STPS30H100DJF-TR

STPS30H100DJF Datasheet 100 V, 30 A PowerFLAT power Schottky rectifier Features • • • • • • • • • Low forward voltage drop Very low conduction losses Negligible switching losses Extremely fast switching Low thermal resistance Avalanche rated High integration Thin package: 1 mm ECOPACK2 compliant Applications • • • • Switching diode SMPS DC/DC converter Telecom power Description Product status link STPS30H100DJF Product summary Symbol Value IF(AV) 30 A VRRM 100 V Tj (max.) 150 °C VF (typ.) 0.56 V This Schottky rectifier is ideally suited for switch mode power supply and high frequency DC to DC converters. Packaged in PowerFLAT 5x6, the STPS30H100DJF is optimized for use in low voltage high frequency inverters, free-wheeling and polarity protection applications. Its low profile was especially designed to be used in applications with space-saving constraints. DS8985 - Rev 3 - October 2022 For further information contact your local STMicroelectronics sales office. www.st.com STPS30H100DJF Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified, anode terminals shortcircuited) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 100 V IF(RMS) Forward rms current 45 A IF(AV) Average forward current, δ = 0.5 square wave Tc = 100 °C 30 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 250 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 265 W -65 to +175 °C +150 °C Tstg Tj Storage temperature range Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Rth(j-c) Parameter Junction to case Max. Unit 2 °C/W For more information, please refer to the following application note: • AN5046: Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT packages Table 3. Static electrical characteristics (anode terminals short-circuited) Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 15 A IF = 30 A Min. Typ. - 2.5 - Unit 6 µA 6.5 mA 0.76 0.56 - Max. 0.62 0.84 0.63 V 0.71 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.60 x IF(AV) + 0.00367 x IF2(RMS) For more information, please refer to the following application notes related to the power losses: • • DS8985 - Rev 3 AN604: Calculation of conduction losses in a power rectifier AN4021: Calculation of reverse losses in a power diode page 2/9 STPS30H100DJF Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5) Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Relative variation of thermal impedance junction to case versus pulse duration 1 PARM (t p ) PARM (10 µs) 0.1 0.01 t p(µs) 0.001 1 10 100 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) DS8985 - Rev 3 Figure 6. Junction capacitance versus reverse voltage applied (typical values) page 3/9 STPS30H100DJF Characteristics (curves) Figure 7. Forward voltage drop versus forward current Figure 8. Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 120 PowerFlat_5X6 epoxy printed board FR4, ecu = 70 µm 100 80 60 40 20 SCu(cm²) 0 0 DS8985 - Rev 3 1 2 3 4 5 6 7 8 9 10 page 4/9 STPS30H100DJF Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 PowerFLAT 5x6 package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 9. PowerFLAT 5x6 package outline (non-contractual) Bottom view Side view Top view Note: DS8985 - Rev 3 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 5/9 STPS30H100DJF PowerFLAT 5x6 package information Table 4. PowerFLAT 5x6 mechanical data Dimensions Ref Millimeters Min. Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.80 1.00 0.031 0.039 A1 0.00 0.05 0.000 0.002 b 0.30 0.50 0.01 0.02 c 0.25 0.010 D 4.80 5.40 0.189 0.212 D2 3.91 4.45 0.154 0.175 e 1.27 0.050 E 5.90 6.35 0.232 0.250 E2 3.34 3.70 0.138 0.146 L 0.50 0.80 0.020 0.031 K 1.10 1.575 0.015 0.023 L1 0.05 0.25 0.002 0.15 0.006 0.009 Figure 10. PowerFLAT 5x6 recommended footprint (dimensions are in mm) Note: DS8985 - Rev 3 For packing information, please refer to TN1173. page 6/9 STPS30H100DJF Ordering information 3 Ordering information Table 5. Ordering information DS8985 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STPS30H100DJF-TR PS30 H100 PowerFLAT 5x6 0.095 g 3000 Tape and reel page 7/9 STPS30H100DJF Revision history Table 6. Document revision history DS8985 - Rev 3 Date Version Changes 29-Mar-2012 1 Initial release. 26-Jun-2017 2 Updated cover image and Section 2.1: "PowerFLAT™5x6 package information". 20-Oct-2022 3 Updated cover image and Section 2.1 . page 8/9 STPS30H100DJF IMPORTANT NOTICE – READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgment. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2022 STMicroelectronics – All rights reserved DS8985 - Rev 3 page 9/9