STPS5H100AF

STPS5H100AF High voltage power Schottky rectifier Datasheet - production data Description K This high voltage Schottky barrier rectifier device is packaged in SOD128Flat and designed for high frequency miniature switched mode power supplies and for board DC to DC converters. A Table 1: Device summary SOD128Flat Symbol Value IF(AV) 5A VRRM 100 V Tj(max.) 175 °C VF(typ.) 0.51 V Features       Negligible switching losses High junction temperature capability Low leakage current Good trade-off between leakage current and forward voltage drop Avalanche specification ECOPACK® compliant component January 2017 DocID029499 Rev 1 This is information on a product in full production. 1/8 www.st.com Characteristics 1 STPS5H100AF Characteristics Table 2: Absolute ratings (limiting values at 25 °C, unless otherwise specified) Symbol VRRM Parameter Value Unit 100 V 5 A Repetitive peak reverse voltage IF(AV) Average forward current TL = 115 °C, δ = 0.5, square pulse IFSM Surge non repetitive forward current tp = 10 ms sinusoidal 125 tp = 8.3 ms sinusoidal 130 PARM Repetitive peak avalanche power tp = 10 µs, Tj = 125 °C 165 W Tstg Storage temperature range -65 to +175 °C 175 °C Max. value Unit 16 °C/W Maximum operating junction Tj temperature(1) A Notes: (1)(dP tot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink. Table 3: Thermal parameters Symbol Rth(j-l) Parameter Junction to lead Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit - 0.7 3.5 µA - 1 4 Tj = 25 °C IR(1) Reverse leakage current Tj = 125 °C VR = 100 V Tj = 150 °C Tj = 25 °C VF(2) Forward voltage drop Tj = 125 °C Tj = 25 °C Tj = 125 °C IF = 2.5 A IF = 5 A - 16 - 0.67 - 0.51 - mA 0.55 0.76 0.57 0.61 Notes: (1)Pulse test: tp = 5 ms, δ < 2% (2)Pulse test: tp = 380 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.49 x IF(AV) + 0.024 x IF2(RMS) For more information, please refer to the following application notes related to the power losses.   2/8 AN604 (Calculation of conduction losses in a power rectifier) AN4021 (Calculation of reverse losses in a power diode) DocID029499 Rev 1 V STPS5H100AF 1.1 Characteristics Characteristics (curves) Figure 2: Average forward current versus ambient temperature (δ = 0.5) Figure 1: Average forward power dissipation versus average forward current 4 PF(AV) (W) δ = 0.05 δ = 0.2 δ = 0.1 δ = 0.5 12 δ= 1 IF(AV) (A) Rth(j-a) = Rth(j-l) 10 3 8 6 2 4 1 T T 2 IF(AV) (A) δ = tp/T δ = tp/T tp 0 1 2 3 4 5 0 6 Figure 3: Normalized avalanche power derating versus pulse duration 1 Tamb(°C) tp 0 0 PARM (t p ) PARM (10 µs) 25 50 75 100 125 150 175 Figure 4: Relative variation of thermal impedance junction to lead versus pulse duration Zth(j-l)/Rth(j-l) 1.0 0.9 0.8 0.7 0.1 0.6 0.5 0.4 0.01 0.3 0.2 Single pulse t p (µs) 0.1 0.001 1 10 100 Figure 5: Reverse leakage current versus reverse voltage applied (typical values) 1.E+04 tp(s) 0.0 1.E-04 1000 IR(µA) 1.E-03 1.E-02 1.E-01 1.E+01 Figure 6: Junction capacitance versus reverse voltage applied (typical values) 1000 C(pF) F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+03 1.E+00 Tj = 125 °C Tj = 100 °C 1.E+02 Tj = 75 °C 100 1.E+01 Tj = 50 °C 1.E+00 Tj = 25 °C 1.E-01 VR(V) VR(V) 10 1.E-02 0 10 20 30 40 50 60 70 80 90 100 DocID029499 Rev 1 1 10 100 3/8 Characteristics STPS5H100AF Figure 8: Thermal resistance junction to ambient versus copper surface under each lead (typical values, epoxy printed board FR4, eCu = 35 µm) Figure 7: Forward voltage drop versus forward current (typical values) 100.00 IF(A) 200 Rth(j-a)(°C/W) SOD128-Flat 10.00 150 Tj = 75 °C Tj = 125 °C 1.00 Tj = 25 °C 100 0.10 50 VF(V) 0.01 0.0 4/8 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 SCu(cm²) 1.0 0 0.0 DocID029499 Rev 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS5H100AF 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.   2.1 Epoxy meets UL94, V0 Lead-free package SOD128Flat package information Figure 9: SOD128Flat package outline DocID029499 Rev 1 5/8 Package information STPS5H100AF Table 5: SOD128Flat package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A 0.93 1.03 0.037 0.041 b 1.69 1.81 0.067 0.071 c 0.10 0.22 0.004 0.009 D 2.30 2.50 0.091 0.098 E 4.60 4.80 0.181 0.189 E1 3.70 3.90 0.146 0.154 L 0.55 0.85 0.026 0.033 L1 0.30 typ. 0.012 typ. L2 0.45 typ. 0.018 typ. Figure 10: SOD128Flat footprint in mm (inches) 6/8 DocID029499 Rev 1 STPS5H100AF 3 Ordering information Ordering information Table 6: Ordering information 4 Order code Marking Package Weight Base qty. Delivery mode STPS5H100AF 5H100 SOD128Flat 26.4 mg 3000 Tape and reel Revision history Table 7: Document revision history Date Revision 09-Jan-2017 1 Changes Initial release. DocID029499 Rev 1 7/8 STPS5H100AF IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2017 STMicroelectronics – All rights reserved 8/8 DocID029499 Rev 1