STPS340B

STPS340 Power Schottky rectifier Main product characteristics K IF(AV) VRRM Tj (max) VF (max) 3A A 40 V 150° C 0.57 V A NC DPAK STPS340B A Features and Benefits ■ ■ ■ ■ ■ ■ ■ Very small conduction losses Negligible switching losses Low forward voltage drop Low thermal resistance Extremely fast switching Surface mounted device Avalanche capability specified K K SMB STPS340U SMC STPS340S A K Description Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in DPAK, SMC, SMB, and low profile SMB, this device is intended for use in low and medium voltage operation, high frequency inverters, free wheeling and polarity protection applications where low switching losses are required. SMB flat STPS340UF Order codes Part Number STPS340U STPS340S STPS340B STPS340B-TR STPS340UF Marking U34 S34 S340 S340 FU34 February 2007 Rev 9 1/11 www.st.com 11 Characteristics STPS340 1 Characteristics Table 1. Symbol VRRM IF(RMS) Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage RMS forward current Tc = 135° C δ = 0.5 DPAK DPAK SMB/SMC SMB flat 75 1300 -65 to + 150 (1) Value 40 6 Unit V A IF(AV) Average forward current TL = 105° C δ = 0.5 TL = 115° C δ = 0.5 3 A IFSM PARM Tstg Tj 1. dPtot --------------dTj Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature < 1 ------------------------Rth ( j – a ) tp =10 ms sinusoidal tp = 1 µs Tj = 25° C A W °C °C 150 condition to avoid thermal runaway for a diode on its own heatsink Table 2. Symbol Thermal resistance Parameter SMB Value 25 15 20 5.5 °C/W °C/W Unit Rth(j-l) Junction to lead SMB flat SMC Rth(j-c) Junction to case DPAK Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Min. Typ. Max. 20 2 10 0.63 IF = 3 A 0.52 0.57 V 0.84 IF = 6 A 0.63 0.72 Unit µA mA VF(1) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.050 IF2(RMS) 2/11 STPS340 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current (per diode) IF(AV)(A) 3.5 Average forward current versus ambient temperature (δ = 0.5, per diode) (DPAK / SMB / SMC) PF(AV)(W) 2.5 δ = 0.05 2.0 δ = 0.1 δ = 0.2 δ = 0.5 3.0 Rth(j-a)=Rth(j-l) DPAK δ=1 1.5 2.5 SMB / SMC 2.0 1.5 1.0 Rth(j-a)=65°C/W 1.0 0.5 T 0.5 T IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 δ=tp/T 3.5 tp 0.0 4.0 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 Figure 3. Average forward current versus ambient temperature (δ = 0.5, per diode) (SMB flat) Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) (DPAK) IF(AV)(A) 3.5 Rth(j-a)=Rth(j-l) IM(A) 60 DPAK 3.0 2.5 50 40 2.0 SMB flat 30 Tc=25°C Tc=75°C 1.5 1.0 Rth(j-a)=40°C/W . SCU=2.5 cm2 20 IM t T 0.5 0.0 0 10 Tc=125°C δ=tp/T 25 tp 50 Tamb(°C) 0 75 100 125 150 1.E-03 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) (SMB) SMB Figure 6. Non repetitive surge peak forward current versus overload duration (maximum values) (SMC) SMC IM(A) 10 9 8 7 Ta=25°C IM(A) 12 11 10 9 8 7 6 Ta=75°C Ta=75°C Ta=25°C 6 5 4 3 2 1 0 1.E-03 1.E-02 1.E-01 1.E+00 IM t 5 4 3 Ta=125°C 2 δ=0.5 IM t Ta=125°C t(s) 1 0 1.E-03 δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 3/11 Characteristics STPS340 Figure 7. Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat SMB flat Figure 8. Normalized avalanche power derating versus pulse duration IM(A) 25 PARM(tp) PARM(1µs) 1 20 15 TL=25°C 0.1 TL=75°C 10 0.01 TL=125°C 5 IM t δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 0.001 0.01 0.1 1 tp(µs) 10 100 1000 0 1.E-03 Figure 9. Normalized avalanche power derating versus junction temperature Figure 10. Relative variation of thermal impedance junction to ambient versus pulse duration (DPAK) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 DPAK PARM(tp) PARM(25°C) 1.2 1 0.7 0.8 0.6 0.4 0.2 0.6 0.5 0.4 0.3 0.2 Single pulse T Tj(°C) 0 25 50 75 100 125 150 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 δ=tp/T tp 1.E+00 Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 Single pulse Figure 12. Relative variation of thermal impedance junction to ambient versus pulse duration (SMC) Zth(j-a)/Rth(j-a) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 SMC SMB T 0.2 Single pulse T 0.1 0.0 1.E-02 1.E-01 1.E+00 tp(s) 1.E+01 0.1 δ=tp/T 1.E+02 tp 1.E+03 tp(s) 1.E-01 1.E+00 1.E+01 0.0 1.E-02 δ=tp/T 1.E+02 tp 1.E+03 4/11 STPS340 Characteristics Figure 13. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 SMB flat Figure 14. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) 1.E+01 Tj=150°C 1.E+00 Tj=125°C Tj=100°C 1.E-01 Tj=75°C 1.E-02 Tj=25°C 0.2 Single pulse 1.E-03 0.1 0.0 1.E-04 1.E-03 1.E-02 tp(s) 1.E-04 1.E-01 1.E+00 1.E+01 VR(V) 0 5 10 15 20 25 30 35 40 Figure 15. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Figure 16. Forward voltage drop versus forward current IFM(A) 10 Tj=125°C (Maximum values) 1 100 Tj=125°C (Typical values) 0 Tj=25°C (Maximum values) VR(V) 10 1 10 100 VFM(V) 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 17. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (DPAK) Rth(j-a)(°C/W) 100 90 80 70 60 50 DPAK Figure 18. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB / SMC) Rth(j-a)(°C/W) 110 100 90 80 70 60 50 SMB / SMC 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 40 30 20 SCU(cm²) 10 0 0.0 0.5 1.0 1.5 2.0 SCU(cm²) 2.5 3.0 3.5 4.0 4.5 5.0 5/11 Package Information STPS340 Figure 19. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU = 35 µm) (SMB flat) Rth(j-a)(°C/W) 110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMB flat SCU(cm²) 2 Package Information ● ● Band indicates cathode on SMB and SMC Epoxy meets UL94, V0 DPAK dimensions Dimensions Ref Millimeters Min. A E B2 C2 L2 A Table 4. Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 Max. 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 A1 A2 B D B2 C C2 H L4 B G A1 R R C D E A2 0.60 MIN. G H V2 L2 L4 V2 0.80 typ. 0.60 0° 1.00 8° 0.031 typ. 0.023 0° 0.039 8° 6/11 STPS340 Figure 20. DPAK footprint dimensions (in millimeters) 6.7 3 3 1.6 Package Information 2.3 6.7 2.3 1.6 Table 5. SMB dimensions Dimensions Ref. E1 Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059 D A1 A2 b 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E c A1 E E1 b C L A2 D L Figure 21. SMB footprint (dimensions in mm) 1.62 2.60 1.62 2.18 5.84 7/11 Package Information Table 6. SMB Flat dimensions Dimensions Ref. A c D L L2 E E1 L L1 b STPS340 Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029 Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024 A b(1) c (1) 0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60 1.10 2.20 0.40 3.95 5.60 4.60 1.50 D E E1 L L1 L2 1. Applies to plated leads Figure 22. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 8/11 STPS340 Table 7. SMC package mechanical data Package Information Dimensions Ref E1 Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.40 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A1 D 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 A2 b E c E A1 E1 C A2 E2 L b E2 D L Figure 23. Foot print dimensions (in millimeters) 1.54 5.03 1.54 3.15 8.11 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STPS340 3 Ordering information Ordering type STPS340U STPS340S STPS340B S340 STPS340B-TR STPS340UF FU34 SMB flat 0.50 g DPAK 0.30 g 2500 5000 Tape and reel Tape and reel Marking U34 S34 Package SMB SMC Weight 0.107 g 0.243 g Base qty 2500 Tape and reel 2500 75 Tube Delivery mode 4 Revision history Date Jul-2003 Feb-2005 08-Feb-2007 Revision 7B 8 9 Last update. Layout update. No content change. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Description of Changes 10/11 STPS340 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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