STPS3045DJF-TR

STPS3045DJF Datasheet 45 V, 30 A power Schottky rectifier Features • • • • • • • Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Low thermal resistance High avalanche capability specified Thin package: 1 mm • ECOPACK®2 compliant Applications • • Telecom power supply Desktop power supply Description This Schottky rectifier is ideally suited for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT™ 5x6, the STPS3045DJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. Product status link Its low profile was especially designed to be used in applications with space-saving constraints. PowerFLAT™ is a trademark of STMicroelectronics. STPS3045DJF Product summary Symbol Value IF(AV) 30 A VRRM 45 V Tj (max.) 175 °C VF (typ.) 0.50 V DS6592 - Rev 5 - February 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS3045DJF Characteristics 1 Characteristics Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short circuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 45 A IF(AV) Average forward current, δ = 0.5, square wave TC = 120 °C 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 380 A PARM Repetitive peak avalanche power tp = 10 µs , Tj = 125 °C 900 W -65 to +175 °C 175 °C Max. value Unit 2.5 °C/W Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case For more information, please refer to the following application note : • AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages Table 3. Static electrical characteristics (anode terminals short circuited) Symbol IR (1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF (1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 15 A IF = 30 A Min. Typ. - 20 - Unit 300 µA 80 mA 0.56 0.41 - Max. 0.46 0.64 0.50 V 0.56 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.43 x IF(AV) + 0.00433 IF 2 (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS6592 - Rev 5 page 2/9 STPS3045DJF Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 24 Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV) (A) PF(AV)(W) 35 Rth(j-a) = Rth(j-c) 30 20 25 16 20 12 15 8 10 T T 4 5 IF(AV)(A) δ =tp/T 0 0 5 10 15 20 25 30 35 tp 40 Figure 3. Normalized avalanche power derating versus pulse duration (Tj= 125 °C) PARM (t p ) PARM (10 µs) 0 Tamb(°C) tp δ =tp/T 0 25 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c) /Rth(j-c) 1.0 1 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 0.1 0.001 t p(µs) 1 DS6592 - Rev 5 10 100 1000 0.0 1.E-05 Single pulse t p (s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 page 3/9 STPS3045DJF Characteristics (curves) Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 1.E+02 Figure 6. Junction capacitance versus reverse voltage applied (typical values) IR(mA) C(pF) 10000 Tj = 150 °C 1.E+01 F = 1 MHz Vosc = 30 mV RMS T = 25 °C Tj = 125 °C j Tj = 100 °C 1.E+00 Tj = 75 °C 1000 Tj = 50 °C 1.E-01 Tj = 25 °C 1.E-02 VR(V) 1.E-03 0 5 10 15 20 25 30 35 40 45 Figure 7. Forward voltage drop versus forward current 100 10 100 Figure 8. Thermal resistance junction to ambient versus copper surface under tab IF (A) Rth(j-a) (°C/W) 60 150 55 PowerFlat™_5X6 50 Tj = 125 °C (Maxim um v alues) 45 40 epoxy printed board FR4, eCu = 35 µm 125 100 35 30 Tj = 125 °C (Typical v alues) 25 75 20 Tj = 25 °C (Maxim um v alues) 15 10 50 25 5 VF(V) 0 0.0 VR(V) 1 0.1 DS6592 - Rev 5 0.2 0.3 0.4 0.5 0.6 0.7 0.8 SCu (cm²) 0 0 1 2 3 4 5 6 7 8 9 10 page 4/9 STPS3045DJF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 PowerFLAT™ 5x6 package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 9. PowerFLAT™ 5x6 package outline (non-contractual) Bottom view Side view Top view DS6592 - Rev 5 page 5/9 STPS3045DJF PowerFLAT™ 5x6 package information Table 4. PowerFLAT™ 5x6 mechanical data Dimensions Ref Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 b 0.30 0.50 0.01 0.02 c 0.25 0.010 D 4.80 5.40 0.189 0.212 D2 3.91 4.45 0.154 0.175 e 1.27 0.050 E 5.90 6.35 0.232 0.250 E2 3.34 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.10 1.575 0.015 0.023 L1 0.05 0.25 0.002 0.15 0.006 0.009 Figure 10. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm) DS6592 - Rev 5 page 6/9 STPS3045DJF Ordering information 3 Ordering information Table 5. Ordering information DS6592 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPS3045DJF-TR PS30 45 PowerFLAT™ 5x6 0.095 g 3000 Tape and reel page 7/9 STPS3045DJF Revision history Table 6. Document revision history DS6592 - Rev 5 Date Revision Changes 09-Nov-2009 1 First issue. 05-Jul-2010 2 Replace Power QFN with PowerFLAT™. 20-May-2011 3 Updated package graphics and marking in Table 6. Added Figure 10. 12-Aug-2015 4 Updated cover image and Table 1 on cover page. Updated Table 2 and Section 1.1: Characteristics (curves). 14-Feb-2019 5 Updated Section Cover image, Figure 9. PowerFLAT™ 5x6 package outline (non-contractual) and Table 4. PowerFLAT™ 5x6 mechanical data. Minor text changes to improve readability. page 8/9 STPS3045DJF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS6592 - Rev 5 page 9/9