STPS3150UY

STPS3150-Y Datasheet Automotive 150 V, 3 A power Schottky rectifier A K Features • • • • • • A K AEC-Q101 qualified Negligible switching losses Low forward voltage drop for higher efficiency and extended battery life Surface mount miniature package Low thermal resistance ECOPACK2 component SMB Applications • • • • DC / DC converter Reverse polarity protection Freewheeling diodes Switching diode Description Packaged in SMB, this device is intended for use in automotive applications where low drop forward voltage is required to reduce power dissipation. Product status STPS3150-Y Product summary Symbol Value IF(AV) 3A VRRM 150 V T j(max.) 175 °C VF(typ.) 0.63 V DS7256 - Rev 2 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS3150-Y Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit 150 V VRRM Repetitive peak reverse voltage, Tj = -40 °C to +175 °C IF(AV) Average forward current, δ = 0.5, square wave TL = 130 °C 3 A IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 80 A Tstg Storage temperature range -65 to +175 °C Operating junction temperature range(1) -40 to +175 °C Tj 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Max. value Unit 20 °C/W Junction to lead For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 3 A IF = 6 A Min. Typ. Max. Unit - 0.4 2.0 µA - 0.6 2.0 mA - 0.78 0.82 - 0.63 0.67 - 0.85 0.89 - 0.70 0.75 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.59 x IF(AV) + 0.027 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS7256 - Rev 2 page 2/9 STPS3150-Y Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 2.5 PF(AV)(W) = 0.05 = 0.1 = 0.2 = 0. =1 Figure 2. Average forward current versus ambient temperature (δ = 0.5) IF(AV) (A) 3.5 SMB Rth(j-a)=Rth(j-l) 3.0 2.0 2.5 1.5 2.0 1.5 1.0 T T 1.0 0.5 0.5 IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 tp δ =tp/T tp =tp/T 3.5 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) PARM (t p ) PARM (10 µs) 0.0 0 50 75 100 125 150 17 5 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 1.0 1 25 Tamb (°C) Zth(j-a)/Rth(j-a) SMB 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 Single pulse 0.1 0.001 t p(µs) 1 10 100 1.E-01 1.E+00 1.E+01 1.E+02 IR(µA) Figure 6. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+03 1.E+03 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 tp(s) 0.0 1.E-02 Tj = 125 °C 1.E+02 Tj = 100 °C Tj = 75 °C 1.E+01 100 Tj = 50 °C 1.E+00 Tj = 25 °C 1.E-01 VR(V) 1.E-02 0 DS7256 - Rev 2 25 50 75 VR(V) 100 125 150 10 1 10 100 1000 page 3/9 STPS3150-Y Characteristics (curves) Figure 7. Forward voltage drop versus forward current 100 Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (SMB)(typical values) IF(A) Rth(j-a) (°C/W) Tj = 125 °C (maximum values) Tj = 125 °C (typical values) 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm SMB 150 Tj = 25 °C (maximum values) 10 100 50 1 0.0 S(Cu)(cm²) VF(V) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 0.0 DS7256 - Rev 2 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/9 STPS3150-Y Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 9. SMB package outline E1 D E A1 C A2 L DS7256 - Rev 2 b page 5/9 STPS3150-Y SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.074 0.097 A2 0.05 0.20 0.001 0.008 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 Figure 10. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS7256 - Rev 2 page 6/9 STPS3150-Y Ordering Information 3 Ordering information Table 5. Ordering information DS7256 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode STPS3150UY G315Y SMB 0.107 g 2500 Tape and reel page 7/9 STPS3150-Y Revision history Table 6. Document revision history DS7256 - Rev 2 Date Version Changes 03-Nov-2011 1 Initial release. 16-Jan-2020 2 Updated Figure 1, Figure 2 and Figure 8. page 8/9 STPS3150-Y IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS7256 - Rev 2 page 9/9