STPS3L60SY

STPS3L60-Y Automotive power Schottky rectifier Features ■ Negligible switching losses ■ Low thermal resistance ■ Avalanche capability specified ■ AEC Q101 qualified ■ ECOPACK®2 compliant component Description Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. STPS3L60SY SMC (JEDEC DO-214AB) Packaged in SMC this device is intended for use in DC/DC chargers for automotive applications. Table 1. September 2011 Doc ID 17537 Rev 1 Device summary IF(AV) 3A VRRM 60 V Tj (max) 150 °C VF (max) 0.65 V 1/7 www.st.com 7 Characteristics 1 STPS3L60-Y Characteristics Table 2. Absolute ratings (limiting values) Symbol Unit Repetitive peak reverse voltage 60 V IF(RMS) Forward rms current 10 A IF(AV) Average forward current TC = 100 °C δ = 0.5 3 A IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A IRRM Repetitive peak reverse current tp = 2 µs square F=1 kHz 1 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25 °C 1600 W Storage temperature range -65 to +175 °C Operating junction temperature range(1) -40 to +150 °C 10000 V/µs Tj dV/dt dPtot --------------dTj Critical rate of rise reverse voltage < 1 -------------------------Rth ( j – a ) Table 3. condition to avoid thermal runaway for a diode on its own heatsink Thermal resistances Symbol Rth (j-l) Table 4. Parameter Unit 20 ° C/W Static electrical characteristics Symbol Parameter IR (1) Reverse leakage current VF (1) Value Junction to leads Tests conditions Tj = 25 °C VR = VRRM Tj = 125 °C Forward voltage drop Tj = 25 °C IF = 3 A Tj = 125 °C IF = 3 A Tj = 25 °C IF = 6 A Tj = 125 °C IF = 6 A 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.54 x IF(AV) + 0.037x IF2(RMS) 2/7 Value VRRM Tstg 1. Parameter Doc ID 17537 Rev 1 Min. Typ. 10 Max. Unit 55 µA 15 mA 0.7 0.56 0.65 V 0.94 0.67 0.76 STPS3L60-Y Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current IF(av)(A) PF(av)(W) 2.5 δ = 0.1 δ = 0.2 3.5 δ = 0.5 δ = 0.05 2.0 Average forward current versus ambient temperature (δ = 0.5) Rth(j-a)=Rth(j-l) 3.0 δ=1 2.5 1.5 2.0 1.0 1.5 T 1.0 0.5 δ=tp/T IF(av) (A) 0.0 0.0 0.5 Figure 3. 1.0 1.5 2.0 2.5 3.0 Rth(j-a)=75°C/W 0.5 tp 3.5 T 4.0 Normalized avalanche power derating versus pulse duration 0.0 δ=tp/T 0 Figure 4. Tamb(°C) tp 25 50 75 100 125 150 Normalized avalanche power derating versus junction temperature PARM(Tj) PARM(25 °C) PARM(tp) PARM(1 µs) 1.2 1 1 0.8 0.1 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 Figure 5. 1 0 10 100 1000 Non repetitive surge peak forward current versus overload duration (maximum values) IM(A) 14 12 10 8 Tc=25°C 6 Tc=50°C 4 IM 2 0 1E-3 Tc=100°C t t(s) δ=0.5 1E-2 1E-1 1E+0 25 Figure 6. 50 100 125 150 Relative variation of thermal impedance junction to lead versus pulse duration Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 δ = 0.5 0.6 0.5 0.4 δ = 0.2 0.3 δ = 0.1 0.2 Single pulse 0.1 0.0 1E-3 Doc ID 17537 Rev 1 75 T δ=tp/T tp(s) 1E-2 1E-1 tp 1E+0 3/7 Characteristics Figure 7. 5E+1 STPS3L60-Y Reverse leakage current versus reverse voltage applied (typical values) Figure 8. C(pF) IR(mA) 500 Tc=150°C 1E+1 Junction capacitance versus reverse voltage applied (typical values) F=1MHz Tj=25°C Tc=125°C 200 Tc=100°C 1E+0 100 Tc=75°C 1E-1 1E-2 1E-3 50 Tc=50°C Tc=25°C 20 VR(V) 0 5 Figure 9. VR(V) 10 15 20 25 30 35 40 45 50 55 60 Forward voltage drop versus forward current (low level, maximum values) 10 1 10 100 Figure 10. Forward voltage drop versus forward current (high level, maximum values) IFM(A) 5.0 Tj=150°C 4.5 (typical values) 4.0 Tj=25°C 3.5 3.0 Tj=125°C 2.5 2.0 1.5 1.0 0.5 VFM(V) 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 20 IFM(A) Tj=150°C (typical values) 10 Tj=25°C Tj=125°C 5 2 1 0.2 VFM(V) 0.4 0.6 0.8 1.0 1.2 1.4 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead 100 Rth(j-a) (°C/W) Epoxy printed circuit board FR4, copper thickness = 35 µm 80 60 40 20 S(Cu) (cm²) 0 4/7 0 1 2 3 Doc ID 17537 Rev 1 4 5 1.6 STPS3L60-Y 2 Package information Package information ● Epoxy meets UL94,V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMC Dimensions Dimensions Ref. E1 D Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b(1) 2.90 3.20 0.114 0.126 (1) 0.15 0.40 0.006 0.016 D 5.55 6.25 0.218 0.246 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 L 0.75 1.50 0.030 0.059 A1 C A2 E2 L b Inches Min. c E Millimeters 1. Dimensions b and c apply to plated leads Figure 12. Footprint, dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.322) Doc ID 17537 Rev 1 5/7 Ordering information 3 Ordering information Table 6. 4 Ordering information Order code Marking Package Weight Base qty Delivery mode STPS3L60SY S36Y SMC 0.24 g 2500 Tape and reel Revision history Table 7. 6/7 STPS3L60-Y Document revision history Date Revision 15-Sep-2011 1 Changes Initial release. Doc ID 17537 Rev 1 STPS3L60-Y Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com Doc ID 17537 Rev 1 7/7