STPS3L40_07

STPS3L40 Power Schottky rectifier Main product characteristics A IF(AV) VRRM Tj (max) VF(max) 3A 40 V 150° C 0.44 V K SMC STPS3L40S Features and Benefits ■ ■ ■ ■ A Negligible switching losses Low thermal resistance Low forward voltage drop Avalanche capability specified K SMB flat STPS3L40UF Description Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. Packaged in SMC, and low profile SMB, this device is intended for use in DC/DC chargers. Table 1. Symbol VRRM IF(AV) IFSM PARM Tstg Tj 1. d Ptot --------------dTj Order codes Part Number STPS3L40S STPS3L40UF Marking S3L4 FS3L4 Absolute Ratings (limiting values) Parameter Repetitive peak reverse voltage SMC Average forward current SMB flat Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature (1) TL = 120° C δ = 0.5 TL = 130° C δ = 0.5 tp = 10 ms sinusoidal tp = 1 µs Tj = 25° C Value 40 3 75 1300 -65 to + 175 150 Unit V A A W °C °C < 1 ------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink February 2007 Rev 3 1/8 www.st.com 8 Characteristics STPS3L40 1 Characteristics Table 2. Symbol Rth(j-l) Junction to lead SMB flat 10 Thermal resistance Parameter SMC Value 18 °C/W Unit Table 3. Symbol IR(1) Static electrical characteristics Parameter Reverse leakage current Test Conditions Tj = 25° C Tj = 125° C Tj = 25° C VR = VRRM Typ. Max. 100 16 40 0.5 IF = 3 A 0.40 0.44 V 0.62 IF = 6 A 0.52 0.58 Unit µA mA VF(1) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.30 x IF(AV) + 0.047 IF2(RMS) Figure 1. PF(AV)(W) 2.0 3.5 Average forward power dissipation Figure 2. versus average forward current IF(AV)(A) δ = 0.1 δ = 0.2 δ = 0.5 3.0 Average forward current versus ambient temperature (δ = 0.5) - SMC Rth(j-a)=Rth(j-l) SMC 1.6 δ = 0.05 δ=1 2.5 Rth(j-a)=75°C/W 1.2 2.0 1.5 1.0 0.8 0.4 T 0.5 T IF(AV)(A) 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 δ=tp/T 3.5 tp 0.0 4.0 0 δ=tp/T 25 tp 50 Tamb(°C) 75 100 125 150 2/8 STPS3L40 Characteristics Figure 3. Average forward current versus ambient temperature (δ = 0.5) SMB flat Rth(j-a)=Rth(j-l) Figure 4. Non repetitive surge peak forward current versus overload duration (maximum values) SMC SMC IF(AV)(A) 3.5 3.0 2.5 Rth(j-a)=75°C/W SMB flat IM(A) 14 12 10 Ta=25°C 2.0 1.5 1.0 8 6 4 Ta=75°C T IM Ta=125°C 0.5 0.0 0 2 δ=tp/T 25 tp 50 Tamb(°C) 0 75 100 125 150 1.E-03 t δ=0.5 t(s) 1.E-02 1.E-01 1.E+00 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat SMB flat (non exposed pad) Figure 6. Normalized avalanche power derating versus pulse duration IM(A) 45 40 35 30 PARM(tp) PARM(1µs) 1 0.1 25 20 15 10 5 0 1.E-03 1.E-02 1.E-01 1.E+00 TL=125°C IM t TL=25°C TL=75°C 0.01 δ=0.5 t(s) 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Figure 7. Normalized avalanche power derating versus junction temperature Figure 8. Relative variation of thermal impedance junction to ambient versus pulse duration - SMC PARM(tp) PARM(25°C) 1.2 1 Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 SMC 0.8 0.6 0.4 0.2 0.6 0.5 0.4 0.3 0.2 T Single pulse Tj(°C) 0 25 50 75 100 125 150 0.1 0.0 1.E-02 1.E-01 1.E+00 tp(s) 1.E+01 δ=tp/T 1.E+02 tp 1.E+03 3/8 Characteristics STPS3L40 Figure 9. Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat Figure 10. Reverse leakage current versus reverse voltage applied (typical values) IR(mA) 1.E+02 Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 1.E-01 1.E+00 SMB flat 1.E+01 Tj=125°C Tj=100°C Tj=25°C 0.2 Single pulse 1.E-02 0.1 0.0 1.E-04 1.E-03 1.E-02 tp(s) 1.E-03 1.E-01 1.E+00 1.E+01 0 5 10 15 VR(V) 20 25 30 35 40 Figure 11. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz VOSC=30mVRMS Tj=25°C Figure 12. Forward voltage drop versus forward current IFM(A) 100 10 Tj=125°C (maximum values) Tj=125°C (typical values) 100 1 Tj=25°C (maximum values) 0 VR(V) 10 1 10 100 0 0.0 0.1 0.2 0.3 0.4 VFM(V) 0.5 0.6 0.7 0.8 0.9 1.0 Figure 13. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35µm) Rth(j-a)(°C/W) 110 100 90 SMC 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMB flat SCU(cm²) FIG 15A - WITHOUT EXPOSED PAD 4/8 STPS3L40 Package Information 2 Package Information ● Epoxy meets UL94,V0 SMC package mechanical data Dimensions Ref E1 Table 4. Millimeters Min. Max. 2.45 0.20 3.2 0.41 8.15 7.15 4.70 6.25 1.40 Inches Min. 0.075 0.002 0.114 0.006 0.305 0.260 0.173 0.218 0.030 Max. 0.096 0.008 0.126 0.016 0.321 0.281 0.185 0.246 0.063 A D 1.90 0.05 2.90 0.15 7.75 6.60 4.40 5.55 0.75 A2 b E c E A1 E1 C A2 E2 L b E2 D L Figure 14. SMC footprint (dimensions in mm) 1.54 5.03 1.54 3.15 8.11 5/8 Package Information Table 5. SMB Flat dimensions Dimensions Ref. A c D L L2 E E1 L L1 b STPS3L40 Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029 Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024 A b(1) c (1) 0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60 1.10 2.20 0.40 3.95 5.60 4.60 1.50 D E E1 L L1 L2 1. Applies to plated leads Figure 15. SMB Flat footprint (dimensions in mm) 5.84 2.07 1.20 3.44 1.20 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS3L40 Ordering information 3 Ordering information Ordering type STPS3L40S STPS3L40UF Marking S3L4 FS3L4 Package SMC SMB flat Weight 0.24 g 0.50 g Base qty 2500 5000 Delivery mode Tape and reel Tape and reel 4 Revision history Date Jul-2003 08-Feb-2007 Revision 2A 3 Last update. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Description of Changes 7/8 STPS3L40 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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