STPS3H100UFN

STPS3H100 Datasheet 3 A - 100 V power Schottky rectifier Features • • • • • • Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche capability specified ECOPACK2 compliant Applications • • • • Switching diode SMPS DC/DC converter LED lighting Description This 100 V power Schottky rectifier is ideal for switch mode power supplies, for 12 V rails and high frequency converters. Packaged in SMB and SMB Flat, the STPS3H100 is optimized for use in consumer and computer applications where low drop forward voltage is required to reduce power dissipation. Product status link STPS3H100 Product summary IF(AV) 3A VRRM 100 V Tj (max.) 175 °C VF (typ.) 0.63 V DS6597 - Rev 3 - January 2020 For further information contact your local STMicroelectronics sales office. www.st.com STPS3H100 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter VRRM Repetitive peak reverse voltage IF(AV) Average forward current, δ = 0.5 square wave IFSM Surge non repetitive forward current PARM Repetitive peak avalanche power Tstg SMB Tl = 115 °C SMB Flat Tl = 140 °C Unit 100 V 3 A 75 A 172 W -65 to +175 °C 175 °C tp = 10 ms sinusoidal tp = 10 µs, Tj = 125 °C Storage temperature range Tj Value Maximum operating junction temperature(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Rth(j-l) Parameter Junction to lead Max. value SMB 25 SMB Flat 15 Unit °C/W For more information, please refer to the following application note: • AN5088: Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol IR(1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 3 A IF = 6 A Min. Typ. - 0.40 - Unit 1.00 µA 1.00 mA 0.84 0.63 - Max. 0.68 0.92 0.71 V 0.76 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.6 x IF(AV) + 0.027 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS6597 - Rev 3 page 2/11 STPS3H100 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current 2.6 2.4 PF(AV) (W) Figure 2. Average forward current versus ambient temperature (δ = 0.5) 3.5 δ =0.05 δ = 0.1 δ = 0.2 δ = 0.5 IF(AV) (A) δ= 1 Rth(j-a)=Rth(j-l) 3.0 2.2 2.0 1.8 SMB flat SMB flat 2.5 1.6 1.4 1.2 1.0 2.0 SMB SMB 1.5 0.8 0.6 0.4 1.0 T IF(AV)(A) 0.2 0.0 0.0 0.5 1.0 1.5 δ =tp/T 2.0 2.5 3.0 tp δ =tp/T tp 3.5 Figure 3. Normalized avalanche power derating versus pulse duration (Tj = 125 °C) 1 T 0.5 PARM (t p ) PARM (10 µs) Tamb (°C) 0.0 0 25 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to ambient versus pulse duration (SMB) 1.0 0.9 Zth(j-a )/Rt h(j-a ) SMB 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 0.1 t p(µs) 0.001 t p (s) 0.0 1 DS6597 - Rev 3 Single pulse 10 100 1000 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 page 3/11 STPS3H100 Characteristics (curves) Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (SMB Flat) Zth(j-l)/ Rth(j-l) 1.0 Figure 6. Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 IR(µA) SMB flat 0.9 1.E+03 0.8 Tj =150 °C Tj =125 °C 0.7 1.E+02 0.6 Tj =100 °C 0.5 1.E+01 Tj =75 °C 0.4 Tj =50 °C 1.E+00 0.3 Tj =25 °C 0.2 1.E-01 0.1 Single pulse t p (s) 0.0 VR(V) 1.E-02 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 7. Junction capacitance versus reverse voltage applied (typical values) 100 0 20 40 60 80 100 Figure 8. Forward voltage drop versus forward current I (A) 6.0 F C(pF) 5.5 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C 5.0 Tjj=125 °C (Maximum values) 4.5 4.0 3.5 Tjj=125 °C (Typical values) 3.0 Tj =25 °C (Maximum values) 2.5 2.0 1.5 1.0 VF(V) 0.5 VR(V) 0.0 0.0 10 1 10 Figure 9. Thermal resistance junction to ambient versus copper surface under each lead (SMB) 200 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 100 Rth(j-a) (°C/W) Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (SMB flat) 200 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm Rth(j-a)(°C/W) SMB flat Epoxy printed board FR4, copper thickness: 35 μm SMB 150 150 100 100 50 50 S(Cu)(cm²) SCu (cm²) 0 0 0.0 0.5 DS6597 - Rev 3 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 page 4/11 STPS3H100 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SMB package information • • Epoxy meets UL94, V0 Lead-free package Figure 11. SMB package outline E1 D E A1 C A2 L DS6597 - Rev 3 b page 5/11 STPS3H100 SMB package information Table 4. SMB package mechanical data Dimensions Ref. Millimeters Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 1.95 2.20 0.0768 0.0867 c 0.15 0.40 0.0059 0.0157 D 3.30 3.95 0.1299 0.1556 E 5.10 5.60 0.2008 0.2205 E1 4.05 4.60 0.1594 0.1811 L 0.75 1.50 0.0295 0.0591 Figure 12. SMB recommended footprint 1.62 2.60 1.62 (0.064) (0.102) (0.064) 2.18 (0.086) 5.84 (0.230) DS6597 - Rev 3 page 6/11 STPS3H100 SMB Flat package information 2.2 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 13. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 5. SMB Flat mechanical data Dimensions Ref. Millimeters Min. DS6597 - Rev 3 Typ. Inches (for reference only) Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 L1 0.40 0.016 L2 0.60 0.024 page 7/11 STPS3H100 SMB Flat package information Figure 14. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS6597 - Rev 3 page 8/11 STPS3H100 Ordering Information 3 Ordering information Table 6. Ordering information DS6597 - Rev 3 Order code Marking Package Weight Base qty. Delivery mode STPS3H100U G31 SMB 0.107 g 2500 Tape and reel STPS3H100UF FG31 SMB Flat 0.050 g 5000 Tape and reel page 9/11 STPS3H100 Revision history Table 7. Document revision history Date Version 15-Jan-2010 1 Changes First issue. Updated cover page. 27-Sept-2018 2 Updated Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified). Removed figure 3, figure 4, figure 5 and figure 6. Minor text changes to improve readability. 14-Janv-2020 DS6597 - Rev 3 3 Updated Figure 3. Minor text changes to improve readability. page 10/11 STPS3H100 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2020 STMicroelectronics – All rights reserved DS6597 - Rev 3 page 11/11