STPS5H100B

® STPS5H100 HIGH VOLTAGE POWER SCHOTTKY RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM Tj VF(max) FEATURES AND BENEFITS ■ ■ ■ ■ ■ 5A 100 V 175°C 0.61 V K A NC DPAK Negligible switching losses High junction temperature capability Low leakage current Good trade off between leakage current and forward voltage drop Avalanche specification Table 2: Order Codes Part Number STPS5H100B STPS5H100B-TR Marking S5H100 S5H100 DESCRIPTION High voltage Schottky barrier rectifier designed for high frequency miniature Switched Mode Power Supplies such as adaptators and on board DC to DC converters. Table 3: Absolute Maximum (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt RMS forward voltage Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature Critical rate of rise of reverse voltage Tc = 165°C δ = 0.5 tp = 10ms sinusoidal tp = 2µs F = 1KHz tp = 100µs square tp = 1µs Tj = 25°C Parameter Repetitive peak reverse voltage Value 100 10 5 75 1 2 7200 -65 to + 175 175 10000 Unit V A A A A A W °C °C V/µs 1 dPtot * : --------------- > ------------------------- thermal runaway condition for a diode on its own heatsink Rth ( j – a ) dTj February 2006 REV. 8 1/5 STPS5H100 Table 4: Thermal Parameters Symbol Rth(j-c) Junction to case Parameter Value 2.5 Unit °C/W Table 5: Static Electrical Characteristics Symbol IR * Parameter Reverse leakage current Tests conditions Tj = 25°C Tj = 125°C Tj = 25°C VF ** Forward voltage drop Tj = 125°C Tj = 25°C Tj = 125°C Pulse test: * tp = 5 ms, δ < 2% ** tp = 380 µs, δ < 2% Min. Typ 1.3 0.57 0.66 Max. 3.5 4.5 0.73 0.61 0.85 0.71 Unit µA mA VR = VRRM IF = 5A IF = 10A V To evaluate the conduction losses use the following equation: P = 0.51 x IF(AV) + 0.02 IF (RMS) 2 Figure 1: Average forward power dissipation versus average forward current PF(av)(W) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 IF(av) (A) δ=tp/T tp T Figure 2: Average forward current versus ambient temperature (δ = 0.5) IF(av)(A) δ = 0.1 δ = 0.05 δ = 0.2 6 δ = 0.5 Rth(j-a)=Rth(j-c) 5 δ=1 4 Rth(j-a)=80°C/W 3 2 1 δ=tp/T tp T 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Tamb(°C) 60 80 100 120 140 160 180 0 0 20 40 Figure 3: Normalized avalanche derating versus pulse duration PARM(tp) PARM(1µs) 1 power Figure 4: Normalized avalanche derating versus junction temperature PARM(tp) PARM(25°C) power 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(µs) 10 100 1000 Tj(°C) 0 0 25 50 75 100 125 150 2/5 STPS5H100 Figure 5: Non repetitive surge peak forward current versus overload duration (maximum values) IM(A) 120 110 100 90 80 70 60 50 40 30 IM 20 10 0 1E-3 Figure 6: Relative variation of thermal impedance junction to case versus pulse duration Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=50°C 0.6 0.4 0.2 δ = 0.5 Tc=75°C Tc=125°C t δ = 0.2 δ = 0.1 Single pulse T δ=0.5 t(s) 1E-2 1E-1 1E+0 0.0 1E-3 1E-2 tp(s) 1E-1 δ=tp/T tp 1E+0 Figure 7: Reverse leakage current versus reverse voltage applied IR(µA) 5E+3 1E+3 1E+2 1E+1 1E+0 1E-1 1E-2 0 10 Tj=25°C Tj=125°C Figure 8: Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F=1MHz Tj=25°C 100 VR(V) 20 30 40 50 60 70 80 90 100 VR(V) 10 1 10 100 Figure 9: Forward voltage drop versus forward current (maximum values) Figure 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35µm) Rth(j-a) (°C/W) 100 90 80 70 60 50 40 30 20 10 0 IFM(A) 50.0 Tj=125°C 10.0 Tj=25°C 1.0 0.1 0.0 VFM(V) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 S(Cu) (cm²) 0 2 4 6 8 10 12 14 16 18 20 3/5 STPS5H100 Figure 11: DPAK Package Mechanical Data DIMENSIONS Millimeters Inches Min. Max Min. Max. 2.20 2.40 0.086 0.094 0.90 1.10 0.035 0.043 0.03 0.23 0.001 0.009 0.64 0.90 0.025 0.035 5.20 5.40 0.204 0.212 0.45 0.60 0.017 0.023 0.48 0.60 0.018 0.023 6.00 6.20 0.236 0.244 6.40 6.60 0.251 0.259 4.40 4.60 0.173 0.181 9.35 10.10 0.368 0.397 0.80 typ. 0.031 typ. 0.60 1.00 0.023 0.039 0° 8° 0° 8° REF. E B2 L2 C2 A D H L4 B G A1 C R R A2 0.60 MIN. V2 A A1 A2 B B2 C C2 D E G H L2 L4 V2 Figure 12: Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 4/5 STPS5H100 Table 6: Ordering Information Ordering type STPS5H100B STPS5H100B-TR ■ Marking S5H100 S5H100 Package DPAK Weight 0.30 g Base qty 75 2500 Delivery mode Tube Tape & reel Cooling method: by conduction (C) Date Jul-2003 03-Nov-2005 15-Feb-2006 Revision 6B 7 8 Last issue. DPAK Foot Print dimensions updated. ECOPACK statement added. Description of Changes Table 7: Revision History Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 5/5