STPS30M100DJF
Datasheet
100 V, 30 A power Schottky rectifier
Features
•
•
•
•
•
Very low conduction losses
Low forward voltage drop
Low thermal resistance
High specified avalanche capability
High integration
•
ECOPACK®2 compliant
Applications
•
•
•
•
•
Switching diode
SMPS
DC/DC converter
LED lighting
Desktop power supply
Description
The STPS30M100DJF is a power Schottky rectifier optimized for switch mode power
supply and high frequency DC to DC converters.
Product status link
STPS30M100DJF
Packaged in PowerFLAT™, this device is intended to be used in adaptors requiring
good efficiency at both low and high load. Its low profile was especially designed to
be used in applications with space-saving constraints.
PowerFLATTM is a trademark of STMicroelectronics.
Product summary
Symbol
Value
IF(AV)
30 A
VRRM
100 V
Tj (max.)
150 °C
VF (typ.)
0.66 V
DS6588 - Rev 6 - February 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS30M100DJF
Characteristics
1
Characteristics
Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise specified, anode terminals short
circuited)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
100
V
IF(RMS)
Forward rms current
45
A
IF(AV)
Average forward current, δ = 0.5, square wave
TC = 90 °C
30
A
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
200
A
PARM
Repetitive peak avalanche power
tp = 10 µs , Tj = 125 °C
1080
W
-65 to +175
°C
150
°C
Max. value
Unit
2.5
°C/W
Tstg
Tj
Storage temperature range
Maximum operating junction temperature(1)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameters
Symbol
Rth(j-c)
Parameter
Junction to case
For more information, please refer to the following application note :
•
AN5046 : Printed circuit board assembly recommendations for STMicroelectronics PowerFLAT™ packages
Table 3. Static electrical characteristics (anode terminals short circuited)
Symbol
IR (1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF (1)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 15 A
IF = 30 A
Min.
Typ.
-
10
-
Max.
Unit
100
µA
40
mA
0.82
0.58
0.66
0.96
0.66
V
0.73
1. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.65 x IF(AV) + 0.00267 x IF 2 (RMS)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
DS6588 - Rev 6
page 2/9
STPS30M100DJF
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
30.0
PF(AV)(W)
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
35
25.0
Rth(j-a) = Rth(j-c)
30
δ= 1
δ = 0.5
IF(AV)(A)
25
20.0
δ = 0.2
20
15.0
δ = 0.1
15
δ = 0.05
10.0
10
T
T
5.0
IF(AV)(A)
0.0
0
5
10
15
δ = tp / T
20
25
30
5
tp
δ = tp / T
0
35
Figure 3. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
PARM (t p )
PARM (10 µs)
0
25
Tamb (°C)
50
75
100
125
150
Figure 4. Relative variation of thermal impedance junction
to case versus pulse duration
1.0
1
tp
Zth(j-c)/ Rth(j-c)
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.3
0.01
0.2
0.1
0.001
0.0
1.E-05
t p(µs)
1
DS6588 - Rev 6
10
Single pulse
100
t p (s)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1000
page 3/9
STPS30M100DJF
Characteristics (curves)
Figure 5. Reverse leakage current versus reverse voltage
applied (typical values)
1.E+02
IR(mA)
Figure 6. Junction capacitance versus reverse voltage
applied (typical values)
10000
C(pF)
F = 1 MHz
Vosc = 30 mV RMS
T = 25 °C
Tj = 150 °C
1.E+01
Tj = 125 °C
j
Tj = 100 °C
1.E+00
1000
Tj = 75 °C
1.E-01
Tj = 50 °C
1.E-02
Tj = 25 °C
VR(V)
1.E-03
0
10
20
30
40
50
60
70
80
90
Figure 7. Forward voltage drop versus forward current
60
VR(V)
100
100
1
10
100
Figure 8. Thermal resistance junction to ambient versus
copper surface under tab
IF( A)
Rth(j-a) (°C/W)
150
55
PowerFlat™_5X6
50
Tj= 125 °C
(Maximum values)
45
epoxy printed board FR4, eCu = 35 µm
125
40
35
100
Tj= 125 °C
(Typical values)
30
75
25
20
50
Tj= 25 °C
(Maxim um values)
15
10
5
25
VF (V)
0
0.0
0 .1
0.2
0 .3
0.4
0 .5
0.6
0 .7
0.8
0 .9
1.0
1 .1
SCu (cm²)
1.2
0
0
DS6588 - Rev 6
1
2
3
4
5
6
7
8
9
10
page 4/9
STPS30M100DJF
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK®
packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions
and product status are available at: www.st.com. ECOPACK® is an ST trademark.
2.1
PowerFLAT™ 5x6 package information
•
•
Epoxy meets UL 94,V0
Cooling method: by conduction (C)
Figure 9. PowerFLAT™ 5x6 package outline (non-contractual)
Bottom view
Side view
Top view
DS6588 - Rev 6
page 5/9
STPS30M100DJF
PowerFLAT™ 5x6 package information
Table 4. PowerFLAT™ 5x6 mechanical data
Dimensions
Ref
Millimeters
Min.
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
0.80
1.00
0.031
0.039
A1
0.00
0.05
0.000
0.002
b
0.30
0.50
0.01
0.02
c
0.25
0.010
D
4.80
5.40
0.189
0.212
D2
3.91
4.45
0.154
0.175
e
1.27
0.050
E
5.90
6.35
0.232
0.250
E2
3.34
3.70
0.138
0.146
L
0.50
0.80
0.020
0.031
K
1.10
1.575
0.015
0.023
L1
0.05
0.25
0.002
0.15
0.006
0.009
Figure 10. PowerFLAT™ 5x6 recommended footprint (dimensions are in mm)
DS6588 - Rev 6
page 6/9
STPS30M100DJF
Ordering information
3
Ordering information
Table 5. Ordering information
DS6588 - Rev 6
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS30M100DJF-TR
PS30M 100
PowerFLAT 5x6
0.095 g
3000
Tape and reel
page 7/9
STPS30M100DJF
Revision history
Table 6. Document revision history
Date
Version
Changes
06-Nov-2009
1
First issue.
30-Jul-2010
2
Replace Power QFN with PowerFLAT.
15-Jan-2011
3
Add reference E in Table 5.
20-May-2011
4
Update all package illustrations. Updated base quantity and marking in Table
6. Updated terminal identification in captions of Table 2 and Table 4. Added
Figure 14.
Removed figure 5, figure 6 and figure 12.
11-Jun-2018
5
Updated Table 1. Absolute Ratings (limiting values at 25 °C, unless otherwise
specified, anode terminals short circuited).
Minor text changes to improve readability.
08-Feb-2019
DS6588 - Rev 6
6
Updated Section Cover image, Figure 9. PowerFLAT™ 5x6 package outline
(non-contractual) and Table 4. PowerFLAT™ 5x6 mechanical data.
page 8/9
STPS30M100DJF
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2019 STMicroelectronics – All rights reserved
DS6588 - Rev 6
page 9/9
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