STPS30L60CFP

STPS30L60C Power Schottky rectifier Main product characteristics IF(AV) VRRM Tj (max) VF (max) 2 x 15 A 60 V 150° C 0.56 V A1 K A2 A2 K A1 TO-220FPAB STPS30L60CFP Features and benefits ■ ■ ■ ■ Low forward voltage drop Negligible switching losses Low thermal resistance Avalanche capability specified K A1 A1 A2 K A2 Description Dual center tap Schottky rectifiers suited for switched mode power supplies and high frequency DC to DC converters. Packaged in TO-220FPAB, TO-220, D2PAK, I2PAK and TO-247, this device is intended for use in high frequency inverters. TO-220AB STPS30L60CT I2PAK STPS30L60CR K A2 A1 K A1 A2 D2PAK STPS30L60CG TO-247 STPS30L60CW Order codes Part Number STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG-TR STPS30L60CR STPS30L60CFP Marking STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG STPS30L60CR STPS30L60CFP March 2007 Rev 7 1/11 www.st.com 11 Characteristics STPS30L60C 1 Characteristics Table 1. Symbol VRRM IF(RMS) Absolute ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage RMS forward current Average forward current TO-220AB δ = 0.5 TO-220FPAB δ = 0.5 TC = 130° C TC = 110° C Per diode Per device Per diode Per device Value 60 30 15 30 15 30 230 2 7800 -65 to + 175 temperature(1) 150 10000 Unit V A IF(AV) A IFSM IRRM PARM Tstg Tj dV/dt 1. dPtot --------------dTj Surge non repetitive forward current Repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction < 1 ------------------------Rth ( j – a ) tp = 10 ms Sinusoidal tp = 2 µs square F = 1 kHz tp = 1 µs Tj = 25° C A A W °C °C V/µs Critical rate of rise reverse voltage condition to avoid thermal runaway condition for a diode on its own heatsink Table 2. Symbol Thermal resistances Parameter TO-220AB, I2PAK, D2PAK, TO-247 Per diode Total Per diode Total Value 1.5 0.8 4.7 3.95 0.1 3.2 °C/W Unit Rth(j-c) Junction to case TO-220FPAB Rth(c) Coupling TO-220AB, I2PAK, D2PAK, TO-247 TO-220FPAB When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol IR (1) Static electrical characteristics (per diode) Parameter Reverse leakage current Tests Conditions Tj = 25° C Tj = 125° C Tj = 25° C IF = 15 A IF = 15 A IF = 30 A IF = 30 A 0.65 0.5 VR = VRRM Min. Typ. Max. 480 77 130 0.6 0.56 V 0.75 0.7 Unit µA mA VF (1) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test : tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation : P = 0.42 x IF(AV) + 0.009x IF2(RMS) 2/11 STPS30L60C Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) 18 δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 δ=1 Average forward current versus ambient temperature (δ = 0.5, per diode) Rth(j-a)=Rth(j-c) 12 10 8 6 4 2 PF(av)(W) IF(av)(A) 16 14 12 TO-220FPAB 10 8 6 T Rth(j-a)=15 °C/W 4 T IF(av) (A) 0 0 2 4 6 8 10 12 14 δ=tp/T tp 2 δ=tp/T 0 25 tp Tamb(°C) 50 75 100 125 150 16 18 20 0 Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 PARM(tp) PARM(25°C) 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward Figure 6. current versus overload duration (maximum values, per diode) (TO-220AB, TO-247, D2PAK, I2PAK) 120 Non repetitive surge peak forward current versus overload duration (maximum values, per diode) (TO-220FPAB) TO-220FPAB 250 200 IM(A) IM(A) 100 80 150 Tc=25°C TC=50 °C 60 100 50 IM t Tc=75°C 40 Tc=125°C TC=75 °C IM t 20 0 1E-3 δ=0.5 t(s) 1E-2 1E-1 1E+0 0 1.E-03 δ =0.5 t(s) 1.E-02 1.E-01 TC=125 °C 1.E+00 3/11 Characteristics STPS30L60C Figure 7. Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220AB, TO-247, D2PAK, I2PAK) 1.0 0.9 Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB) Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 0.4 0.2 Zth(j-c)/Rth(j-c) TO-220FPAB 0.8 0.7 δ = 0.5 0.6 0.5 δ=0.5 δ = 0.2 δ = 0.1 0.4 0.3 0.2 δ=0.2 δ=0.1 T Single pulse tp(s) 1E-3 1E-2 1E-1 1E+0 0.0 1E-4 0.1 Single pulse tp(s) 1.E-01 δ=tp/T 1.E+00 tp 0.0 1.E-03 1.E-02 1.E+01 Figure 9. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode) C(nF) 2.0 5E+2 1E+2 1E+1 1E+0 IR(mA) Tj=150°C Tj=125°C Tj=100°C F=1MHz Tj=25°C 1.0 0.5 Tj=75°C Tj=50°C 1E-1 1E-2 Tj=25°C 0.2 VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 VR(V) 0.1 1 10 100 Figure 11. Forward voltage drop versus forward current (maximum values, per diode) Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK (Epoxy printed circuit board FR4, copper thickness: 35 µm) Rth(j-a)(°C/W) 80 70 200 100 IFM(A) Typical values Tj=150°C Tj=25°C 60 50 40 10 30 Tj=125°C 20 VFM(V) 1 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 10 S(cm²) 0 0 5 10 15 20 25 30 35 40 4/11 STPS30L60C Package information 2 Package information ● ● ● ● Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm TO-220FPAB dimensions Dimensions Ref. Millimeters Min. A A H B Table 4. Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 1.15 4.95 2.4 10 B D E Dia L6 L2 L3 L5 F1 L4 F2 D L7 F F1 F2 G G1 H L2 E 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G L3 L4 L5 L6 L7 Dia. 5/11 Package information Table 5. TO-220AB dimensions STPS30L60C Dimensions Ref Millimeters Min. A H2 Dia L5 L7 L6 L2 F2 F1 L9 L4 F G1 G M E D C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/11 STPS30L60C Table 6. D2PAK dimensions Package information DIMENSIONS REF. Millimeters Min. A A E L2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 C2 A2 B D L L3 A1 B2 B G A2 B2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. Footprint (dimensions in millimeters) 16.90 10.30 1.30 5.08 8.90 3.70 7/11 Package information Table 7. I2PAK dimensions STPS30L60C Dimensions Ref. Millimeters Min. A E L2 c2 Inches Min. 0.173 0.094 0.024 0.044 0.019 0.048 0.352 0.094 0.195 0.394 0.512 0.138 0.050 Max. 0.181 0.107 0.035 0.067 0.028 0.052 0.368 0.106 0.203 0.409 0.551 0.155 0.055 Max. 4.60 2.72 0.88 1.70 0.70 1.32 9.35 2.70 5.15 10.40 14 3.93 1.40 A A1 b b1 4.40 2.40 0.61 1.14 0.49 1.23 8.95 2.40 4.95 10 13 3.50 1.27 D c c2 L1 L b1 A1 D e e1 E b e e1 c L L1 L2 8/11 STPS30L60C Table 8. TO-247 dimensions Package information DIMENSIONS REF. Millimeters Min. A V Inches Min. 0.191 0.086 0.015 0.039 0.118 0.078 Typ. Max. 0.203 0.102 0.031 0.055 Typ. Max. 5.15 2.60 0.80 1.40 4.85 2.20 0.40 1.00 3.00 2.00 2.00 3.00 10.90 15.45 19.85 3.70 18.50 14.20 34.60 5.50 2.00 5° 60° 3.55 D E V Dia F F1 H A F2 F3 2.40 3.40 0.078 0.118 0.429 0.094 0.133 L5 L L2 L4 F1 V2 F(x3) M G E F2 F3 F4 L3 D L1 F4 G H L L1 L2 L3 L4 L5 M V V2 Dia. 15.75 0.608 20.15 0.781 4.30 0.145 0.728 14.80 0.559 1.362 0.216 3.00 0.078 5° 60° 3.65 0.139 0.620 0.793 0.169 0.582 0.118 0.143 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STPS30L60C 3 Ordering information Ordering code STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG-TR STPS30L60CR STPS30L60CFP Marking STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CG STPS30L60CR STPS30L60CFP Package TO-247 TO-220AB D2PAK D PAK I PAK TO-220FPAB 2 2 Weight 4.4 g 2.3 g 1.5 g 1.5 g 1.49 g 2.0 g Base qty 50 50 50 1000 50 50 Delivery mode Tube Tube Tube Tape and reel Tube Tube 4 Revision history Date July-2003 16-Oct-2006 28-Nov-2006 07-Mar-2007 31-Mar-2007 Revision 3B 4 5 6 7 Initial release Reformatted to current standards. Corrected dimensions for I2PAK in Table 5. Added TO-220FPAB package. Added STPS30L60CG-TR to ordering information. Updated thermal parameters in Table 2. Updated TC = 110° C in Table 1. Description of Changes 10/11 STPS30L60C Please Read Carefully: Information in this document is provided solely in connection with ST products. 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