STPS3150AFN

STPS3150 Datasheet 150 V, 3 A power Schottky rectifier Features • • • • • Negligible switching losses Low forward voltage drop for higher efficiency and extended battery life Surface mount miniature package Low thermal resistance ECOPACK2 component Applications • • • • • LED Lighting Battery charger DC / DC converter Notebook adapter Switching diode Description 150 V power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in axial, SMB, SMA Flat Notch and SMB Flat, the STPS3150 is ideal for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. Product status STPS3150 Product summary Symbol Value IF(AV) 3A VRRM 150 V T j(max.) 175 °C VF(typ.) 0.63 V DS3283 - Rev 7 - October 2019 For further information contact your local STMicroelectronics sales office. www.st.com STPS3150 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol VRRM IF(AV) Parameter Repetitive peak reverse voltage Average forward current, δ = 0.5, square wave SMA Flat Notch TL = 130 °C SMB TL = 130 °C SMB Flat TL = 150 °C DO-201AD TL = 140 °C SMA Flat Notch IFSM SMB Surge non repetitive forward current Tstg Tj 3 A A 100 Storage temperature range Maximum operating junction V 80 tp = 10 µs, Tj = 125 °C Repetitive peak avalanche power 150 80 DO-201AD PARM Unit 75 tp = 10 ms sinusoidal SMB Flat Value 210 W -65 to +175 °C +175 °C temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Max. value Junction to lead Junction to lead, lead length = 10 mm SMA Flat Notch 20 SMB 20 SMB Flat 10 DO-201AD 15 Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRM IF = 3 A IF = 6 A Min. Typ. Max. Unit - 0.4 2.0 µA - 0.6 2.0 mA - 0.78 0.82 - 0.63 0.67 - 0.85 0.89 - 0.70 0.75 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% DS3283 - Rev 7 page 2/16 STPS3150 Characteristics To evaluate the conduction losses, use the following equation: P = 0.59 x IF(AV) + 0.027 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS3283 - Rev 7 page 3/16 STPS3150 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 2.5 PF(AV)(W) = 0.05 = 0.1 = 0.2 = 0. =1 Figure 2. Average forward current versus ambient temperature (δ = 0.5) 3.5 IF(AV) (A) Rth(j-a)=Rth(j-l) 3.0 2.0 SMB-Flat 2.5 DO-201AD 1.5 2.0 SMA-Flat Notch, SMB 1.5 1.0 T T 1.0 0.5 0.5 IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 tp δ =tp/T tp =tp/T 3.5 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) 0.0 0 50 75 100 125 150 17 5 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 1.0 1 25 Tamb (°C) Zth(j-a)/Rth(j-a) SMB 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 Single pulse 0.1 0.001 t p(µs) 1 tp(s) 0.0 1.E-02 10 100 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1000 Figure 5. Relative variation of thermal impedance junction Figure 6. Relative variation of thermal impedance junction to lead versus pulse duration (SMB flat) to ambient versus pulse duration (DO-201AD) 1.0 Zth(j-l)/Rth(j-l) 1.0 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.2 Single pulse 0.1 0.0 1.E-04 DS3283 - Rev 7 Zth(j-a)/Rth(j-a) DO-201AD SMBflat 1.E-03 1.E-02 Single pulse 0.1 tp(s) 1.E-01 1.E+00 1.E+01 0.0 1.E-01 tp(s) 1.E+00 1.E+01 1.E+02 1.E+03 page 4/16 STPS3150 Characteristics (curves) Figure 7. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 IR(µA) Figure 8. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F = 1 MHZ VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+03 Tj = 125 °C 1.E+02 Tj = 100 °C Tj = 75 °C 1.E+01 100 Tj = 50 °C 1.E+00 Tj = 25 °C 1.E-01 VR(V) 1.E-02 0 25 50 VR(V) 75 100 125 150 Figure 9. Forward voltage drop versus forward current 100 10 1 10 100 1000 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMA Flat Notch) Rth(j-a) (°C/W) IF(A) 200 Tj = 125 °C (maximum values) Epoxy printed circuit board FR4, copper thickness: 35 µm SMA Flat Notch Tj = 125 °C (typical values) 150 Tj = 25 °C (maximum values) 10 100 50 S(Cu)(cm²) VF(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 0.0 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat) Rth(j-a) (°C/W) 200 0.5 Rth(j-a) (°C/W) SMB flat Epoxy printed circuit board FR4, eCu = 35 µm SMB 150 150 100 100 50 50 S(Cu)(cm²) SCu (cm²) 0 0 0.0 0.5 DS3283 - Rev 7 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 5/16 STPS3150 Characteristics (curves) Figure 13. Thermal resistance versus lead length Rth (°C/W) 90 DO-201AD R 80 th(j - a) 70 60 50 40 Rth(j-l) 30 20 10 0 5 DS3283 - Rev 7 L leads (mm) 10 15 20 25 page 6/16 STPS3150 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMA Flat Notch package information • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Band indicates cathode Figure 14. SMA Flat Notch package outline DS3283 - Rev 7 page 7/16 STPS3150 SMA Flat Notch package information Table 4. SMA Flat Notch package mechanical data Dimensions Ref. Millimeters Min. A1 Inches (for reference only) Typ. 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.044 0.002 b 1.25 1.65 0.049 0.065 C 0.15 0.40 0.005 0.016 D 2.25 2.90 0.088 0.115 E 5.00 5.35 0.196 0.211 E1 3.95 4.60 0.155 0.182 G 2.00 0.079 G1 0.85 0.033 L 0.75 1.20 0.029 L1 0.45 0.018 L2 0.45 0.018 L3 0.05 0.002 V 8° 8° V1 8° 8° Figure 15. SMA Flat Notch recommended footprint in mm (inches) 1.20 3.12 1.20 (0.047) (0.123) (0.047) 1.52 (0.060) 5.52 (0.217) DS3283 - Rev 7 page 8/16 STPS3150 SMB package information 2.2 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 16. SMB package outline E1 D E A1 C A2 L b Table 5. SMB package mechanical data Dimensions Millimeters Ref. DS3283 - Rev 7 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 page 9/16 STPS3150 SMB package information Figure 17. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS3283 - Rev 7 page 10/16 STPS3150 SMB Flat package information 2.3 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 18. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 6. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS3283 - Rev 7 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 L1 0.40 0.016 L2 0.60 0.024 page 11/16 STPS3150 SMB Flat package information Figure 19. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS3283 - Rev 7 page 12/16 STPS3150 DO-201AD package information 2.4 DO-201AD package information • Epoxy meets UL 94, V0 Figure 20. DO-201AD package outline B A E No te 1 B E No te 1 ØD No te 2 ØC Table 7. DO-201AD package mechanical data Dimensions Millimeters Ref. Min. A B 25.40 Inches (for reference only) Typ. Max. - 9.50 - Min. 1.000 Typ. Max. - 0.374 - C - 5.30 - 0.209 D(1) - 1.30 - 0.051 E - 1.25 Note 2(2) 15.00 0.049 0.590 1. The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) DS3283 - Rev 7 page 13/16 STPS3150 Ordering Information 3 Ordering information Table 8. Ordering information DS3283 - Rev 7 Order code Marking Package Weight Base qty. Delivery mode STPS3150U G315 SMB 0.107 g 2500 Tape and reel STPS3150UF FG315 SMB Flat 0.050 g 5000 Tape and reel STPS3150 STPS3150 DO-201AD 1.120 g 600 Ammopack STPS3150RL STPS3150 DO-201AD 1.120 g 1900 Tape and reel STPS3150AFN A3150 SMA Flat Notch 0.039 g 10 000 Tape and reel page 14/16 STPS3150 Revision history Table 9. Document revision history DS3283 - Rev 7 Date Version Changes May-2003 2A 31-May-2006 3 8-Feb-2007 4 Added SMB flat and SMB flat e package. 20-Jul-2011 5 Updated Table 2. 11-Aug-2016 6 Updated Table 2 and all curves. 08-Oct-2019 7 Added Section 2.1 SMA Flat Notch package information. Last update. Reformatted to current standard. Added ECOPACK statement. Updated SMB footprint in Figure 12. Changed nF to pF in Figure 8. page 15/16 STPS3150 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved DS3283 - Rev 7 page 16/16