STPS4S200S

STPS4S200 Datasheet 4 A - 200 V power Schottky rectifier Features • • • • • Negligible switching losses High junction temperature capability Very small conduction losses Low leakage current Tj = -40 °C minimum operating • ECOPACK2 component Applications • • • • • Inverter Lighting Battery charger Telecom power Home appliance Description Single chip Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in SMB Flat Notch, SMB Flat, SMC and DPAK, the STPS4S200 is ideal for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. Product status STPS4S200 Product summary Symbol Value IF(AV) 4A VRRM 200 V T j(max.) 175 °C VF(typ.) 0.64 V DS10646 - Rev 5 - June 2021 For further information contact your local STMicroelectronics sales office. www.st.com STPS4S200 Characteristics 1 Characteristics Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) Forward rms current 10 A 4 A 130 A -65 to +175 °C -40 to +175 °C IF(AV) Average forward current, δ = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Operating junction temperature SMB Flat Notch, SMC, SMB Flat TL = 125 °C DPAK Tc = 160°C tp = 10 ms sinusoidal range(1) 1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 2. Thermal resistance parameter Symbol Parameter Max. value Rth(j-l) Junction to lead (SMB Flat Notch, SMC, SMB Flat) 15 Rth(j-c) Junction to case 3.2 DPAK Unit °C/W For more information, please refer to the following application note : • AN5088 : Rectifiers thermal management, handling and mounting recommendations Table 3. Static electrical characteristics Symbol Parameter IR(1) Reverse leakage current VF(2) Forward voltage drop Test conditions Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C VR = VRRM IF = 4 A Min. Typ. - 0.70 - Max. Unit 5 µA 2.50 mA 0.87 0.64 0.71 V 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses, use the following equation: P = 0.63 x IF(AV) + 0.020 x IF2(RMS) For more information, please refer to the following application notes related to the power losses : • AN604: Calculation of conduction losses in a power rectifier • AN4021: Calculation of reverse losses on a power diode DS10646 - Rev 5 page 2/16 STPS4S200 Characteristics (curves) 1.1 Characteristics (curves) Figure 1. Average forward power dissipation versus average forward current PF(AV) (W) 3.5 δ = 0.05 δ = 0.2 δ = 0.1 10 δ = 0.5 3.0 δ=1 2.5 Figure 2. Average forward current versus ambient temperature (δ = 0.5) I F(AV) (A) 8 DPAK Rth(j-a)=Rth(j-c) 6 2.0 1.5 4 T 1.0 0.5 δ= tp/T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 I tp 3.0 3.5 F(AV) (A) 4.0 4.5 δ=tp/T 0 SMB-Flat & SMC Rth(j-a)=Rth(j-l) T 2 0 tp Tamb(°C) 25 50 75 100 125 150 175 Figure 3. Relative variation of thermal impedance junction Figure 4. Relative variation of thermal impedance junction to case versus pulse duration (DPAK) to lead versus pulse duration (SMB flat, SMB flat Notch) 1.0 Zth(j-c)/Rth(j-c) 1.0 DPAK 0.9 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 Single pulse 0.2 Single pulse 0.2 0.1 0.1 0.0 1.E-05 tP(s) 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (SMC) 0.9 SMB Flat SMB Flat Notch 0.3 0.3 1.0 Zth(j-l)/Rth(j-l) t (s) P 0.0 1.E-04 1.E-03 1.E-02 1.E+00 1.E+01 Figure 6. Reverse leakage current versus reverse voltage applied (typical values) I (µA) Zth(j-l) /R th(j-l) 1.E+04R SMC T = 150 °C j 1.E+03 0.8 T = 125 °C j 0.7 1.E+02 T = 100 °C j 0.6 1.E+01 0.5 0.4 T = 75 °C j T = 50 °C j 1.E+00 0.3 0.2 1.E-01 0.1 0.0 1.E-03 DS10646 - Rev 5 t p (s) 1.E-02 T = 25 °C j 1.E-01 Single pulse 1.E-01 1.E+00 1.E+01 V (V) R 1.E-02 1.E+02 0 20 40 60 80 100 120 140 160 180 200 page 3/16 STPS4S200 Characteristics (curves) Figure 7. Junction capacitance versus reverse voltage applied (typical values) 1000 Figure 8. Forward voltage drop versus forward current (typical values) I (A) 10.00 F C(pF) F = 1 MHz VOSC = 30 mVRMS T = 125 °C j T = 25 °C j 1.00 T = 25 °C j 100 0.10 VR(V) 10 1 10 100 1000 Figure 9. Forward voltage drop versus forward current (maximum values) IF(A) 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 10. Thermal resistance junction to ambient versus copper surface under tab (DPAK) 100 10.00 V (V) F Rth(j-a) (°C/W) DPAK Epoxy printed circuit board, copper thickness: 35 µm 90 80 T = 125 °C j 70 1.00 60 50 40 T = 25 °C j 0.10 30 20 10 V (V) F 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Figure 11. Thermal resistance junction to ambient versus copper surface under each lead (SMB Flat, SMB Flat Notch) 200 Rth(j-a)(°C/W) SCu (cm²) 0 0 10 15 20 25 30 35 40 Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMC) Rth(j-a) (°C/W) 160 Epoxy p ri nted ci rcui t board FR4, coppe r t hi ckness: 35 µm SMB flat SMB flat Notch Epoxy printed board FR4, copper thickness: 35 μm 5 140 SMC 120 150 100 80 100 60 40 50 20 SCu (cm²) SCu (cm²) 0 0 0.0 0.0 0.5 DS10646 - Rev 5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.0 page 4/16 STPS4S200 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS10646 - Rev 5 page 5/16 STPS4S200 SMB Flat Notch package information 2.1 SMB Flat Notch package information • • Epoxy meets UL94, V0 Lead-free package Figure 13. SMB Flat Notch package outline A V G1 b D V1 G E E1 L1 L A1 L3 L2 c Table 4. SMB Flat Notch mechanical data Dimensions Millimeters Ref. Min. A 0.90 A1 Max. Min. 1.10 0.035 0.05 Typ. Max. 0.043 0.002 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.20 5.60 0.205 0.220 E1 4.05 4.60 0.159 0.181 G 2.00 0.079 G1 1.20 0.047 L 0.75 1.20 0.030 0.047 L1 0.30 0.012 L2 0.60 0.024 L3 DS10646 - Rev 5 Typ. Inches 0.02 0.001 V 8° 8° V1 8° 8° page 6/16 STPS4S200 SMB Flat Notch package information Figure 14. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS10646 - Rev 5 page 7/16 STPS4S200 SMB Flat package information 2.2 SMB Flat package information • • Epoxy meets UL94, V0 Lead-free package Figure 15. SMB Flat package outline A c D L 2x L1 2 x E E1 L2 2 x b Table 5. SMB Flat mechanical data Dimensions Millimeters Ref. Min. DS10646 - Rev 5 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.044 b 1.95 2.20 0.076 0.087 c 0.15 0.40 0.005 0.016 D 3.30 3.95 0.129 0.156 E 5.10 5.60 0.200 0.221 E1 4.05 4.60 0.159 0.182 L 0.75 1.50 0.029 0.060 L1 0.40 0.016 L2 0.60 0.024 page 8/16 STPS4S200 SMB Flat package information Figure 16. Footprint recommendations, dimensions in mm (inches) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) 2.07 (0.082) 5.84 (0.230) millimeters (inches) DS10646 - Rev 5 page 9/16 STPS4S200 SMC package information 2.3 SMC package information • Epoxy meets UL94, V0 Figure 17. SMC package outline E1 D E A1 A2 b C L E2 Table 6. SMC package mechanical data Dimensions Millimeters Ref. DS10646 - Rev 5 Inches (for reference only) Min. Max. Min. Max. A1 1.90 2.45 0.0748 0.0965 A2 0.05 0.20 0.0020 0.0079 b 2.90 3.20 0.1142 0.1260 c 0.15 0.40 0.0059 0.0157 D 5.55 6.25 0.2185 0.2461 E 7.75 8.15 0.3051 0.3209 E1 6.60 7.15 0.2598 0.2815 E2 4.40 4.70 0.1732 0.1850 L 0.75 1.50 0.0295 0.0591 page 10/16 STPS4S200 SMC package information Figure 18. SMC recommended footprint 1.54 (0.061) 5.11 (0.201) 1.54 (0.061) 3.14 (0.124) 8.19 (0.323) millimeters (inches) DS10646 - Rev 5 page 11/16 STPS4S200 DPAK package information 2.4 DPAK package information • • Epoxy meets UL 94,V0 Cooling method: by conduction (C) Figure 19. DPAK package outline E A b4 c2 Thermal pad E1 L2 D D1 R H L4 A1 b e e1 R c A2 L1 L 0.25 Note: DS10646 - Rev 5 V2 Gauge plane This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. page 12/16 STPS4S200 DPAK package information Table 7. DPAK package mechanical data Dimensions Millimeters Ref. Inches (for reference only) Min. Max. Min. Max. A 2.18 2.40 0.085 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b4 4.95 5.46 0.194 0.215 c 0.46 0.61 0.018 0.024 c2 0.46 0.60 0.018 0.023 D 5.97 6.22 0.235 0.244 D1 4.95 5.60 0.194 0.220 E 6.35 6.73 0.250 0.265 E1 4.32 5.50 0.170 0.216 e 2.286 typ. 0.090 typ. e1 4.40 4.70 0.173 0.185 H 9.35 10.40 0.368 0.409 L 1.0 1.78 0.039 0.070 L2 1.27 0.050 L4 0.60 1.02 0.023 0.040 V2 -8° +8° -8° +8° Figure 20. DPAK recommended footprint (dimensions in mm) 12.7 6.7 3.0 3.0 4.572 6.7 B The device must be positioned within DS10646 - Rev 5 A 1.6 0.05 A B page 13/16 STPS4S200 Ordering Information 3 Ordering information Table 8. Ordering information DS10646 - Rev 5 Order code Marking Package Weight Base qty. Delivery mode STPS4S200B-TR S4 200B D²PAK 0.032 g 10 000 Tape and reel STPS4S200S S42 SMC 0.250 g 2500 Tape and reel STPS4S200UF FG42 SMB Flat 0.050 g 5000 Tape and reel STPS4S200UFN B42 SMB Flat Notch 0.056 g 5000 Tape and reel page 14/16 STPS4S200 Revision history Table 9. Document revision history DS10646 - Rev 5 Date Version Changes 17-Oct-2014 1 26-Aug-2015 2 15-May-2017 3 Updated DPAK package information and reformatted to current standard. 31-Jan-2019 4 Added Section 2.1 SMB Flat Notch package information. 01-Jun-2021 5 Removed normalized avalanche curve. First release. Added device in SMC package. Updated document accordingly. page 15/16 STPS4S200 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. 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Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2021 STMicroelectronics – All rights reserved DS10646 - Rev 5 page 16/16