STPS40L45CG-TR

STPS40L45C Low drop power Schottky rectifier Datasheet - production data Description A1 Dual center tap Schottky barrier rectifier designed for high frequency switched mode power supplies and DC to DC converters. K A2 Packaged in TO-220AB, TO-247 and D2PAK these devices are intended for use in low voltage, K high frequency inverters, free-wheeling and polarity protection applications. A2 A1 D2PAK STPS40L45CG A1 K TO-220AB STPS40L45CT A2 Table 1. Device summary K A1 IF(AV) 2 x 20 A VRRM 45 V Tj (max) 150° C VF(max) 0.49 V A2 TO-247 STPS40L45CW Features  Low forward voltage drop meaning very small conduction losses  Low switching losses allowing high frequency operation  Avalanche capability specified October 2013 This is information on a product in full production. DocID6857 Rev 5 1/11 www.st.com Characteristics 1 STPS40L45C Characteristics Table 2. Absolute Ratings (limiting values, per diode) Symbol Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 30 A 20 40 A 220 A Tc =130° C  = 0.5 Per diode Per device IF(AV) Average forward current IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal IRRM Repetitive peak reverse current tp = 2 µs square F = 1 kHz 2 A IRSM Non repetitive peak reverse current tp = 100 µs square 3 A PARM Repetitive peak avalanche power tp = 1 µs Tj = 25° C 8100 W -65 to + 150 °C 150 °C 10000 V/µs Storage temperature range Tstg Tj Maximum operating junction temperature dV/dt 1. Parameter dPtot --------------dTj (1) Critical rate of rise of reverse voltage 1 - condition to avoid thermal runaway for a diode on its own heatsink  ------------------------Rth  j – a  Table 3. Thermal resistances Symbol Rth (j-c) Rth(c) Parameter Per diode Total Junction to case Coupling Value Unit 1.5 0.8 °C/W 0.1 °C/W When the diodes 1 and 2 are used simultaneously: Tj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode2) x Rth(c). Table 4. Static electrical characteristics (per diode) Symbol IR(1) VF(1.) Parameter Test Conditions Reverse leakage current Tj = 25° C Tj = 125° C Forward voltage drop VR = VRRM Tj = 25° C IF = 20 A Tj = 125° C IF = 20 A Tj = 25° C IF = 40 A Tj = 125° C IF = 40 A 1. Pulse test: tp = 380 µs,  < 2% To evaluate the conduction losses use the following equation: P = 0.28 x IF(AV) + 0.0105 IF2(RMS) 2/11 DocID6857 Rev 5 Min. Typ. 140 Max. Unit 0.6 mA 280 mA 0.53 0.42 0.49 V 0.69 0.6 0.7 STPS40L45C Characteristics Figure 1. Average forward power dissipation versus average forward current (per diode) Figure 2. Average forward current versus ambient temperature ( = 0.5, per diode) IF(av)(A) PF(av)(W) 16 δ = 0.1 14 δ = 0.2 δ = 0.5 δ = 0.05 12 10 δ=1 8 6 T 4 2 0 IF(av) (A) 0 2 4 6 8 δ=tp/T tp 10 12 14 16 18 20 22 24 22 20 18 16 14 12 10 8 6 4 2 0 Rth(j-a)=Rth(j-c) Rth(j-a)=15°C/W T δ=tp/T 0 Tamb(°C) tp 25 50 75 100 125 150 Figure 3. Normalized avalanche power derating Figure 4. Normalized avalanche power derating versus pulse duration versus junction temperature PARM(tp) PARM(1 µs) PARM(Tj) PARM(25 °C) 1 1.2 1 0.1 0.8 0.6 0.4 0.01 0.2 Tj(°C) tp(µs) 0.001 0.01 0.1 1 0 10 100 1000 25 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values, per diode) 75 100 125 150 Figure 6. Relative variation of thermal impedance junction to case versus pulse duration IM(A) 250 225 200 175 150 125 100 75 50 IM 25 0 1E-3 50 Zth(j-c)/Rth(j-c) 1.0 0.8 0.6 δ = 0.5 Tc=25°C 0.4 Tc=75°C δ = 0.2 T δ = 0.1 0.2 t Tc=125°C t(s) δ=0.5 1E-2 1E-1 1E+0 tp(s) Single pulse 0.0 1E-4 DocID6857 Rev 5 1E-3 1E-2 δ=tp/T 1E-1 tp 1E+0 3/11 11 Characteristics STPS40L45C Figure 7. Reverse leakage current versus reverse voltage applied (typical values, per diode) IR(mA) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) C(nF) 10.0 1E+3 F=1MHz Tj=25°C Tj=150°C 1E+2 Tj=125°C 1E+1 1.0 Tj=75°C 1E+0 0.1 VR(V) 1E-2 VR(V) Tj=25°C 1E-1 0 5 10 15 20 25 30 35 40 10 1 45 Figure 9. Forward voltage drop versus forward current (maximum values, per diode) Figure 10. Thermal resistance junction to ambient versus copper surface under tab IFM(A) 80 1000 Rth(j-a) (°C/W) 70 Epoxy printed circuit board FR4, copper thickness: 35 µm 60 100 100 50 Typical values Tj=150°C 40 Tj=125°C 30 10 20 Tj=75°C 10 Tj=25°C VFM(V) 1 0.0 4/11 0.2 0.4 0.6 0.8 0 1.0 1.2 1.4 1.6 S(Cu) (cm²) 0 DocID6857 Rev 5 5 10 15 20 25 30 35 40 STPS40L45C 2 Package Information Package Information  Epoxy meets UL94,V0  Cooling method: by conduction (C)  Recommended torque value: 0.4 to 0.6 N·m (TO-220AB)  Recommended torque value: 0.55, 1.0 N·m maximum (TO-247) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 11. TO-220AB dimension definitions A E ∅P Resin gate 0.5 mm max. protrusion(1) F Q H1 D D1 L30 L20 b1 J1 L1 L b e e1 Resin gate 0.5 mm max. protrusion(1) c (1) Resin gate position accepted in each of the two position shown as well as the symmetrical opposites DocID6857 Rev 5 5/11 11 Package Information STPS40L45C Table 5. TO-220AB dimension values Dimensions Ref. Millimeters Min. Max. Min. Max. A 4.40 4.60 0.17 0.18 b 0.61 0.88 0.024 0.035 b1 1.14 1.70 0.045 0.067 c 0.48 0.70 0.019 0.027 D 15.25 15.75 0.60 0.62 D1 6/11 Inches 1.27 typ. 0.05 typ. E 10 10.40 0.39 0.41 e 2.40 2.70 0.094 0.106 e1 4.95 5.15 0.19 0.20 F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.24 0.26 J1 2.40 2.72 0.094 0.107 L 13 14 0.51 0.55 L1 3.50 3.93 0.137 0.154 L20 16.40 typ. 0.64 typ. L30 28.90 typ. 1.13 typ. P 3.75 3.85 0.147 0.151 Q 2.65 2.95 0.104 0.116 DocID6857 Rev 5 STPS40L45C Package Information Figure 12. D2PAK dimension definitions A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Table 6. D2PAK dimension values Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.30 1.75 0.051 0.069 M 2.29 2.79 0.090 0.110 R V2 0.40 typ. 0° 0.016 typ. 8° DocID6857 Rev 5 0° 8° 7/11 11 Package Information STPS40L45C Figure 13. D2PAK footprint (dimensions in mm) 16.90 12.2 5.08 2.54 1.60 3.50 9.75 Figure 14. TO-247 dimension definitions Heat-sink plane A E ∅P S ∅R D L2 L1 b1 L b2 1 2 3 b c A1 e 8/11 DocID6857 Rev 5 3 2 1 BACK VIEW STPS40L45C Package Information Table 7. TO-247 dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ Max. A 4.85 5.15 0.191 0.203 A1 2.20 2.60 0.086 0.102 b 1.00 1.40 0.039 0.055 b1 2.00 2.40 0.078 0.094 b2 3.00 3.40 0.118 0.133 c 0.40 0.80 0.015 0.031 D(1) 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e 5.30 5.60 0.209 L 14.20 14.80 0.559 0.582 L1 3.70 4.30 0.145 0.169 L2 P (2) 5.45 18.50 typ. 0.215 0.220 0.728 typ. 3.55 3.65 0.139 0.143 R 4.50 5.50 0.177 0.217 S 5.30 5.70 0.209 5.50 0.216 0.224 1. Dimension D plus gate protrusion does not exceed 20.5 mm 2. Resin thickness around the mounting hole is not less than 0.9 mm DocID6857 Rev 5 9/11 11 Ordering Information 3 STPS40L45C Ordering Information Table 8. Ordering information 4 Order code Marking Package Weight Base qty Delivery mode STPS40L45CG STPS40L45CG D2PAK 1.8g 500 Tape and reel STPS40L45CT STPS40L45CT TO-220AB 2g 50 Tube STPS40L45CW STPS40L45CW TO-247 4.4g 30 Tube Revision history Table 9. Document revision history 10/11 Date Revision Jul-2003 4A 30-Oct-2013 5 Description of Changes Previous version Updated Package information section DocID6857 Rev 5 STPS40L45C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. 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