STPS30L40CT

® STPS30L40CG/CT/CW LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCTS CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE AVALANCHERATED DESCRIPTION Dual center tap schottky rectifiers suited for Switched Mode Power Supplies and high frequencyDC to DC converters. Packaged in TO-247, TO-220ABand D2PAK these devices are intended for use in low voltage, high frequency inverters, free-wheeling and polarity protectionapplications. ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 135°C δ = 0.5 Per diode Per device Value 40 30 15 30 220 1 3 - 65 to + 150 150 10000 Unit V A A A A A °C °C V/µs A2 A1 K A1 K A2 2 x 15 A 40 V 150 °C 0.50 V A1 K K A2 A2 A1 D2PAK STPS30L40CG TO-220AB STPS30L40CT TO-247 STPS30L40CW tp = 10 ms Sinusoidal tp=2 µs square F=1kHz tp = 100 µs square *: 1 dPtot thermal runaway condition for a diode on its own heatsink < dTj Rth(j−a) 1/6 July 1999 - Ed: 3A STPS30L40CG/CT/CW THERMAL RESISTANCES Symbol Rth (j-c) Rth (c) Junction to case Parameter Per diode Total Coupling Value 1.60 0.85 0.10 Unit °C/W °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol IR * Parameter Reverse leakage current Forward voltage drop Tests Conditions Tj = 25°C Tj = 100°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Pulse test : * tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.330 x I F(AV) + 0.011 IF2(RMS) IF = 15 A IF = 15 A IF = 30 A IF = 30 A 0.59 0.42 VR = VRRM 20 Min. Typ. Max. 360 50 0.55 0.50 0.74 0.67 Unit µA mA V VF * Fig. 1: Average forward power dissipation versus average forward current (per diode). 12 10 8 6 4 T Fig. 2: Average current versus temperature (δ=0.5) (per diode). IF(av)(A) 18 16 14 12 10 8 6 4 2 0 ambient PF(av)(W) δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Rth(j-a)=Rth(j-c) δ=1 Rth(j-a)=15°C/W T 2 IF(av)A 0 0 2 4 6 8 10 12 14 δ=tp/T tp δ=tp/T tp Tamb( °C) 50 75 100 125 150 16 18 20 0 25 2/6 STPS30L40CG/CT/CW Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values) (per diode). IM(A) 200 180 160 140 120 100 80 60 40 IM 20 0 1E-3 Fig. 4: Relative variation of thermal transient impedance junction to case versus pulse duration. 1.0 0.8 Zth(j-c)/Rth(j-c) Tc=25°C Tc=75°C Tc=125°C t 0.6 0.4 0.2 δ = 0.5 δ = 0.2 δ = 0.1 Single pulse T δ=0.5 t(s) 1E-2 1E-1 1E+0 0.0 1.0E-4 tp(s) 1.0E-3 1.0E-2 δ=tp/T tp 1.0E-1 1.0E+0 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values) (per diode). IR(mA) 2E+2 1E+2 1E+1 1E+0 1E-1 1E-2 Tj=150°C Fig. 6: Junction capacitance versus reverse voltage applied (typical values) (per diode). 2000 1000 500 C(pF) F=1MHz Tj=25 °C Tj=100°C Tj=75°C Tj=25°C 200 VR(V) 0 5 10 15 20 25 30 35 40 100 1 2 VR(V) 5 10 20 50 Fig. 7: Forward voltage drop versus forward current (maximum values) (per diode). Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35µm) (STPS30L40CGonly). Rth(j-a) (°C/W) 80 200 100 IFM(A) Typical values Tj=150°C 70 60 50 40 10 Tj=125°C Tj=25°C 30 20 10 1.4 1.6 1.8 2.0 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 S(Cu) (cm ) 0 5 10 15 20 25 30 35 40 0 3/6 STPS30L40CG/CT/CW PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS REF. H2 Dia L5 C L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. Millimeters Min. Max. 4.40 4.60 1.23 1.32 2.40 2.72 0.49 0.70 0.61 0.88 1.14 1.70 1.14 1.70 4.95 5.15 2.40 2.70 10 10.40 16.4 typ. 13 14 2.65 2.95 15.25 15.75 6.20 6.60 3.50 3.93 2.6 typ. 3.75 3.85 Inches Min. Max. 0.173 0.181 0.048 0.051 0.094 0.107 0.019 0.027 0.024 0.034 0.044 0.066 0.044 0.066 0.194 0.202 0.094 0.106 0.393 0.409 0.645 typ. 0.511 0.551 0.104 0.116 0.600 0.620 0.244 0.259 0.137 0.154 0.102 typ. 0.147 0.151 Cooling method : C Recommended torque value : 0.55 m.N Maximum torque value : 0.70 m.N 4/6 STPS30L40CG/CT/CW PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E L2 C2 Millimeters Min. Max. 4.40 4.60 2.49 2.69 0.03 0.23 0.70 0.93 1.14 1.70 0.45 0.60 1.23 1.36 8.95 9.35 10.00 10.40 4.88 5.28 15.00 15.85 1.27 1.40 1.40 1.75 2.40 3.20 0.40 typ. 0° 8° Inches Min. Max. 0.173 0.181 0.098 0.106 0.001 0.009 0.027 0.037 0.045 0.067 0.017 0.024 0.048 0.054 0.352 0.368 0.393 0.409 0.192 0.208 0.590 0.624 0.050 0.055 0.055 0.069 0.094 0.126 0.016 typ. 0° 8° D L L3 A1 B2 B G A2 C R A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 M * V2 * FLAT ZONE NO LESSTHAN 2mm Cooling method : by conduction (method C) FOOT PRINT (in millimeters) D2PAK 16.90 10.30 1.30 5.08 3.70 8.90 5/6 STPS30L40CG/CT/CW PACKAGE MECHANICAL DATA TO-247 DIMENSIONS REF. V Millimeters Inches 0.203 0.102 0.031 0.055 Min. Typ. Max. Min. Typ. Max. V Dia. H A L5 L L2 L4 F2 F3 V2 F(x3) G = = M E F4 L3 F1 L1 D A 4.85 5.15 0.191 D 2.20 2.60 0.086 E 0.40 0.80 0.015 F 1.00 1.40 0.039 F1 3.00 0.118 F2 2.00 0.078 F3 2.00 2.40 0.078 F4 3.00 3.40 0.118 G 10.90 0.429 H 15.45 15.75 0.608 L 19.85 20.15 0.781 L1 3.70 4.30 0.145 L2 18.50 0.728 L3 14.20 14.80 0.559 L4 34.60 1.362 L5 5.50 0.216 M 2.00 3.00 0.078 V 5° 5° V2 60° 60° Dia. 3.55 3.65 0.139 0.094 0.133 0.620 0.793 0.169 0.582 0.118 0.143 Cooling method : C Recommended torque value : 0.8m.N Maximum torque value : 1.0m.N Ordering type STPS30L40CT STPS30L40CG STPS30L40CG-TR STPS30L40CW Marking STPS30L40CT STPS30L40CG STPS30L40CG STPS30L40CW Package TO-220AB D PAK D PAK TO-247 2 2 Weight 2g 1.8g 1.8g 4.4g Base qty 50 50 500 30 Delivery mode Tube Tube Tape & reel Tube Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1999 STMicroelectronics - Printed in Italy - All rights reserved. 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