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STPS41L60C

STPS41L60C

  • 厂商:

    STMICROELECTRONICS(意法半导体)

  • 封装:

  • 描述:

    STPS41L60C - Power Schottky rectifier - STMicroelectronics

  • 数据手册
  • 价格&库存
STPS41L60C 数据手册
STPS41L60C Power Schottky rectifier Main product characteristics IF(AV) VRRM Tj (max) VF (max) 2 x 20 A 60 V 150° C 0.58 V K A1 K A2 K Features and benefits ■ ■ ■ ■ Low forward voltage drop Negligible switching losses Low thermal resistance Avalanche capability specified I2PAK STPS41L60CR A1 K A2 A1 K A2 TO-220AB STPS41L60CT Description Dual center tap Schottky rectifiers suited for switch mode power supplies and high frequency DC to DC converters. Packaged in D2PAK, I2PAK and TO-220AB, this device is intended for use in low voltage, high frequency inverters, free-wheeling and polarity protection applications. Table 1. Symbol VRRM IF(RMS) IF(AV) IFSM PARM Tstg Tj 1. dPtot --------------dTj K A2 A1 D2PAK STPS41L60CG Absolute ratings (limiting values, per diode) Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature (1) Value 60 30 Unit V A A A W °C °C TC = 125° C δ = 0.5 Per diode Per device 20 40 220 9500 -65 to + 175 150 tp = 10 ms Sinusoidal tp = 1 µs Tj = 25° C < 1 ------------------------Rth ( j – a ) condition to avoid thermal runaway for a diode on its own heatsink May 2007 Rev 5 1/8 www.st.com 8 Characteristics STPS41L60C 1 Table 2. Symbol Rth (j-c) Rth (c) Characteristics Thermal resistances Parameter Junction to case Coupling Per diode Total Value 1.5 0.8 0.1 Unit ° C/W When the diodes 1 and 2 are used simultaneously : ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) Table 3. Symbol IR (1) Static electrical characteristics (per diode) Parameter Reverse leakage current Tests Conditions Tj = 25° C Tj = 125° C Tj = 25° C IF = 20 A IF = 20 A IF = 40A IF = 40A 0.67 0.50 VR = VRRM Min. Typ. Max. 600 100 175 0.60 0.58 V 0.77 0.71 Unit µA mA VF (1) Forward voltage drop Tj = 125° C Tj = 25° C Tj = 125° C 1. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.42 x IF(AV) + 0.007 x IF2(RMS) Figure 1. PF(av)(W) 16 δ=0.5 δ=1 Conduction losses versus average current Figure 2. IF(av)(A) Average forward current versus ambient temperature (δ = 0.5) Rth(j-a)=Rth(j-c) 22 20 18 16 14 12 14 12 δ=0.1 δ=0.2 10 8 δ=0.05 10 6 4 2 0 0 5 10 15 20 25 T T 8 6 4 Rth(j-a)=50 °C/W δ=tp/T tp IF(av)(A) δ=tp/T tp 2 0 0 25 Tamb(°C) 50 75 100 125 150 2/8 STPS41L60C Characteristics Figure 3. Normalized avalanche power derating versus pulse duration Figure 4. Normalized avalanche power derating versus junction temperature PARM(tp) PARM(1µs) 1 1.2 1 PARM(tp) PARM(25°C) 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 Figure 5. Non repetitive surge peak forward current versus overload duration (maximum values) Figure 6. Relative variation of thermal impedance junction to case versus pulse duration 250 225 200 175 150 125 100 75 50 25 IM(A) 1.0 0.9 0.8 0.7 Tc=25 °C Zth(j-c)/Rth(j-c) Single pulse 0.6 0.5 Tc=75 °C 0.4 0.3 T Tc=125 °C IM t 0.2 δ =0.5 t(s) 1.E-02 1.E-01 1.E+00 0.1 0.0 1.E-03 1.E-02 tp(s) 1.E-01 δ=tp/T tp 0 1.E-03 1.E+00 Figure 7. Reverse leakage current versus reverse voltage applied (typical values) Tj=150°C Figure 8. Junction capacitance versus reverse voltage applied (typical values) F=1 MHz VOSC= 30 mV Tj=25 °C 1.E+03 IR(mA) C(nF) 10.0 1.E+02 Tj=125°C Tj=100°C 1.E+01 Tj=75°C 1.0 1.E+00 Tj=50°C 1.E-01 Tj=25°C VR(V) 1.E-02 0 5 10 15 20 25 30 35 40 45 50 55 60 0.1 1 VR(V) 10 100 3/8 Package information STPS41L60C Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm) (STPS41L60CG only) 80 100 IFM(A) Tj=125 °C (Maximum values) Rth(j-a)(°C/W) 70 60 Tj=125 °C (Typical values) 50 Tj=25 °C (Maximum values) 10 40 30 20 10 VFM(V) 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 0 5 10 15 S(cm²) 20 25 30 35 40 2 Package information ● ● ● ● Epoxy meets UL94,V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Figure 11. Package dimensions I2PAK DIMENSIONS REF. A E L2 c2 Millimeters Min. Max. 4.60 2.69 0.93 1.17 1.17 0.60 1.36 9.35 2.70 10.4 13.6 3.78 1.40 Inches Min. 0.173 0.098 0.028 0.044 0.044 0.018 0.048 0.352 0.094 0.394 0.516 0.137 0.050 Max. 0.181 0.106 0.037 0.046 0.046 0.024 0.054 0.368 0.106 0.409 0.535 0.149 0.055 A A1 b b1 b2 c c2 4.40 2.49 0.70 1.14 1.14 0.45 1.23 8.95 2.40 10.0 13.1 3.48 1.27 D L1 b2 L b1 b e A1 D e E L c L1 L2 4/8 STPS41L60C Figure 12. Package dimensions D2PAK Package information DIMENSIONS REF. Millimeters Min. A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 A A1 A2 D 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 B B2 L L3 A1 B2 B G A2 C C2 C R D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0° 8° 0.016 typ. 0° 8° Figure 13. Footprint 16.90 10.30 1.30 5.08 3.70 8.90 5/8 Package information Figure 14. Package dimensions TO-220AB STPS41L60C DIMENSIONS REF. Millimeters Min. A C H2 Dia L5 C L7 L6 L2 F2 F1 L9 L4 F G1 G M E D A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.044 0.194 0.094 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.066 0.202 0.106 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 1.70 5.15 2.70 10.40 4.40 1.23 2.40 0.49 0.61 1.14 1.14 4.95 2.40 10 D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Diam. 16.4 typ. 13 2.65 15.25 6.20 3.50 14 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 6/8 STPS41L60C Ordering information 3 Ordering information Delivery mode Tube Tape and reel Tube Tube Type STPS41L60CG Marking STPS41L60CG Package D2PAK D2 PAK Weight 1.48 g 1.48 g 2.20 g 1.49 g Base qty 50 1000 50 50 STPS41L60CG-TR STPS41L60CG STPS41L60CT STPS41L60CR STPS41L60CT STPS41L60CR TO-220AB I2PAK 4 Revision history Date July 2003 10-Jan-2007 28-May-2007 Revision 3A 4 5 Previous issue Reformated to current standards. Added ECOPACK statement Removed IRRM and dV/dT from the Absolute ratings table on page 1. Updated reverse leakage current values in Table 3 and Figure 7. Updated figures 1, 2, and 5 to 10. Description of Changes 7/8 STPS41L60C Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 8/8
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