STPS3150RL

STPS3150 Power Schottky rectifier Main product characteristics A A IF(AV) VRRM Tj (max) VF (max) 3A 150 V 175° C 0.67 V K K SMB STPS3150U A DO-201AD STPS3150 Features and benefits ■ ■ ■ Negligible switching losses Low forward voltage drop for higher efficiency and extented battery life Low thermal resistance K SMB flat STPS3150UF Description 150 V Power Schottky rectifier are suited for switch mode power supplies on up to 24 V rails and high frequency converters. Packaged in Axial, SMB, and low-profile SMB, this device is intended for use in consumer and computer applications like TV, STB, PC and DVD where low drop forward voltage is required to reduce power dissipation. Table 1. Symbol VRRM IF(AV) Repetitive peak reverse voltage SMB Average forward current Order Codes Part Number STPS3150U STPS3150 STPS3150RL STPS3150UF Marking G315 STPS3150 STPS3150 FG315 Absolute Ratings (limiting values) Parameter TL = 130° C δ = 0.5 TL = 140° C δ = 0.5 TL = 150° C δ = 0.5 100 tp = 10 ms sinusoidal 150 100 -65 to + 175 175 °C °C A Value 150 Unit V DO-201AD SMB flat SMB 3 A IFSM Tstg Tj 1. dPtot --------------dTj Surge non repetitive forward current Storage temperature range Operating junction < 1 ------------------------Rth ( j – a ) DO-201AD SMB flat temperature(1) condition to avoid thermal runaway for a diode on its own heatsink February 2007 Rev 4 1/10 www.st.com 10 Characteristics STPS3150 1 Table 2. Symbol Characteristics Thermal resistance Parameter SMB flat Rth(j-l) Junction to lead Lead length = 10 mm SMB DO-201AD Value 10 20 15 ° C/W Unit Table 3. Symbol IR (1) Static electrical characteristics Parameter Reverse leakage current Tests conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ 0.4 0.6 0.78 IF = 3 A 0.63 0.85 IF = 6 A 0.70 Max. 2.0 2.0 0.82 0.67 V 0.89 0.75 Unit µA mA VF (2) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. tp = 5 ms, δ < 2% 2. tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.59 x IF(AV) + 0.023 IF2(RMS) Figure 1. Average forward power dissipation versus average forward current δ = 0.1 δ = 0.05 δ=1 δ = 0.2 δ = 0.5 Figure 2. Average forward current versus ambient temperature (δ = 0.5) (DO-201AD / SMB) PF(AV)(W) 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 2.5 1.0 1.5 3.5 3.0 2.5 2.0 IF(AV)(A) Rth(j-a)=Rth(j-I) DO-201AD SMB Rth(j-a)=75°C/W T 0.5 T IF(AV)(A) δ=tp/T 3.0 tp 0.0 3.5 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 175 2/10 STPS3150 Characteristics Figure 3. Average forward current versus ambient temperature (δ = 0.5) (SMB flat) Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) IF(AV)(A) 3.5 Rth(j-a)=Rth(j-l) IM(A) 12 11 10 9 8 Ta=25°C SMB 3.0 2.5 2.0 SMB flat 7 6 5 Rth(j-a)=40°C/W . SCU=2.5 cm2 1.5 1.0 Ta=75°C 4 3 2 IM t Ta=125°C T 0.5 0.0 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 175 1 0 1.E-03 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (DO-201AD) Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat IM(A) 14 DO-201AD IM(A) 50 45 40 12 10 8 Ta=75°C Ta=25°C 35 30 TL=25°C 25 TL=75°C 6 4 IM 20 Ta=125°C 15 10 IM t TL=125°C 2 t δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 5 0 1.E-03 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 0 1.E-03 Figure 7. Normalized avalanche power derating versus pulse duration Figure 8. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 PARM(tp) PARM(25°C) 0.1 0.8 0.6 0.4 0.2 0.01 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 25 50 75 100 125 150 3/10 Characteristics STPS3150 Figure 9. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (DO-2001AD) Zth(j-a)/Rth(j-a) 1.0 DO-201AD Zth(j-a)/Rth(j-a) 1.0 SMB 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.9 0.8 0.7 0.6 0.5 0.4 0.3 T 0.2 0.1 0.0 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 Single pulse T 0.2 Single pulse tp(s) δ=tp/T tp 0.1 0.0 1.E-01 1.E+00 tp(s) 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 Figure 11. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse Figure 12. Reverse leakage current versus reverse voltage applied (typical values) IR(µA) 1.E+04 Tj=150°C SMB flat 1.E+03 Tj=125°C 1.E+02 Tj=100°C 1.E+01 Tj=75°C 1.E+00 Tj=50°C 1.E-01 Tj=25°C 0.1 0.0 1.E-04 1.E-03 1.E-02 tp(s) 1.E-02 1.E-01 1.E+00 1.E+01 0 25 50 VR(V) 75 100 125 150 Figure 13. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Figure 14. Forward voltage drop versus forward current IFM(A) 100 Tj=125°C (maximum values) Tj=125°C (typical values) Tj=25°C (maximum values) 100 10 VR(V) 10 1 10 100 1000 1 0.0 0.2 0.4 0.6 0.8 VFM(V) 1.0 1.2 1.4 1.6 1.8 4/10 STPS3150 Characteristics Figure 15. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB) Rth(j-a)(°C/W) 110 100 90 SMB Figure 16. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (DO-201AD) Rth(°C/W) 90 DO-201AD 80 70 Rth(j-a) 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 60 50 40 30 Rth(j-I) SCu(cm²) 10 0 5 10 Lleads(mm) 15 20 25 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB flat) Rth(j-a)(°C/W) 110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMB flat SCU(cm²) 5/10 Package information STPS3150 2 Package information ● Epoxy meets UL94, V0. SMB dimensions Dimensions Ref. E1 Table 4. Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L Figure 18. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 6/10 STPS3150 Table 5. SMB Flat dimensions Package information Dimensions Ref. A c D L L2 E E1 L L1 b Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029 Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024 A b(1) c (1) 0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60 1.10 2.20 0.40 3.95 5.60 4.60 1.50 D E E1 L L1 L2 1. Applies to plated leads Figure 19. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 7/10 Package information Table 6. DO-201AD Package dimensions STPS3150 DIMENSIONS B Note 1 A E E Note 1 B REF. Millimeters Min. Max. 9.50 25.40 5.30 1.30 1.25 15 Inches Min. Max. 0.374 1.000 0.209 0.051 0.049 0.59 ØD Note 2 A ØC B C D(1) E Note 2(2) 1. The lead diameter D is not controlled over zone E 2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”) In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 8/10 STPS3150 Ordering information 3 Ordering information Ordering type STPS3150U STPS3150UF STPS3150 STPS3150RL Marking G315 FG315 STPS3150 STPS3150 Package SMB SMB flat DO-201AD DO-201AD Weight 0.107 g 0.50 g 1.12 g 1.12 g Base qty 2500 5000 600 1900 Delivery mode Tape and reel Tape and reel Ammopack Tape and reel 4 Revision history Date May-2003 31-May-2006 08-Feb-2007 Revision 2A 3 4 Last update. Reformatted to current standard. Added ECOPACK statement. Updated SMB footprint in Figure 12. Changed nF to pF in Figure 8. Added SMB flat package. Description of Changes 9/10 STPS3150 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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