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STPS30H60C

STPS30H60C

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    STPS30H60C - Power Schottky rectifier - STMicroelectronics

  • 数据手册
  • 价格&库存
STPS30H60C 数据手册
www.DataSheet4U.com STPS30H60C Power Schottky rectifier Main product characteristics IF(AV) VRRM Tj VF (typ) 2 X 15 A 60 V 175° C 0.535 V A1 K A2 K A1 A2 Features and benefits ■ ■ ■ ■ ■ TO-220FPAB STPS30H60CFP High junction temperature capability Avalanche rated Low leakage current Good trade-off between leakage current and forward voltage drop High frequency operation A2 K A1 A1 K A2 TO-220AB STPS30H60CT I2PAK STPS30H60CR Description Dual centre tab Schottky rectifier suited for high frequency switch mode power supply. Packaged in TO-220FPAB, TO-220AB, TO-247, I2PAK, and D2PAK, this device is intended to be used in notebook and LCD adaptors and desktop SMPS. In these applications the STPS30H60C provides a good margin between the remaining voltages applied on the diode and the voltage capability of the diode K A2 A1 K A1 A2 D2PAK STPS30H60CG TO-247 STPS30H60CW Order codes Part Number STPS30H60CT STPS30H60CR STPS30H60CG-TR STPS30H60CG STPS30H60CW STPS30H60CFP Marking STPS30H60CT STPS30H60CR STPS30H60CG STPS30H60CG STPS30H60CW STPS30H60CFP March 2007 Rev 2 1/11 www.st.com 11 www.DataSheet4U.com Characteristics STPS30H60C 1 Table 1. Symbol VRRM IF(RMS) Characteristics Absolute ratings (limiting values per diode) Parameter Repetitive peak reverse voltage RMS forward current TO-220AB Tc = 155° C TO-220FPAB Tc = 135° C tp = 10 ms Sinusoidal Tj = 25° C tp = 1 µs Per diode Total package Per diode Total package Value 60 30 15 30 15 30 230 10 200 -65 to + 175 temperature(1) 175 A W °C °C Unit V A A IF(AV) Average forward current, δ = 0.5 IFSM PARM Tstg Tj 1. Surge non repetitive forward current Releative peak avalanche power Storage temperature range Maximum operating junction dP tot 1 -------------- < ------------------------dT j R th ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink Table 2. Symbol Thermal parameters Parameter TO-220AB, I2PAK, D2PAK, TO-247 Per diode Total Per diode Total Value 1.5 0.8 4.7 3.95 0.1 3.2 °C/W Unit Rth(j-c) Junction to case TO-220FPAB Rth(c) Coupling TO-220AB, I2PAK, D2PAK, TO-247 TO-220FPAB Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C Tj = 25° C Tj = 125° C VR = VRRM IF = 7.5 A IF = 15 A IF = 30 A Min. Typ Max. 60 8 435 535 635 25 550 470 660 570 820 690 mV Unit µA mA VF(2) Forward voltage drop 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.45 x IF(AV) + 0.008 x IF2(RMS) 2/11 www.DataSheet4U.com STPS30H60C Characteristics Figure 1. Conduction losses versus average forward current Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) PF(AV)(W) 12 δ=0.05 δ=0.1 δ=0.2 δ=0.5 δ=1 18 16 IF(AV)(A) Rth(j-a)=Rth(j-c) 10 14 TO-220FPAB 8 12 10 6 8 Rth(j-a)=15 °C/W 4 T 6 4 2 2 IF(AV)(A) 0 0 2 4 6 8 10 12 δ=tp/T 14 16 tp Tamb(°C) 0 25 50 75 100 125 150 175 0 18 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1.E+00 PARM(tp) PARM(25°C) 1.2 1.0 1.E-01 0.8 0.6 1.E-02 0.4 0.2 tp(µs) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Tj(°C) 0.0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220AB, TO-247 D2PAK, I2PAK) Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) TO-220FPAB IM(A) 200 180 120 IM(A) 100 160 140 120 100 80 60 40 20 0 1.E-03 IM t δ =0.5 TC=50°C 80 TC=50 °C 60 TC=75°C TC=75 °C 40 TC=125°C 20 IM t δ =0.5 TC=125 °C t(s) 1.E-02 1.E-01 1.E+00 t(s) 1.E-02 1.E-01 1.E+00 0 1.E-03 3/11 www.DataSheet4U.com Characteristics STPS30H60C Figure 7. Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, TO-247 D2PAK, I2PAK) 1.0 0.9 0.8 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 1.E-03 1.E-02 1.E-01 1.E+00 Single pulse δ=0.2 δ=0.1 δ=0.5 Zth(j-c)/Rth(j-c) TO-220FPAB 0.7 0.6 0.5 0.4 T δ=0.2 δ=0.1 δ=0.5 0.3 0.2 T tp(s) δ=tp/T tp 0.1 Single pulse tp(s) 1.E-01 δ=tp/T 1.E+00 tp 0.0 1.E-03 1.E-02 1.E+01 Figure 9. Reverse leakage current versus reverse voltage applied (typical values, per diode) Tj=150°C Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode) C(nF) 10.0 F=1MHz Vosc=30mVRMS Tj=25°C IR(mA) 1.E+02 1.E+01 Tj=125°C Tj=100°C Tj=75°C 1.E+00 1.0 1.E-01 Tj=50°C 1.E-02 Tj=25°C 1.E-03 0 5 10 15 20 25 30 35 VR(V) 40 45 50 55 60 VR(V) 0.1 1 10 100 Figure 11. Forward voltage drop versus forward current (per diode) Figure 12. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, copper thickness = 35 µm) (D2PAK) Rth(j-a)(°C/W) 80 100 IFM(A) TJ=125 °C Maximum values TJ=125 °C Typical values TJ=25 °C Maximum values 70 60 50 40 30 20 10 10 VFM(V) 1 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 0 0 5 10 15 S(cm²) 20 25 30 35 40 4/11 www.DataSheet4U.com STPS30H60C Package mechanical data 2 Package mechanical data ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm TO-220FPAB dimensions Dimensions Ref. Millimeters Min. A A H B Table 4. Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 B D E Dia L6 L2 L3 L5 F1 L4 F2 D L7 F F1 F2 G G1 H L2 E 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G L3 L4 L5 L6 L7 Dia. 5/11 www.DataSheet4U.com Package mechanical data Table 5. TO-220AB dimensions STPS30H60C Dimensions Ref Millimeters Min. A H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/11 www.DataSheet4U.com STPS30H60C Table 6. TO-247 dimensions Package mechanical data DIMENSIONS REF Millimeters Min. A V Inches Min. 0.191 0.086 0.015 0.039 0.118 0.078 Typ. Max. 0.203 0.102 0.031 0.055 Typ. Max. 5.15 2.60 0.80 1.40 4.85 2.20 0.40 1.00 3.00 2.00 2.00 3.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5° 60° 3.55 D E V Dia F F1 H A F2 F3 2.40 3.40 0.078 0.118 0.429 0.094 0.133 L5 L L2 L4 F1 V2 F(x3) M G E F2 F3 F4 L3 D L1 F4 G H L L1 L2 L3 L4 L5 M V V2 Dia. 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5° 60° 3.65 0.139 0.620 0.793 0.169 0.582 0.118 0.143 7/11 www.DataSheet4U.com Package mechanical data Table 7. I2PAK dimensions STPS30H60C DIMENSIONS REF. Millimeters Min. A E L2 c2 Inches Min. Max. Max. A A1 b b1 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 D c c2 L1 L b1 A1 D e e1 E b e e1 c L L1 L2 8/11 www.DataSheet4U.com STPS30H60C Table 8. D2PAK dimensions Package mechanical data DIMENSIONS REF. Millimeters Min. A A E L2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 B D L L3 A1 B2 B G A2 B2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 www.DataSheet4U.com Ordering information STPS30H60C 3 Ordering information Part Number STPS30H60CT STPS30H60CR STPS30H60CG Marking STPS30H60CT STPS30H60CR STPS30H60CG Package TO-220AB I PAK D2PAK D PAK TO-247 TO-220FPAB 2 2 Weight 2.23 g 1.49 g 1.48 g 1.48 g 4.46 g 2.00 g Base qty 50 50 50 1000 30 50 Delivery mode Tube Tube Tube Tape & reel Tube Tube STPS30H60CG-TR STPS30H60CG-TR STPS30H60CW STPS30H60CFP STPS30H60W STPS30H60CFP 4 Revision history Date 27-Feb-2006 31-Mar-2007 Revision 1 2 First issue Added TO-220FPAB package. Updated thermal parameters in Table 2. Description of Changes 10/11 www.DataSheet4U.com STPS30H60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11
STPS30H60C 价格&库存

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