STPS40150CT

STPS40150C Datasheet 150 V power Schottky rectifier Features A1 K A2 A1 K A2 TO-220AB A2 A1 TO-247 K • • • • • • High junction temperature capability Low leakage current High voltage capabilities Good trade off between leakage current and forward voltage drop Low thermal resistance High frequency operation • ECOPACK®2 compliant for TO-220AB and TO-247, on demand for D²PAK K Applications D²PAK A2 A1 • • • • Switching diode SMPS DC/DC converter Telecom power Description This dual center tab Schottky rectifier is suited for high frequency switched mode power supplies. Packaged in TO-247, TO-220AB and D2PAK, this STPS40150C is optimized for use to enhance the reliability of the application. Product status STPS40150C Product summary IF(AV) 2 x 20 A VRRM 150 V Tj(max.) 175 °C VF(typ.) 0.69 V DS3262 - Rev 2 - June 2018 For further information contact your local STMicroelectronics sales office. www.st.com STPS40150C Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values, per diode at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 150 V IF(RMS) Forward rms current 60 A TC = 150 °C Per diode 20 TC = 145 °C Per device 40 IF(AV) Average forward current, δ = 0.5, square wave IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 250 A PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 1015 W -65 to +175 °C +175 °C Tstg Storage temperature range Tj Maximum operating junction temperature(1) A 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameters Symbol Value Parameter Rth(j-c) Junction to case Rth(c) Coupling Unit Max. Per diode 1.20 Total 0.85 °C/W 0.50 °C/W When the diodes 1 and 2 are used simultaneously: ΔTj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) Table 3. Static electrical characteristics (per diode) Symbol IR (1) Parameter Reverse leakage current Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C VF (2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 20 A IF = 40 A Min. Typ. Max. Unit - 2 8 µA - 2 11 mA - 0.92 0.69 - 0.75 1.00 0.79 V 0.86 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp =380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.64 x IF(AV) + 0.0055 x IF 2 (RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS3262 - Rev 2 page 2/15 STPS40150C Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current (per diode) 22 PF(AV)(W) δ=0.05 20 δ=0.2 δ=0.1 Figure 2. Average forward current versus ambient temperature (δ = 0.5, per diode) 22 δ=0.5 IF(AV) (A) 20 18 18 δ=1.0 16 16 14 14 12 12 10 10 8 8 6 6 T 4 4 2 δ=tp/T 0 0 2 4 6 8 10 12 14 16 IF(AV) (A) tp 18 20 22 24 26 2 28 Figure 3. Normalized avalanche power derating versus pulse duration (Tj= 125 °C) PARM (t p ) PARM (10 µs) 1 0 0 25 50 75 100 125 150 175 Figure 4. Relative variation of thermal impedance junction to case versus pulse duration Z th(j-c) / R th(j-c) 1.0 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.3 0.01 0.2 Single pulse 0.1 t p(µs) 0.001 1 10 100 0.0 1.E-03 1000 Figure 5. Reverse leakage current versus reverse voltage applied (typical values, per diode) 1.E+05 I R (µA) t p(s) 1.E-02 1.E-01 1.E+00 Figure 6. Junction capacitance versus reverse voltage applied (typical values, per diode) C(pF) 1000 F = 1 MHz 1.E+04 VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+03 Tj = 125 °C Tj = 100 °C 1.E+02 100 Tj = 75 °C 1.E+01 Tj = 50 °C 1.E+00 Tj = 25 °C VR(V) 1.E-01 10 30 50 70 VR(V) 90 110 130 150 10 1 DS3262 - Rev 2 10 100 1000 page 3/15 STPS40150C Characteristics (curves) Figure 7. Forward voltage drop versus forward current (per diode) IF (A) Figure 8. Thermal resistance junction to ambient versus copper surface under tab 80 100.0 Rth(j-a) (°C/W) D²PAK 70 Tj = 125 °C (maximum values) Epoxy printed board FR4, copper thickness = 35 µm 60 10.0 Tj = 125 °C (typical values) 50 40 Tj = 25 °C (maximum values) 1.0 30 20 10 VF(V) 0.1 0.0 0.1 DS3262 - Rev 2 0.2 0.3 0.4 0.5 0.6 SCu (cm²) 0 0.7 0.8 0.9 1.0 1.1 1.2 0 5 10 15 20 25 30 35 40 page 4/15 STPS40150C Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 2.1 D²PAK package information • • DS3262 - Rev 2 Epoxy meets UL94, V0 Cooling method: by conduction (C) page 5/15 STPS40150C D²PAK package information Figure 9. D²PAK package outline Note: DS3262 - Rev 2 This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 6/15 STPS40150C D²PAK package information Table 4. D²PAK package mechanical data Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.36 4.60 0.172 0.181 A1 0.00 0.25 0.000 0.010 b 0.70 0.93 0.028 0.037 b2 1.14 1.70 0.045 0.067 c 0.38 0.69 0.015 0.027 c2 1.19 1.36 0.047 0.053 D 8.60 9.35 0.339 0.368 D1 6.90 8.00 0.272 0.311 D2 1.10 1.50 0.043 0.060 E 10.00 10.55 0.394 0.415 E1 8.10 8.90 0.319 0.346 E2 6.85 7.25 0.266 0.282 e 2.54 typ. 0.100 e1 4.88 5.28 0.190 0.205 H 15.00 15.85 0.591 0.624 J1 2.49 2.90 0.097 0.112 L 1.90 2.79 0.075 0.110 L1 1.27 1.65 0.049 0.065 L2 1.30 1.78 0.050 0.070 R V2 DS3262 - Rev 2 Inches 0.4 typ. 0° 0.015 8° 0° 8° page 7/15 STPS40150C D²PAK package information Figure 10. D²PAK recommended footprint (dimensions in mm) 16.90 12.20 5.08 2.54 1.60 9.75 DS3262 - Rev 2 3.50 page 8/15 STPS40150C TO-247 package information 2.2 TO-247 package information • • • • Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 N·m Maximum torque value: 1.0 N·m Figure 11. TO-247 package outline Heat-sink plane A E ∅P S ∅R D L2 L1 b1 L b2 1 2 3 b c A1 3 2 1 Back view e DS3262 - Rev 2 page 9/15 STPS40150C TO-247 package information Table 5. TO-247 package mechanical data Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e 5.30 5.60 0.209 L 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 L2 5.45 18.50 0.215 0.220 0.728 ØP 3.55 3.65 0.139 0.143 ØR 4.50 5.50 0.177 0.217 S 5.30 5.70 0.209 5.50 0.216 0.224 1. Inches dimensions given for reference only DS3262 - Rev 2 page 10/15 STPS40150C TO-220AB package information 2.3 TO-220AB package information • • • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Recommended torque value: 0.55 N·m Maximum torque value: 0.70 N·m Figure 12. TO-220AB package outline Table 6. TO-220AB package mechanical data Dimensions Ref. DS3262 - Rev 2 Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.240 0.035 b1 1.14 1.55 0.045 0.061 page 11/15 STPS40150C TO-220AB package information Dimensions Ref. Millimeters Min. Max. Min. Max. c 0.48 0.70 0.019 0.028 D 15.25 15.75 0.600 0.620 D1 DS3262 - Rev 2 Inches 1.27 typ. 0.050 typ. E 10.00 10.40 0.394 0.409 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.195 0.203 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.260 J1 2.40 2.72 0.094 0.107 L 13.00 14.00 0.512 0.551 L1 3.50 3.93 0.138 0.155 L20 16.40 typ. 0.646 typ. L30 28.90 typ. 1.138 typ. θP 3.75 3.85 0.148 0.152 Q 2.65 2.95 0.104 0.116 page 12/15 STPS40150C Ordering information 3 Ordering information Table 7. Order code DS3262 - Rev 2 Order code Marking Package Weight Base qty. Delivery mode STPS40150CT STPS40150CT TO-220AB 1.95 g 50 Tube STPS40150CW STPS40150CW TO-247 4.36 g 30 Tube STPS40150CG STPS40150CG D²PAK 1.38 g 50 Tube STPS40150CG-TR STPS40150CG D²PAK 1.38 g 1000 Tape and reel page 13/15 STPS40150C Revision history Table 8. Document revision history DS3262 - Rev 2 Date Revision Changes 07-Sep-2006 1 First issue. 01-Jun-2018 2 Updated PARM value and removed "Normalized avalanche power derating" curves. Removed I2PAK package information. page 14/15 STPS40150C IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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