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STPS30SM60CT

STPS30SM60CT

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

    TO-220-3

  • 描述:

    DIODE ARRAY SCHOTTKY 60V TO220AB

  • 数据手册
  • 价格&库存
STPS30SM60CT 数据手册
STPS30SM60C Power Schottky rectifier Features A1 ■ High current capability ■ Avalanche rated ■ Low forward voltage drop ■ High frequency operation K A2 K K A2 A2 Description A1 The STPS30SM60C is a dual diode Schottky rectifier, suited for high frequency switch mode power supply. 2 K A1 D2PAK STPS30SM60CG-TR I2PAK STPS30SM60CR K 2 Packaged in TO-220AB, I PAK and D PAK, this device is intended to be used in notebook, game station and desktop adapters, providing in these applications a good efficiency at both low and high load. Table 1. A2 A1 K TO-220AB STPS30SM60CT Device summary Symbol Value IF(AV) 2 x 15 A VRRM 60 V VF (typ) 0.405 V Tj (max) 150 °C Electrical characteristics(a) Figure 1. I V "Forward" I 2 x IO X IF VRRM VR VAR IO X V IR VTo VF(Io) VF VF(2xIo) "Reverse" IAR a. VARM and IARM must respect the reverse safe operating area defined in Figure 12. VAR and IAR are pulse measurements (tp < 1 µs). VR, IR, VRRM and VF, are static characteristics November 2011 Doc ID 022023 Rev 1 1/10 www.st.com 10 Characteristics 1 STPS30SM60C Characteristics Table 2. Absolute ratings (limiting values, per diode, at Tamb = 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 40 A IF(AV) Average forward current, δ = 0.5 IFSM Tc = 130 °C Per diode 15 Tc = 130 °C Per device 30 A Surge non repetitive forward current tp = 10 ms sine-wave 300 A PARM(1) Repetitive peak avalanche power Tj = 25 °C, tp = 1 µs 14400 W VARM(2) Maximum repetitive peak avalanche voltage tp < 1 µs, Tj < 150 °C, IAR < 54 A 80 V VARM(2) Maximum single-pulse peak avalanche voltage tp < 1 µs, Tj < 150 °C, IAR < 54 A 80 V -65 to +175 °C 150 °C Tstg Tj Storage temperature range Maximum operating junction temperature(3) 1. For temperature or pulse time duration deratings, please refer to Figure 4 and 5. More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the application notes AN1768 and AN2025. 2. See Figure 12 3. 1 dPtot < condition to avoid thermal runaway for a diode on its own heatsink Rth(j-a) dTj Table 3. Thermal parameters Symbol Parameter Rth(j-c) Junction to case Rth(c) Coupling Value per diode 1.5 total 0.85 0.2 When the two diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode 1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) 2/10 Doc ID 022023 Rev 1 Unit °C/W °C/W STPS30SM60C Table 4. Characteristics Static electrical characteristics (per diode) Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C VR = VRRM Tj = 125 °C Tj = 25 °C VF(2) IF = 7.5 A Tj = 125 °C Forward voltage drop Tj = 25 °C IF = 15 A Tj = 125 °C Min. Typ. Max. Unit - 15 65 µA - 10 40 mA - 0.495 0.535 - 0.405 0.455 - 0.565 0.625 - 0.505 0.570 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.415 x IF(AV) + 0.0103 x IF2(RMS) Figure 2. 16 Average forward power dissipation Figure 3. versus average forward current (per diode) PF(AV)(W) IF(AV)(A) 18 δ = 0.05 δ = 0.1 14 δ = 0.5 δ = 0.2 δ=1 Average forward current versus ambient temperature (δ = 0.5, per diode) 16 Rth(j-a) = Rth(j-c) 14 12 12 10 10 8 8 6 6 4 4 T 2 2 δ = tp / T 0 2 4 Figure 4. 1 6 8 10 12 IF(AV)(A) tp 0 14 16 18 20 22 Normalized avalanche power derating versus pulse duration Tamb(°C) 0 0 25 Figure 5. PARM(tp) PARM(1µs) 1.2 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) 1 0.1 0.8 0.6 0.4 0.01 0.2 0.001 0.01 tp(µs) 0.1 1 10 100 1000 0 25 Doc ID 022023 Rev 1 Tj(°C) 50 75 100 125 150 3/10 Characteristics Figure 6. 220 STPS30SM60C Non repetitive surge peak forward current versus overload duration (maximum values, per diode) IM(A) Figure 7. 0.9 180 0.8 160 0.7 140 0.6 Tc = 25 °C 120 100 0.5 Tc = 75 °C 80 0.4 0.3 60 40 Zth(j-c)/Rth(j-c) 1.0 200 Relative thermal impedance junction to case versus pulse duration Tc = 125 °C IM t δ = 0.5 20 0 1.E-03 1.E+02 0.1 t(s) 1.E-02 Figure 8. Single pulse 0.2 1.E-01 1.E+00 Reverse leakage current versus reverse voltage applied (typical values, per diode) tp(s) 0.0 1.E-04 1.E-03 Figure 9. IR(mA) 10000 1.E-02 1.E-01 1.E+00 Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) F = 1 MHz Vosc = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+01 Tj = 125 °C Tj = 100 °C 1.E+00 1000 Tj = 75 °C 1.E-01 Tj = 50 °C 1.E-02 Tj = 25 °C VR(V) 1.E-03 0 10 20 30 40 50 Figure 10. Forward voltage drop versus forward current (per diode) 1000.0 VR(V) 100 1 60 10 100 Figure 11. Thermal resistance junction to ambient versus copper surface under tab IFM(A) 80 Rth(j-a)(°C/W) epoxy printed board copper thickness = 35 µm 70 Tj = 125 °C (Maximum values) 100.0 10.0 2 60 D PAK 50 Tj = 125 °C (Typical values) 40 Tj = 25 °C (Maximum values) 30 1.0 20 10 0.1 0.0 4/10 VFM(V) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 2 SCu(cm ) 0 0 Doc ID 022023 Rev 1 5 10 15 20 25 30 35 40 STPS30SM60C Characteristics Figure 12. Reverse safe operating area (tp < 1 µs and Tj < 150 °C) 60.0 Iarm (A) Iarm (Varm) 150 °C, 1µs 55.0 50.0 45.0 40.0 35.0 Varm (V) 30.0 80 85 90 95 100 105 110 Doc ID 022023 Rev 1 115 120 5/10 Package information 2 STPS30SM60C Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. TO-220AB dimensions Dimensions Ref. Dia Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 D L9 L4 L2 F M G1 16.4 Typ. 0.645 Typ. L4 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 E G M Dia. 6/10 Inches A H2 F1 Millimeters Doc ID 022023 Rev 1 2.6 Typ. 3.75 3.85 0.102 Typ. 0.147 0.151 STPS30SM60C Package information Table 6. D2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm R 0.40 typ. V2 0° 0.016 typ. 8° 0° 8° Figure 13. D2PAK footprint (dimensions in mm) 16.90 10.30 5.08 1.30 8.90 Doc ID 022023 Rev 1 3.70 7/10 Package information Table 7. STPS30SM60C I2PAK dimensions Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.40 2.72 0.094 0.107 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.044 0.067 c 0.49 0.70 0.019 0.028 c2 1.23 1.32 0.048 0.052 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 E 10 10.40 0.394 0.409 L 13 14 0.512 0.551 L1 3.50 3.93 0.138 0.155 L2 1.27 1.40 0.050 0.055 A E c2 L2 D L1 A1 b1 L b c e e1 8/10 Doc ID 022023 Rev 1 STPS30SM60C 3 Ordering information Ordering information Table 8. Ordering information Order code STPS30SM60CT STPS30SM60CR STPS30SM60CG-TR 4 Marking STPS30SM60CT STPS30SM60CR STPS30SM60CG Package Weight TO-220AB Base qty Delivery mode 2.20 g 50 Tube 2 1.49 g 50 Tube 2 1.48 g 1000 Tape and reel I PAK D PAK Revision history Table 9. Revision history Date Revision 02-Nov-2011 1 Changes First issue. Doc ID 022023 Rev 1 9/10 STPS30SM60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 Doc ID 022023 Rev 1
STPS30SM60CT 价格&库存

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