STPS360AF

STPS360 Power Schottky rectifier Datasheet - production data Description K This high voltage Schottky barrier rectifier device is packaged in SOD128Flat and designed for high frequency miniature switched mode power supplies and on board DC to DC converters. A Table 1: Device summary SOD128Flat Symbol Value IF(AV) 3A VRRM 60 V Tj(max.) 175 °C VF(typ.) 0.49 V Features       Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche specification ECOPACK® compliant component July 2016 DocID029486 Rev 1 This is information on a product in full production. 1/8 www.st.com Characteristics 1 STPS360 Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol VRRM Parameter Repetitive peak reverse voltage Value Unit 60 V 3 A IF(AV) Average forward current TL = 140 °C, δ = 0.5, square pulse IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 65 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 140 W Tstg Storage temperature range -65 to +175 °C -40 to +175 °C Tj Operating junction temperature range(1) Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Rth(j-l) Parameter Max. value Unit 16 °C/W Junction to lead Table 4: Static electrical characteristics Symbol IR(1) Parameter Test conditions Reverse leakage current Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = 60 V IF = 3 A IF = 6 A Typ. - 20 - Unit 150 µA 30 mA 0.61 0.49 - Max. 0.58 0.80 0.62 0.72 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.44 x IF(AV) + 0.047 x IF2(RMS) For more information, please refer to the following application notes related to the power losses.   2/8 AN604 (Calculation of conduction losses in a power rectifier) AN4021 (Calculation of reverse losses in a power diode) DocID029486 Rev 1 V STPS360 Characteristics 1.1 Characteristics (curves) Figure 1: Average forward power dissipation versus average forward current 2.5 Figure 2: Average forward current versus ambient temperature (δ = 0.5) 10 PF(AV)(W) IF(AV)(A) Rth(j-a) = Rth(j-l) δ = 0.05 δ = 0.1 δ = 0.5 δ = 0.2 δ= 1 8 2.0 1.5 6 1.0 4 T 0.5 0.0 0.0 0.5 1.0 1.5 2.0 T 2 IF(AV)(A) δ = tp /T 2.5 3.0 tp 3.5 4.0 δ = tp/T 0 Figure 3: Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 PARM (t p ) PARM (10 µs) Tamb (°C) tp 0 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to lead versus pulse duration Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 Single pulse t p (µs) 0.1 0.001 1 10 100 t P(s) 0.0 1.E-04 1000 Figure 5: Reverse leakage current versus reverse voltage applied (typical values) 1.E-02 1.E-01 1.E+00 1.E+01 Figure 6: Junction capacitance versus reverse voltage applied (typical values) 1000 1.E+02 1.E-03 C(pF) IR(mA) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 125 °C 1.E+01 Tj = 100 °C 1.E+00 Tj = 75 °C 100 Tj = 50 °C 1.E-01 Tj = 25 °C 1.E-02 VR(V) VR(V) 1.E-03 0 10 20 30 40 50 60 10 1 DocID029486 Rev 1 10 100 3/8 Characteristics STPS360 Figure 7: Forward voltage drop versus forward current (typical values) Figure 8: Thermal resistance junction to ambient versus copper surface under each lead (typical values) 200 Rth(j-a)(°C/W) SOD128-Flat 150 100 Epoxy printed board FR4, eCu = 35 µm 50 SCu(cm²) 0 0.0 4/8 DocID029486 Rev 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Package information STPS360 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Epoxy meets UL94, V0 Lead-free package SOD128Flat package information Figure 9: SOD128Flat package outline DocID029486 Rev 1 5/8 Package information STPS360 Table 5: SOD128Flat package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 0.93 1.03 0.037 0.041 b 1.69 1.81 0.067 0.071 c 0.10 0.22 0.004 0.009 D 2.30 2.50 0.091 0.098 E 4.60 4.80 0.181 0.189 E1 3.70 3.90 0.146 0.154 L 0.55 0.85 0.026 0.033 L1 0.30 typ. 0.012 typ. L2 0.45 typ. 0.018 typ. Figure 10: SOD128Flat footprint in mm (inches) 6/8 DocID029486 Rev 1 Ordering information STPS360 3 Ordering information Table 6: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STPS360AF 360F SOD128Flat 26.4 mg 3000 Tape and reel Revision history Table 7: Document revision history Date Revision 01-Jul-2016 1 Changes Initial release. DocID029486 Rev 1 7/8 STPS360 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2016 STMicroelectronics – All rights reserved 8/8 DocID029486 Rev 1