STPS3L60
Datasheet
60 V, 3 A low drop Schottky rectifier
Features
•
•
•
•
Negligible switching losses
Low forward voltage drop
Avalanche rated
ECOPACK2 component
Applications
•
•
•
•
Switching diode
SMPS
DC/DC converter
LED lighting
Description
Axial and surface mount power Schottky rectifier suited for switch mode power
supplies and high frequency dc to dc converters.
Packaged in DO-201AD, DO-15, SMB, SMBflat and SMBflat Notch, this device is
intended for use in low voltage, high frequency inverters and small battery chargers
and for applications where there are space constraints, for example telecom battery
charger.
Product status
STPS3L60
Product summary
Symbol
Value
IF(AV)
3A
VRRM
60 V
T j(max.)
150 °C
VF(typ.)
0.53 V
DS2134 - Rev 7 - January 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS3L60
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
60
V
IF(RMS)
Forward rms current
10
A
3
A
SMB Flat Notch, SMB Flat TL = 115 °C
IF(AV)
Average forward current, δ = 0.5, square
wave
SMB, DO-201AD
TL = 105 °C
DO-15
TL = 72 °C
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
100
A
PARM
Repetitive peak avalanche power
tp = 10 µs, Tj = 125 °C
144
W
-65 to +150
°C
+150
°C
Tstg
Tj
Storage temperature range
Maximum operating junction temperature(1)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol
Parameter
Max. value
Junction to leads
Rth(j-l)
Junction to leads, lead length = 10 mm
SMB Flat Notch, SMB Flat
15
SMB
20
DO-201AD
20
DO-15
35
Unit
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
Parameter
Test conditions
Tj = 25 °C
IR(1)
Reverse leakage current
Tj = 100 °C
Forward voltage drop
VR = VRRM
-
Tj = 25 °C
IF = 3 A
Tj = 125 °C
-
Tj = 25 °C
-
Tj = 100 °C
Tj = 125 °C
Typ.
-
Tj = 125 °C
Tj = 100 °C
VF(1)
Min.
IF = 6 A
-
Max.
Unit
150
µA
4
15
14
30
mA
0.62
0.53
0.61
0.51
0.59
0.79
0.62
0.71
0.6
0.69
V
1. Pulse test: tp = 380 µs, δ < 2%
DS2134 - Rev 7
page 2/17
STPS3L60
Characteristics
To evaluate the conduction losses, use the following equation:
P = 0.44 x IF(AV) + 0.05 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
DS2134 - Rev 7
page 3/17
STPS3L60
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
Figure 2. Average forward current versus ambient
temperature (δ = 0.5) (SMB Flat, SMB Flat Notch)
PF(AV)(W)
IF(AV)(A)
2.50
δ = 0.1
δ = 0.05
2.25
δ = 0.2
3.5
δ = 0.5
Rth(j-a)=Rth(j-l)
3.0
2.00
δ=1
1.75
2.5
1.50
2.0
1.25
1.5
1.00
0.75
0.50
0.5
IF(AV)(A)
0.25
δ=tp/T
0.00
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Tamb (°C)
tp
0.0
3.5
4.0
Figure 3. Average forward current versus ambient
temperature (δ = 0.5) (DO-201AD, SMB)
3.5
Rth(j-a)=100°C/W
1.0
T
0
25
50
75
100
125
150
Figure 4. Average forward current versus ambient
temperature (δ = 0.5) (DO-15)
IF(AV)(A)
IF(AV)(A)
3.5
Rth(j-a)= Rth(j-I)
Rth(j-a)=Rth(j-l)
3.0
3.0
2.5
2.5
2.0
2.0
Rth(j-a)=80°C/W
1.5
1.5
1.0
Rth(j-a)=100°C/W
1.0
0.5
0.5
Tamb (°C)
0.0
Tamb (°C)
0.0
0
25
50
75
100
125
150
Figure 5. Normalized avalanche power derating versus
pulse duration (Tj = 125 °C)
0
50
75
100
125
150
Figure 6. Relative variation of thermal impedance junction
to lead versus pulse duration (SMB Flat, SMB Flat Notch)
PARM (t p )
PARM (10 µs)
1
25
1.0
Zth(j-l) /Rth(j-l)
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.01
0.3
0.2
Single pulse
0.1
0.001
t p(µs)
1
DS2134 - Rev 7
10
t p (s)
0.0
100
1000
1.E-03
1.E-02
1.E-01
1.E+00
page 4/17
STPS3L60
Characteristics (curves)
Figure 7. Relative variation of thermal impedance junction Figure 8. Relative variation of thermal impedance junction
to ambient versus pulse duration (SMB)
to ambient versus pulse duration (DO-201AD)
1.0
Zth(j-a) /Rth(j-a)
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
0.2
0.2
Single pulse
0.1
0.1
t p (s)
0.0
Single pulse
t p (s)
0.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 9. Relative variation of thermal impedance junction
to ambient versus pulse duration (DO-15)
1.0
Zth(j-a) / Rth(j-a)
Zth(j-a) /Rth(j-a)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 10. Reverse leakage current versus reverse
voltage applied (typical values)
1.E+02
IR(mA)
0.9
Tj=125°C
1.E+01
0.8
0.7
Tj=100°C
1.E+00
0.6
0.5
1.E-01
0.4
0.3
0.1
Single pulse
VR(V)
t p (s)
1.E-03
0.0
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 11. Junction capacitance versus reverse voltage
applied (typical values)
1000
Tj=25°C
1.E-02
0.2
C(pF)
0
10
15
20
25
30
35
40
45
50
55
60
Figure 12. Forward voltage drop versus forward current
(high level)
30
F=1MHz
Vosc=30mV
Tj=25°C
5
IFM(A)
25
Tj=100°C
(Typical v alues)
20
100
Tj=100°C
(Maximum values)
Tj=25°C
(Maximum values)
15
10
5
VFM(V)
VR(V)
10
1
DS2134 - Rev 7
10
100
0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
page 5/17
STPS3L60
Characteristics (curves)
Figure 13. Forward voltage drop versus forward current
(low level)
Figure 14. Thermal resistance junction to ambient versus
copper surface under each lead (SMB flat, SMB flat
Notch)
IFM(A)
5
Rth(j-a)(°C/W)
200
Tj=100°C
(Typical values)
SMB flat
SMB flat Notch
Epoxy printed board FR4, copper thickness: 35 μm
4
150
3
Tj=100°C
(Maximum values)
100
2
Tj=25°C
(Maximum values)
50
1
VFM(V)
SCu (cm²)
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 15. Thermal resistance junction to ambient versus
copper surface under each lead (SMB)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 16. Thermal resistance versus lead length (DO-15)
Rth (°C/W)
Rth(j-a) (°C/W)
120
200
Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm
Rth(j-a)
SMB
100
150
80
60
100
Rth(j-I)
40
50
20
S(Cu)(cm²)
L leads (mm)
0
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5
10
15
20
25
Figure 17. Thermal resistance versus lead length
Rt h (°C/W)
90
DO-201AD
R
80
th(j - a)
70
60
50
40
Rth(j-l)
30
20
10
0
5
DS2134 - Rev 7
L leads (mm)
10
15
20
25
page 6/17
STPS3L60
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMB Flat Notch package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 18. SMB Flat Notch package outline
A
DS2134 - Rev 7
V
c
L3
L2
G1
b
D
V1
G
E
E1
L1
L
A1
page 7/17
STPS3L60
SMB Flat Notch package information
Table 4. SMB Flat Notch mechanical data
Dimensions
Ref.
Millimeters
Min.
A
Typ.
0.90
A1
Inches
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.043
0.002
b
1.95
2.20
0.077
0.087
c
0.15
0.40
0.006
0.016
D
3.30
3.95
0.130
0.156
E
5.20
5.60
0.205
0.220
E1
4.05
4.60
0.159
0.181
G
2.00
0.079
G1
1.20
0.047
L
0.75
1.20
0.030
0.047
L1
0.30
0.012
L2
0.60
0.024
L3
0.02
0.001
V
8°
8°
V1
8°
8°
Figure 19. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS2134 - Rev 7
page 8/17
STPS3L60
SMB package information
2.2
SMB package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 20. SMB package outline
E1
D
E
A1
C
A2
L
b
Table 5. SMB package mechanical data
Dimensions
Millimeters
Ref.
DS2134 - Rev 7
Inches (for reference only)
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.074
0.097
A2
0.05
0.20
0.001
0.008
b
1.95
2.20
0.076
0.087
c
0.15
0.40
0.005
0.016
D
3.30
3.95
0.129
0.156
E
5.10
5.60
0.200
0.221
E1
4.05
4.60
0.159
0.182
L
0.75
1.50
0.029
0.060
page 9/17
STPS3L60
SMB package information
Figure 21. SMB recommended footprint
1.62
2.60
1.62
(0.064)
(0.102)
(0.064)
2.18
(0.086)
5.84
(0.230)
DS2134 - Rev 7
page 10/17
STPS3L60
SMB Flat package information
2.3
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 22. SMB Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L2 2 x
b
Table 6. SMB Flat mechanical data
Dimensions
Ref.
Millimeters
Min.
DS2134 - Rev 7
Typ.
Inches
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.044
b
1.95
2.20
0.076
0.087
c
0.15
0.40
0.005
0.016
D
3.30
3.95
0.129
0.156
E
5.10
5.60
0.200
0.221
E1
4.05
4.60
0.159
0.182
L
0.75
1.50
0.029
0.060
L1
0.40
0.016
L2
0.60
0.024
page 11/17
STPS3L60
SMB Flat package information
Figure 23. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS2134 - Rev 7
page 12/17
STPS3L60
DO-201AD package information
2.4
DO-201AD package information
•
Epoxy meets UL 94, V0
Figure 24. DO-201AD package outline
B
A
E
Note 1
B
E
Note 1
ØD
Note 2
ØC
Table 7. DO-201AD package mechanical data
Dimensions
Millimeters
Ref.
Min.
A
B
25.40
Inches (for reference only)
Typ.
Max.
-
9.50
-
Min.
1.000
Typ.
Max.
-
0.374
-
C
-
5.30
-
0.209
D(1)
-
1.30
-
0.051
E
-
1.25
Note
2(2)
15.00
0.049
0.590
1. The lead diameter D is not controlled over zone E
2. The minimum length, which must stay straight between the right angles after bending, is 15 mm (0.59”)
DS2134 - Rev 7
page 13/17
STPS3L60
DO-15 package information
2.5
DO-15 package information
•
Epoxy meets UL 94, V0
Figure 25. DO-15 package outline
C
C
A
ØD
ØB
Table 8. DO-15 package mechanical data
Dimensions
Ref.
DS2134 - Rev 7
Millimeters
Inches (for reference only)
Min.
Typ.
Max.
Min.
Typ.
Max.
A
6.05
-
6.75
0.238
-
0.266
B
2.95
-
3.53
0.116
-
0.139
C
26.00
-
31.00
1.024
-
1.220
D
0.71
-
0.88
0.028
-
0.0035
page 14/17
STPS3L60
Ordering Information
3
Ordering information
Table 9. Ordering information
DS2134 - Rev 7
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS3L60UFN
B36
SMB Flat Notch
0.056 g
5000
Tape and reel
STPS3L60U
G36
SMB
0.107 g
2500
Tape and reel
STPS3L60UF
FG36
SMB Flat
0.050 g
5000
Tape and reel
STPS3L60RL
STPS3L60
DO-201AD
1.12 g
1900
Tape and reel
STPS3L60Q
STPS3L60
DO-15
1000
Ammopack
STPS3L60QRL
STPS3L60
DO-15
6000
Tape and reel
0.04 g
page 15/17
STPS3L60
Revision history
Table 10. Document revision history
DS2134 - Rev 7
Date
Version
Changes
July-2003
5A
12-Jun-2009
6
Reformatted to current standards. Added SMBflat package. Added ECOPACK statement. Added
cathode band graphics.
31-Jan-2020
7
Added Section 2.1 SMB Flat Notch package information.
Previous issue.
page 16/17
STPS3L60
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DS2134 - Rev 7
page 17/17