.028 0.044 0.044 0.018 0.048 0.352 0.094 0.394 0.516 0.137 0.050 Max. 0.181 0.106 0.037 0.046 0.046 0.024 0.054 0.368 0.106 0.409 0.535 0.149 0.055 Max. 4.60 2.69 0.93 1.17 1.17 0.60 1.36 9.35 2.70 10.4 13.6 3.78 1.40 A E L2 c2 4.40 2.49 0.70 1.14 1.14 0.45 1.23 8.95 2.40 10.0 13.1 3.48 1.27 b2 c c2 L1 b2 L b1 b e A1 D e E L L1 c L2 PACKAGE MECHANICAL DATA TOP-3I (isolated) DIMENSIONS REF. A B C D E F G H J K L P R Millimeters Min. 4.4 1.45 14.35 0.5 2.7 15.8 20.4 15.1 5.4 3.4 4.08 1.20 4.60 Typ. Max. 4.6 Min. 0.173 Inches Typ. Max. 0.181 0.061 0.614 0.028 0.114 0.650 0.831 0.610 0.222 0.144 0.164 0.055 0.181 1.55 0.057 15.60 0.565 0.7 2.9 0.020 0.106 16.5 0.622 21.1 0.815 15.5 0.594 5.65 0.213 3.65 0.134 4.17 0.161 1.40 0.047 6/9 STPS3045CT/CG/CR/CP/CPI/CW/CFP PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E L2 C2 Millimeters Min. Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 8° 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 0° Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 0° Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 8° A A1 A2 D L L3 A1 B2 B G A2 C R B B2 C C2 D E G L L2 L3 M * V2 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0.016 typ. FOOTPRINT DIMENSIONS (in millimeters) 16.90 10.30 1.30 5.08 3.70 8.90 7/9 STPS3045CT/CG/CR/CP/CPI/CW/CFP PACKAGE MECHANICAL DATA TO-247 V DIMENSIONS REF. Millimeters Inches Typ. Max. 0.203 0.102 0.031 0.055 0.118 0.078 0.094 0.133 0.429 0.620 0.793 0.169 0.728 0.582 1.362 0.216 0.118 5° 60° 0.143 Min. Typ. Max. Min. A 4.85 5.15 0.191 D 2.20 2.60 0.086 E 0.40 0.80 0.015 F 1.00 1.40 0.039 F1 3.00 F2 2.00 F3 2.00 2.40 0.078 F4 3.00 3.40 0.118 G 10.90 H 15.45 15.75 0.608 L 19.85 20.15 0.781 L1 3.70 4.30 0.145 L2 18.50 L3 14.20 14.80 0.559 L4 34.60 L5 5.50 M 2.00 3.00 0.078 V 5° V2 60° Dia. 3.55 3.65 0.139 V Dia. H A L5 L L2 L4 F2 F3 V2 F(x3) G = = M E F4 L3 F1 L1 D PACKAGE MECHANICAL DATA SOT-93 DIMENSIONS REF. A C D D1 E F F3 F4 G H L L2 L3 L5 L6 O 8/9 Millimeters Min. 4.70 1.90 2.50 2.00 0.50 1.10 1.75 2.10 10.80 14.70 11.10 0.425 15.20 0.279 12.20 16.20 18.0 3.95 31.00 4.00 4.10 0.157 4.15 0.156 0.78 0.020 1.30 0.043 Typ. Max. Min. 4.90 1.185 2.10 0.075 Inches Typ. Max. 0.193 0.083 0.098 0.078 0.031 0.051 0.069 0.083 0.437 0.598 0.480 0.638 0.709 0.163 1.220 0.161 STPS3045CT/CG/CR/CP/CPI/CW/CFP PACKAGE MECHANICAL DATA TO-220FPAB REF. A H B Dia L6 L2 L3 L5 D F1 L4 F2 L7 F G1 G E A B D E F F1 F2 G G1 H L2 L3 L4 L5 L6 L7 Dia. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.4 4.6 0.173 0.181 2.5 2.7 0.098 0.106 2.5 2.75 0.098 0.108 0.45 0.70 0.018 0.027 0.75 1 0.030 0.039 1.15 1.70 0.045 0.067 1.15 1.70 0.045 0.067 4.95 5.20 0.195 0.205 2.4 2.7 0.094 0.106 10 10.4 0.393 0.409 16 Typ. 0.63 Typ. 28.6 30.6 1.126 1.205 9.8 10.6 0.386 0.417 2.9 3.6 0.114 0.142 15.9 16.4 0.626 0.646 9.00 9.30 0.354 0.366 3.00 3.20 0.118 0.126 Base qty 50 50 1000 50 30 120 30 50 Delivery mode Tube Tube Tape & reel Tube Tube Bulk Tube Tube Type STPS3045CT STPS3045CG STPS3045CG-TR STPS3045CR STPS3045CP STPS3045CPI STPS3045CW STPS3045CFP s s s s s Marking STPS3045CT STPS3045CG STPS3045CG STPS3045CR STPS3045CP STPS3045CPI STPS3045CW Package TO-220AB D PAK D PAK I PAK SOT-93 TOP-3I TO-247 2 2 2 Weight 2.23 g. 1.48 g. 1.48 g. 1.48 g 3.97 g. 4.46 g. 4.46 g. 2.0 g. STPS3045CFP TO-220FPAB Cooling method: by conduction (C) Recommended torque value (SOT-93, TOP-3I, TO-247): 0.8 N.m. Recommended torque value (TO-220AB): 0.55 N.m. Maximum torque value (SOT-93, TOP-3I, TO-247): 1.0 N.m. Maximum torque value (TO-220AB): 0.7 N.m. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. 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