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STPS30L60CG

STPS30L60CG

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    STPS30L60CG - POWER SCHOTTKY RECTIFIER - STMicroelectronics

  • 数据手册
  • 价格&库存
STPS30L60CG 数据手册
® STPS30L60CW/CT/CG/CR POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) 2 x 15 A 60 V 150°C 0.56 V A1 K A2 A2 FEATURES AND BENEFITS A1 s s K K A1 A2 s s NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED TO-247 STPS30L60CW TO-220AB STPS30L60CT DESCRIPTION Dual center tap Schottky rectifiers suited for Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in TO-220, D2PAK, I2PAK and TO-247 this device is intended for use in high frequency inverters. A2 K A1 K A1 A2 D2PAK STPS30L60CG I2PAK STPS30L60CR ABSOLUTE RATINGS (limiting values, per diode) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM PARM Tstg Tj dV/dt *: Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 130°C δ = 0.5 Per diode Per device Value 60 30 15 30 230 2 7800 - 65 to + 175 150 10000 Unit V A A A A W °C °C V/µs tp = 10 ms Sinusoidal tp=2 µs square F=1kHz tp = 1µs Tj = 25°C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j − a ) 1/6 July 2003 - Ed: 3B STPS30L60CW/CT/CG/CR THERMAL RESISTANCES Symbol Rth(j-c) Rth(c) Junction to case Parameter Per diode Total Coupling Value 1.5 0.8 0.1 Unit °C/W °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol IR * Parameter Reverse leakage current Forward voltage drop Tests Conditions Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Tj = 25°C Tj = 125°C Pulse test : * tp = 380 µs, δ < 2% Min. Typ. Max. 480 Unit µA mA V VR = VRRM 77 IF = 15 A IF = 15 A IF = 30 A IF = 30 A 0.65 0.5 130 0.6 0.56 0.75 0.7 VF * To evaluate the maximum conduction losses use the following equation : P = 0.42 x IF(AV) + 0.009 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current (per diode). PF(av)(W) 12 10 8 6 4 2 IF(av) (A) 0 0 2 4 6 8 10 12 14 δ=tp/T tp T Fig. 2: Average forward current versus ambient temperature(δ = 0.5, per diode). IF(av)(A) Rth(j-a)=Rth(j-c) δ = 0.1 δ = 0.05 δ = 0.2 δ = 0.5 δ=1 16 18 20 18 16 14 12 10 8 6 4 2 0 Rth(j-a)=15°C/W T δ=tp/T tp Tamb(°C) 50 75 100 125 150 0 25 2/6 STPS30L60CW/CT/CG/CR Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1µs) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25°C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values, per diode). IM(A) Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. 250 200 150 1.0 0.8 0.6 Tc=25°C Tc=75°C Zth(j-c)/Rth(j-c) δ = 0.5 100 50 IM t 0.4 0.2 δ = 0.2 δ = 0.1 Tc=125°C δ=0.5 0 1E-3 t(s) 1E-2 1E-1 1E+0 Single pulse tp(s) 1E-3 1E-2 1E-1 1E+0 0.0 1E-4 Fig. 7: Reverse leakage current versus reverse voltage applied (typical values, per diode). Fig. 8: Junction capacitance versus reverse voltage applied (typical values, per diode). 5E+2 1E+2 1E+1 1E+0 IR(mA) 2.0 Tj=150°C Tj=125°C Tj=100°C C(nF) F=1MHz Tj=25°C 1.0 0.5 Tj=75°C Tj=50°C 1E-1 1E-2 Tj=25°C 0.2 VR(V) 0 5 10 15 20 25 30 35 40 45 50 55 60 0.1 1 VR(V) 10 100 3/6 STPS30L60CW/CT/CG/CR Fig. 9: Forward voltage drop versus forward current (maximum values, per diode). Fig. 10: Thermal resistance junction to ambient versus copper surface under tab for D2PAK (Epoxy printed circuit board FR4, copper thickness: 35µm) Rth(j-a) (°C/W) 80 Typical values Tj=150°C Tj=25°C 200 100 IFM(A) 70 60 50 40 30 Tj=125°C 10 20 VFM(V) 1 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 10 0 0 4 8 12 S(Cu) (cm²) 16 20 24 28 32 36 40 PACKAGE MECHANICAL DATA D2PAK REF. A E L2 C2 D L L3 A1 B2 B G A2 C R M * V2 * FLAT ZONE NO LESS THAN 2mm A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0° 8° 0° 8° FOOTPRINT 16.90 10.30 1.30 5.08 3.70 8.90 4/6 STPS30L60CW/CT/CG/CR PACKAGE MECHANICAL DATA I2PAK DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.70 0.93 0.028 0.037 1.14 1.17 0.044 0.046 1.14 1.17 0.044 0.046 0.45 0.60 0.018 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 2.40 2.70 0.094 0.106 10.0 10.4 0.394 0.409 13.1 13.6 0.516 0.535 3.48 3.78 0.137 0.149 1.27 1.40 0.050 0.055 REF. A E L2 c2 D L1 b2 L b1 b e A1 c A A1 b b1 b2 c c2 D e E L L1 L2 PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 1.23 1.32 0.048 0.051 2.40 2.72 0.094 0.107 0.49 0.70 0.019 0.027 0.61 0.88 0.024 0.034 1.14 1.70 0.044 0.066 1.14 1.70 0.044 0.066 4.95 5.15 0.194 0.202 2.40 2.70 0.094 0.106 10 10.40 0.393 0.409 16.4 typ. 0.645 typ. 13 14 0.511 0.551 2.65 2.95 0.104 0.116 15.25 15.75 0.600 0.620 6.20 6.60 0.244 0.259 3.50 3.93 0.137 0.154 2.6 typ. 0.102 typ. 3.75 3.85 0.147 0.151 REF. A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. H2 Dia L5 C A L7 L6 L2 F2 F1 L9 L4 F G1 G M E D 5/6 STPS30L60CW/CT/CG/CR PACKAGE MECHANICAL DATA TO-247 DIMENSIONS V REF. Dia. Millimeters Max. 5.15 2.60 0.80 1.40 Inches Min. Typ. Max. 0.191 0.203 0.086 0.102 0.015 0.031 0.039 0.055 0.118 0.078 0.078 0.094 0.118 0.133 0.429 0.608 0.620 0.781 0.793 0.145 0.169 0.728 0.559 0.582 1.362 0.216 0.078 0.118 5° 60° 0.139 0.143 V H A L5 L L2 L4 F2 F3 V2 F(x3) G = = M E F4 L3 F1 L1 D Min. Typ. A 4.85 D 2.20 E 0.40 F 1.00 F1 3.00 F2 2.00 F3 2.00 F4 3.00 G 10.90 H 15.45 L 19.85 L1 3.70 L2 18.50 L3 14.20 L4 34.60 L5 5.50 M 2.00 V 5° V2 60° Dia. 3.55 2.40 3.40 15.75 20.15 4.30 14.80 3.00 3.65 s s s COOLING METHOD : C RECOMMENDED TORQUE VALUE : 0.8M.N MAXIMUM TORQUE VALUE : 1.0M.N Ordering type STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CR Marking STPS30L60CW STPS30L60CT STPS30L60CG STPS30L60CR Package TO-247 TO-220AB D PAK I PAK 2 2 Weight 4.4g 2.3g 1.5g 1.49 g Base qty 50 50 50 50 Delivery mode Tube Tube Tube Tube s EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. 6/6
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