STPS30L45C_10

STPS30L45C Low drop power Schottky rectifier Features ■ ■ ■ ■ ■ A1 K low forward voltage drop meaning very small conduction losses low switching losses allowing high frequency operation low thermal resistance avalanche rated insulated package TO-220FPAB: – insulating voltage = 2000 V DC – capacitance = 45 pF avalanche capability specified A2 K K A2 A2 A1 A1 I2PAK STPS30L45CR D2PAK STPS30L45CG ■ Description A2 Dual center tap Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. Packaged in TO-247, TO-220AB, TO-220FPAB, D2PAK and I2PAK this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. A2 A1 K A1 K TO-220AB STPS30L45CT TO-247 STPS30L45CW A2 K A1 TO-220FPAB STPS30L45CFP Table 1. Device summary IF(AV) VRRM Tj (max) VF(max) 2 x 15 A 45 V 150 °C 0.5 V October 2010 Doc ID 8002 Rev 4 1/12 www.st.com 12 Characteristics STPS30L45C 1 Table 2. Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt 1. d Ptot --------------dTj Characteristics Absolute Ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage Forward rms current TO-220FPAB Average forward current TO-220AB, TO-247, I2PAK, D2PAK Tc =110 °C, δ = 0.5 Tc = 135 °C, δ = 0.5 tp = 10 ms Sinusoidal tp = 2 µs square F = 1 kHz tp = 100 µs square tp = 1 µs Tj = 25 °C (1) Value 45 30 Per diode Per device 15 30 220 1 3 6000 -65 to + 150 150 10000 Unit V A A Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage < 1 ------------------------Rth ( j – a ) A A A W °C °C V/µs condition to avoid thermal runaway for a diode on its own heatsink Table 3. Symbol Thermal resistances Parameter TO-220FPAB Per diode Total Per diode Total Value 4 3.2 °C/W TO-220AB, TO-247, I2PAK, D2PAK TO-220FPAB 1.60 0.85 2.5 °C/W 0.10 Unit Rth(j-c) Junction to case Rth(c) Coupling TO-220AB, TO-247, I2PAK, D2PAK When the diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) 2/12 Doc ID 8002 Rev 4 STPS30L45C Table 4. Symbol IR(1) Characteristics Static electrical characteristics (per diode) Parameter Reverse leakage current Test Conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VR = VRRM IF = 15 A IF = 15 A IF = 30 A IF = 30 A 0.59 0.42 Min. Typ. Max. 0.4 100 200 0.55 0.50 V 0.74 0.67 Unit mA mA VF(1) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.330 x IF(AV) + 0.011 IF2(RMS) Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) IF(av)(A) δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 Average forward current versus ambient temperature (δ = 0.5, per diode) PF(av)(W) 12 10 8 6 4 T δ=1 2 IF(av) (A) 0 0 2 4 6 8 10 12 14 δ=tp/T tp 16 18 20 18 16 14 12 10 8 6 4 2 0 Rth(j-a)=Rth(j-c) TO-220AB/TO-247/I²PAK/D²PAK TO-220FPAB Rth(j-a)=15°C/W T δ=tp/T tp Tamb(°C) 50 75 100 125 150 0 25 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1 µs) 1 PARM(Tj) PARM(25 °C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 25 50 75 100 125 150 Doc ID 8002 Rev 4 3/12 Characteristics STPS30L45C Figure 5. Non repetitive surge peak forward current versus overload duration Figure 6. Non repetitive surge peak forward current versus overload duration (TO-220FPAB only) IM(A) 200 180 160 140 120 100 80 60 40 IM 20 0 1E-3 maximum values, per diode 140 120 100 IM(A) maximum values, per diode Tc=25°C Tc=75°C 80 60 40 IM Tc=25°C Tc=75°C Tc=125°C Tc=125°C t t δ=0.5 t(s) 1E-2 1E-1 1E+0 20 0 1E-3 δ=0.5 t(s) 1E-2 1E-1 1E+0 Figure 7. Relative variation of thermal Figure 8. impedance junction to case versus pulse duration 1.0 0.8 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4 0.2 Single pulse δ = 0.5 Zth(j-c)/Rth(j-c) 0.6 0.4 T δ = 0.5 δ = 0.2 δ = 0.1 δ = 0.2 0.2 tp(s) 1E-3 1E-2 δ=tp/T tp δ = 0.1 T Single pulse tp(s) 1E-2 1E-1 0.0 1E-4 1E-1 1E+0 0.0 1E-3 δ=tp/T tp 1E+0 1E+1 Figure 9. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 2000 IR(mA) 5E+2 1E+2 1E+1 1E+0 1E-1 1E-2 Tj=150°C F=1MHz Tj=25°C Tj=125°C Tj=100°C 1000 500 Tj=75°C Tj=25°C 200 VR(V) 0 5 10 15 20 25 30 35 40 45 100 1 2 5 VR(V) 10 20 50 4/12 Doc ID 8002 Rev 4 STPS30L45C Characteristics Figure 11. Forward voltage drop versus forward current (maximum values, per diode) IFM(A) 200 100 Typical values Tj=150°C Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK Rth(j-a) (°C/W) 80 70 60 50 40 30 20 Epoxy printed circuit board FP4, copper thickness = 35 µm 10 Tj=125°C Tj=25°C VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 10 0 0 5 10 15 S(cm²) 20 25 30 35 40 Doc ID 8002 Rev 4 5/12 Package Information STPS30L45C 2 Package Information ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque (TO-220AB, TO-220FPAB): 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. TO-220AB package dimensions Dimensions Ref Millimeters Min. A H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Dia. 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/12 Doc ID 8002 Rev 4 STPS30L45C Package Information Mounting (soldering) the I2PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. Table 6. I2PAK dimensions Dimensions Ref. A E L2 c2 Millimeters Min. Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 A A1 b 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 D b1 c L1 L b1 A1 c2 D e e1 b e e1 c E L L1 L2 Doc ID 8002 Rev 4 7/12 Package Information Table 7. TO-220FPAB package dimensions Dimensions Ref Millimeters Min. A A H B STPS30L45C Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 B D E Dia L6 L2 L3 L5 F1 L4 F2 D L7 F F1 F2 G G1 H L2 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L3 L4 L5 L6 L7 Dia. 8/12 Doc ID 8002 Rev 4 STPS30L45C Table 8. D2PAK package dimensions Package Information Dimensions Ref Millimeters Min. A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 A A1 A2 B D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 L L3 A1 B2 B G A2 B2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. D2PAK footprint dimensions (in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 Doc ID 8002 Rev 4 9/12 Package Information Table 9. TO-247 dimensions STPS30L45C Dimensions Ref. Millimeters Min. A A1 b E A Heat-sink plane ∅P ∅R Inches Min. 0.191 0.086 0.039 0.078 0.118 0.015 0.781 0.608 Max. 0.203 0.102 0.055 0.094 0.133 0.031 0.793 0.620 Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75 4.85 2.20 1.00 2.00 3.00 0.40 19.85 15.45 b1 b2 S D c L2 L1 L 1 2 3 D(1) E b1 b2 b A1 e c 3 2 1 e BACK VIEW 5.45 typ. 14.20 3.70 14.80 4.30 0.215 typ. 0.559 0.145 0.582 0.169 L L1 L2 ∅P (2) 18.50 typ. 3.55 4.50 3.65 5.50 0.728 typ. 0.139 0.177 0.143 0.217 ∅R S 1. Dimension D plus gate protrusion does not exceed 20.5 mm 2. Resin thickness around the mounting hole is not less than 0.9 mm 5.50 typ. 0.216 typ. 10/12 Doc ID 8002 Rev 4 STPS30L45C Ordering Information 3 Ordering Information Table 10. Ordering information Marking STPS30L45CT STPS30L45CG STPS30L45CG STPS30L45CW STPS30L45CR STPS30L45CFP Package TO-220AB D PAK D PAK TO-247 I PAK TO-220FPAB 2 2 2 Order code STPS30L45CT STPS30L45CG STPS30L45CG-TR STPS30L45CW STPS30L45CR STPS30L45CFP Weight 2g 1.8g 1.8g 4.4g 1.4g 1.9 g Base qty 50 50 500 30 50 50 Delivery mode Tube Tube Tape and reel Tube Tube Tube 4 Revision history Table 11. Date Jul-2003 13-Oct-2010 Document revision history Revision 3B 4 Previous issue Added paragraph above Table 6 and updated I2PAK dimensions in Table 6. Updated TO-247 dimensions in Table 9. Changes Doc ID 8002 Rev 4 11/12 STPS30L45C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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